公开(公告)号：US11641720B2

公开(公告)日：2023-05-02

申请号：US17224078

申请日：2021-04-06

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Shao-Chien Lee ,  Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang ,  Pei-Chang Huang ,  Chin-Min Hu

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/34

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

公开(公告)号：US11337303B2

公开(公告)日：2022-05-17

申请号：US16533808

申请日：2019-08-07

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/05

Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

公开(公告)号：US11013103B2

公开(公告)日：2021-05-18

申请号：US16203636

申请日：2018-11-29

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Kai-Ming Yang ,  Chien-Tsai Li

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46

Abstract: A method for forming a circuit board includes forming a first dielectric layer, a first circuit layer in the first dielectric layer, a second circuit layer on the first dielectric layer, and a plurality of conductive vias in the first dielectric layer and connecting the first circuit layer to the second circuit layer; forming a second dielectric layer on the first dielectric layer and the second circuit layer; forming a plurality of openings in the second dielectric layer to expose a plurality of parts of the second circuit layer; forming a seed layer on the exposed parts of the second circuit layer and sidewalls of the openings; and forming a plurality of bonding layers on the seed layer, wherein the bonding layers and the seed layer are made of copper, and the bonding layers are porous.

公开(公告)号：US20200329565A1

公开(公告)日：2020-10-15

申请号：US16739133

申请日：2020-01-10

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Pei-Chang Huang ,  Chi-Chun Po ,  Chun-Lin Liao ,  Po-Hsiang Wang ,  Hsuan-Wei Chen

IPC: H05K3/10

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

公开(公告)号：US20200083142A1

公开(公告)日：2020-03-12

申请号：US16683266

申请日：2019-11-14

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Pei-Chang Huang

IPC: H01L23/42 ,  H01L23/498 ,  H01L23/18 ,  H01L23/367 ,  H01L23/467 ,  H01L23/14 ,  H01L21/48

Abstract: A package substrate includes a multilayer circuit structure, a gas-permeable structure, a heat conducting component, a first circuit layer, a second circuit layer and a build-up circuit structure. The gas-permeable structure and the heat conducting component are respectively disposed in a first and a second through holes of the multilayer circuit structure. The first and the second circuit layers are respectively disposed on an upper and a lower surfaces of the multilayer circuit structure and expose a first and a second sides of the gas-permeable structure. The build-up circuit structure is disposed on the first circuit layer and includes at least one patterned photo-imageable dielectric layer and at least one patterned circuit layer alternately stacked. The patterned circuit layer is electrically connected to the first circuit layer by at least one opening. The build-up circuit structure and the first circuit layer exposed by a receiving opening form a recess.

公开(公告)号：US10141224B2

公开(公告)日：2018-11-27

申请号：US15821666

申请日：2017-11-22

Applicant: Unimicron Technology Corp.

Inventor： Dyi-Chung Hu ,  Yin-Po Hung ,  Ra-Min Tain ,  Yu-Hua Chen

IPC: H01L21/768 ,  H01L23/498 ,  H01L21/48 ,  H01L23/48

Abstract: An interconnection structure and a manufacturing method thereof are provided. The method includes the following steps. First, a substrate having a first surface and a second surface opposite to each other is provided. Then, a conductive through via extended from the first surface to the second surface is formed in the substrate. Then, a portion of the substrate is removed from the first surface to expose a portion of the conductive through via. Then, a dielectric layer is formed on the substrate, and the dielectric layer covers the exposed conductive through via. Then, an opening is formed in the dielectric layer, wherein the opening exposes a portion of the conductive through via, and the top surface of the conductive through via protrudes from the bottom surface of the opening. Then, a conductive layer is formed in the opening.

公开(公告)号：US20180096889A1

公开(公告)日：2018-04-05

申请号：US15821666

申请日：2017-11-22

Applicant: Unimicron Technology Corp.

Inventor： Dyi-Chung Hu ,  Yin-Po Hung ,  Ra-Min Tain ,  Yu-Hua Chen

IPC: H01L21/768 ,  H01L23/498 ,  H01L21/48 ,  H01L23/48

CPC classification number: H01L21/76879 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827

Abstract: An interconnection structure and a manufacturing method thereof are provided. The method includes the following steps. First, a substrate having a first surface and a second surface opposite to each other is provided. Then, a conductive through via extended from the first surface to the second surface is formed in the substrate. Then, a portion of the substrate is removed from the first surface to expose a portion of the conductive through via. Then, a dielectric layer is formed on the substrate, and the dielectric layer covers the exposed conductive through via. Then, an opening is formed in the dielectric layer, wherein the opening exposes a portion of the conductive through via, and the top surface of the conductive through via protrudes from the bottom surface of the opening. Then, a conductive layer is formed in the opening.

公开(公告)号：US09859159B2

公开(公告)日：2018-01-02

申请号：US14644197

申请日：2015-03-10

Applicant: Unimicron Technology Corp.

Inventor： Dyi-Chung Hu ,  Yin-Po Hung ,  Ra-Min Tain ,  Yu-Hua Chen

IPC: H01L23/538 ,  H01L21/768 ,  H01L23/498 ,  H01L21/48 ,  H01L23/48

CPC classification number: H01L21/76879 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827

Abstract: An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a substrate, a conductive through via, a dielectric layer, and a conductive layer. The substrate has a first surface and a second surface opposite to each other. The conductive through via is disposed in the substrate and extended from the first surface beyond the second surface. The dielectric layer is disposed on the substrate, wherein the dielectric layer has an opening exposing a portion of the conductive through via. The top surface of the conductive through via protrudes from the bottom surface of the opening. The conductive layer is disposed in the opening and connected to the conductive through via.

公开(公告)号：US20170110393A1

公开(公告)日：2017-04-20

申请号：US15391861

申请日：2016-12-28

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Kai-Ming Yang ,  Wang-Hsiang Tsai ,  Tzyy-Jang Tseng

IPC: H01L23/498 ,  H01L21/683 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/4673 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/10674 ,  Y10T29/49165 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A circuit board includes a composite layer of a non-conductor inorganic material and an organic material, a plurality of conductive structures, a first built-up structure, and a second built-up structure. The composite layer of the non-conductor inorganic material and the organic material has a first surface and a second surface opposite to each other and a plurality of openings. The conductive structures are respectively disposed in the openings of the composite layer of the non-conductor inorganic material and the organic material. The first built-up structure is disposed on the first surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures. The second built-up structure is disposed on the second surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures.

公开(公告)号：US20160190050A1

公开(公告)日：2016-06-30

申请号：US14583755

申请日：2014-12-28

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Dyi-Chung Hu ,  Yu-Hua Chen

IPC: H01L23/498 ,  H01L21/3105 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/4864 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing an interposer includes the following steps. Conductive beads is filled in a blind via of a substrate and a solder layer of each conductive bead is melted so as to form a solder post in the blind via. A metal ball of each conductive bead is inlaid in the corresponding solder post such that the solder post and the metal balls inlaid therein construct a conductive though via. Two surfaces of the substrate are planarized such that two ends of the conductive through via are exposed to the two surfaces of the substrate respectively and are flush with the two surfaces of the substrate respectively. A redistribution layer is manufactured at each surface of the substrate such that the two ends of each conductive through via connect the redistribution layers respectively. Besides, an interposer and a chip package structure applied the interposer are also provided.

Abstract translation: 一种用于制造插入件的方法包括以下步骤。 导电珠填充在基板的盲孔中，并且每个导电珠的焊料层熔化，以在盲孔中形成焊料柱。 每个导电