公开(公告)号：WO2012037216A3

公开(公告)日：2012-06-07

申请号：PCT/US2011051552

申请日：2011-09-14

Applicant: TESSERA INC ,  OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG ,  SAVALIA PIYUSH

Inventor： OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG ,  SAVALIA PIYUSH

IPC: H01L21/768 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/50 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor assembly 10 can include providing a semiconductor element 20 having a front surface 21, a rear surface 22, and a plurality of conductive pads 50, forming at least one hole 40 extending at least through a respective one of the conductive pads 50 by processing applied to the respective conductive pad 50 from above the front surface 21, forming an opening 30 extending from the rear surface 22 at least partially through a thickness of the semiconductor element 20, such that the at least one hole 30 and the opening 40 meet at a location between the front and rear surfaces, and forming at least one conductive element 60, 80 exposed at the rear surface 22 for electrical connection to an external device, the at least one conductive element extending within the at least one hole 30 and at least into the opening 40, the conductive element being electrically connected with the respective conductive pad 50.

Abstract translation: 制造半导体组件10的方法可以包括提供具有前表面21，后表面22和多个导电焊盘50的半导体元件20，形成至少一个孔40，所述至少一个孔40至少延伸穿过相应的一个导电 通过处理从前表面21上方施加到相应的导电焊盘50的焊盘50形成从后表面22至少部分地延伸穿过半导体元件20的厚度的开口30，使得至少一个孔30和 开口40在前表面和后表面之间的位置汇合，并且形成暴露在后表面22处用于电连接到外部装置的至少一个导电元件60,80，所述至少一个导电元件在至少一个孔 并且至少进入开口40中，导电元件与相应的导电垫50电连接。

公开(公告)号：WO2010105157A3

公开(公告)日：2012-02-23

申请号：PCT/US2010027141

申请日：2010-03-12

Applicant: TESSERA INC ,  HABA BELGACEM ,  MARCUCCI BRIAN

Inventor： HABA BELGACEM ,  MARCUCCI BRIAN

IPC: H01L23/49 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011

Abstract: A microelectronic assembly can include a microelectronic device (310) having device contacts (312) exposed at a surface (328) thereof and an interconnection element having element contacts (340) and having a face adjacent to the microelectronic device. Conductive elements (365), e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer (360) has a conductive surface (375) disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material (360) can have first and second dimensions (326, 336) in first and second horizontal directions which are smaller than first and second corresponding dimensions (324, 334) of the microelectronic device. The conductive material (360) is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

Abstract translation: 微电子组件可以包括具有在其表面（328）处暴露的器件触点（312）的微电子器件（310）和具有元件触点（340）并具有与微电子器件相邻的面的互连元件。 导电元件（365），例如，引线将器件触点与元件触点连接，并且具有在微电子器件的表面上方延伸的部分。 导电层（360）具有导电表面（375），该导电表面设置在多个导电元件的行程之上或之下至少基本均匀的距离处。 在一些情况下，导电材料（360）可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸（324,334）的第一和第二尺寸（326,336）。 导电材料（360）可连接到参考电位源，以便实现导电元件所需的阻抗。

公开(公告)号：WO2009048604A3

公开(公告)日：2009-09-24

申请号：PCT/US2008011632

申请日：2008-10-08

Applicant: TESSERA INC ,  HABA BELGACEM ,  OGANESIAN VAGE ,  ENDO KIMITAKA

Inventor： HABA BELGACEM ,  OGANESIAN VAGE ,  ENDO KIMITAKA

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/24226 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1189 ,  H01L2924/00

Abstract: An interconnect element (130) can include a dielectric layer (116) having a top face (116b) and a bottom face (116a) remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces (132, 134). A plurality of conductive protrusions (112) can extend upwardly from the plane defined by the first metal layer (102) through the dielectric layer (116). The conductive protrusions (112) can have top surfaces (126) at a first height (115) above the first metal layer (132) which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias (128) can extend from the top surfaces (126) of the protrusions (112) to connect the protrusions (112) with the second metal layer.

Abstract translation: 互连元件（130）可以包括具有远离顶面的顶面（116b）和底面（116a）的介电层（116），限定沿着底面延伸的平面的第一金属层以及第二金属 层沿着顶面延伸。 第一或第二金属层之一或两者可以包括多个导电迹线（132,134）。 多个导电突起（112）可以从由第一金属层（102）限定的平面穿过介电层（116）向上延伸。 导电凸起（112）可以具有在第一金属层（132）上方的第一高度（115）处的顶表面（126），其可以大于电介质层的高度的50％。 多个导电通孔（128）可以从突起（112）的顶表面（126）延伸以将突起（112）与第二金属层连接。

公开(公告)号：WO2007076100A3

公开(公告)日：2007-09-07

申请号：PCT/US2006049203

申请日：2006-12-26

Applicant: TESSERA INC ,  HABA BELGACEM ,  TUCKERMAN DAVID B

Inventor： HABA BELGACEM ,  TUCKERMAN DAVID B

IPC: H01L21/58 ,  H01L21/60

CPC classification number: H05K3/4007 ,  H01L2224/16225 ,  H05K3/062 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2203/0384

Abstract: Methods for making a microelectronic component including a plurality of conductive posts (14) extending and projecting away from a flexible substrate (30, 32), wherein at least some of the conductive posts are electrically connected to a plurality of traces (34) exposed on the flexible substrate.

Abstract translation: 用于制造微电子元件的方法，所述微电子元件包括从柔性基板（30,32）延伸并伸出的多个导电柱（14），其中至少一些导电柱电连接到多个暴露于 柔性衬底。

公开(公告)号：WO2006101861A3

公开(公告)日：2006-12-14

申请号：PCT/US2006009197

申请日：2006-03-14

Applicant: TESSERA INC ,  HABA BELGACEM ,  GIBSON DAVID

Inventor： HABA BELGACEM ,  GIBSON DAVID

IPC: H01L23/498 ,  G01R1/04 ,  G01R1/073 ,  H01L23/538

CPC classification number: G01R1/0483 ,  G01R1/0735 ,  G01R1/07378 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/0367 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: An assembly for testing microelectronic devices includes a microelectronic element 22 having faces and contacts, a flexible substrate 32 spaced from and overlying a first face 24 of the microelectronic element, and a plurality of conductive posts 46 extending from the flexible substrate 32 and projecting away from the first face 24 of the microelectronic element 22, at least some of the conductive posts 46 being electrically interconnected with the microelectronic element 22. The assembly also includes a plurality of support elements 30 disposed between the microelectronic element 22 and the flexible substrate 32 for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts 46 are offset from the support elements 30.

Abstract translation: 用于测试微电子器件的组件包括具有面和触点的微电子元件22，与微电子元件的第一面24间隔开并且覆盖微电子元件的第一面24的柔性衬底32以及从柔性衬底32延伸并远离 微电子元件22的第一表面24，至少一些导电柱46与微电子元件22电互连。组件还包括多个支撑元件30，其设置在微电子元件22和柔性基板32之间，用于支撑 微电子元件上的柔性基板。 至少一些导电柱46与支撑元件30偏移。

公开(公告)号：WO2005065207A3

公开(公告)日：2006-05-11

申请号：PCT/US2004042415

申请日：2004-12-16

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

IPC: H01L21/44 ,  H01L21/66 ,  H01L23/58

CPC classification number: H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package includes a microelectronic element (80) having faces and contacts (83) and a flexible substrate (90) spaced from and overlying a first face (84) of the microelectronic element (82). The package (80) also includes a plurality of conductive posts (98) extending from the flexible substrate (90) and projecting away from the first face (84) of the microelectronic element (82), wherein at least some of the conductive posts (98) are electrically interconnected with the microelectronic element (82), and a plurality of support elements (88) supporting the flexible substrate (90) over the microelectronic element (82). The conductive posts (98) are offset from the support elements (82) to facilitate flexure of the substrate (90) and movement of the posts (98) relative to the microelectronic element (82).

Abstract translation: 微电子封装包括具有面和触点（83）的微电子元件（80）和与微电子元件（82）的第一面（84）间隔开并且覆盖其上的柔性基板（90）。 包装（80）还包括从柔性基板（90）延伸并远离微电子元件（82）的第一面（84）突出的多个导电柱（98），其中至少一些导电柱（ 98）与微电子元件（82）电互连，以及支撑微电子元件（82）上的柔性基板（90）的多个支撑元件（88）。 导电柱（98）从支撑元件（82）偏移，以便于衬底（90）的挠曲和柱（98）相对于微电子元件（82）的移动。

公开(公告)号：WO2012074570A3

公开(公告)日：2012-09-27

申请号：PCT/US2011029394

申请日：2011-03-22

Applicant: TESSERA INC ,  OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG ,  SAVALIA PIYUSH

Inventor： OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG ,  SAVALIA PIYUSH

IPC: H01L21/60 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/481 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A microelectronic assembly 100 is provided which includes a first element 110 consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface 103 facing and attached to a major surface 104 of a microelectronic element 102 at which a plurality of conductive pads 106 are exposed, the microelectronic element 102 having active semiconductor devices therein. A first opening 111 extends from an exposed surface 118 of the first element 110 towards the surface 103 attached to the microelectronic element 102, and a second opening 113 extends from the first opening 111 to a first one of the conductive pads 106, wherein where the first and second openings meet, interior surfaces 121, 123 of the first and second openings extend at different angles relative to the major surface 104 of the microelectronic element 102. A conductive element 114 extends within the first and second openings 111, 113 and contacts the at least one conductive pad 106.

Abstract translation: 提供微电子组件100，其包括第一元件110，第一元件110基本上由至少一种半导体或无机介电材料组成，该第一元件110具有面对并连接到微电子元件102的主表面104的表面103，在微电子元件102的主表面104处，多个导电垫106 其中微电子元件102具有有源半导体器件。 第一开口111从第一元件110的暴露表面118朝向附接到微电子元件102的表面103延伸，并且第二开口113从第一开口111延伸到导电垫106中的第一个，其中， 第一和第二开口相遇，第一和第二开口的内表面121,123相对于微电子元件102的主表面104以不同的角度延伸。导电元件114在第一和第二开口111,113内延伸并接触 至少一个导电垫106。

公开(公告)号：WO2010104610A8

公开(公告)日：2011-11-17

申请号：PCT/US2010000777

申请日：2010-03-12

Applicant: TESSERA INC ,  KRIMAN MOSHE ,  AVSIAN OSHER ,  HABA BELGACEM ,  HUMPSTON GILES ,  BURSHTYN DMITRI

Inventor： KRIMAN MOSHE ,  AVSIAN OSHER ,  HABA BELGACEM ,  HUMPSTON GILES ,  BURSHTYN DMITRI

IPC: H01L21/98 ,  H01L21/768 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements (101, 102). Each of the first and second microelectronic elements can include a conductive layer (610) extending along a face (608) of such microelectronic element. At least one of the first and second microelectronic elements can include a recess (618) extending from the rear surface towards the front surface, and a conductive via (605) extending from the recess through the bond pad (603) and electrically connected to the bond pad, with a conductive layer (610) connected to the via and extending along a rear face (608) of the microelectronic element (101, 102) towards an edge (620) of the microelectronic element. A plurality of leads (224) can extend from the conductive layers (610) of the first and second microelectronic elements and a plurality of terminals (616) of the assembly can be electrically connected with the leads.

Abstract translation: 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件（101,102）。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的面（608）延伸的导电层（610）。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹槽（618），以及从凹部穿过接合焊盘（603）延伸并电连接到 接合焊盘，其中导电层（610）连接到通孔并且沿着微电子元件（101,102）的后表面（608）朝着微电子元件的边缘（620）延伸。 多个引线（224）可以从第一和第二微电子元件的导电层（610）延伸，并且组件的多个端子（616）可以与引线电连接。

公开(公告)号：WO2005065238A3

公开(公告)日：2009-03-26

申请号：PCT/US2004043049

申请日：2004-12-21

Applicant: TESSERA INC ,  DAMBERG PHILIP ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  KANG TECK-GYU

Inventor： DAMBERG PHILIP ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  KANG TECK-GYU

IPC: H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/498 ,  H01L23/52 ,  H01L29/40 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A microelectronic package (20) includes a microelectronic element (22) having faces and contacts (26), a flexible substrate (30) overlying and spaced from a first face (24) of the microelectronic element (22), and a plurality of conductive terminals (42) exposed at a surface of the flexible substrate. The conductive terminals (42) are electrically interconnected with the microelectronic element (22) and the flexible substrate (30) includes a gap (50) extending at least partially around at least one of the conductive terminals (42). In certain embodiments, the package includes a support layer, such as a compliant layer (48), disposed between the first face (24) of the microelectronic element (22) and the flexible substrate (30). In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

Abstract translation: 微电子封装（20）包括具有面和触点（26）的微电子元件（22），覆盖并与微电子元件（22）的第一面（24）隔开的柔性衬底（30），以及多个导电 端子（42）暴露在柔性基板的表面。 导电端子（42）与微电子元件（22）电互连，并且柔性基板（30）包括至少部分地围绕至少一个导电端子（42）延伸的间隙（50）。 在某些实施例中，封装包括设置在微电子元件（22）的第一面（24）和柔性基板（30）之间的支撑层，例如顺应层（48）。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：WO2006091793A8

公开(公告)日：2007-10-04

申请号：PCT/US2006006554

申请日：2006-02-23

Applicant: TESSERA INC ,  HABA BELGACEM

Inventor： HABA BELGACEM

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L24/16 ,  G01R31/2896 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/0554 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/29099

Abstract: A microelectronic assembly includes a microelectronic element (20), such as a semiconductor wafer or semiconductor chip, having a first surface (22) and contacts (24) accessible at the first surface (22), and a compliant layer (26) overlying the first surface of the microelectronic element, the compliant layer (26) having openings in substantial alignment with the contacts (24) of the microelectronic element. The assembly desirably includes conductive posts (38) overlying the compliant layer (26) and projecting away from the first surface (22) of the microelectronic element (20), the conductive posts (38) being electrically interconnected with the contacts (24) of the microelectronic element (20) by elongated, electrically conductive elements extending between the contacts (24) and the conductive posts (38).

Abstract translation: 微电子组件包括具有在第一表面（22）可接近的第一表面（22）和触点（24）的微电子元件（20），例如半导体晶片或半导体芯片，以及柔性层（26），其覆盖 微电子元件的第一表面，顺应层（26）具有与微电子元件的触点（24）基本对准的开口。 组件理想地包括覆盖顺应层（26）并远离微电子元件（20）的第一表面（22）突出的导电柱（38），导电柱（38）与触点（24）电互连 所述微电子元件（20）由在所述触头（24）和所述导电柱（38）之间延伸的细长的导电元件。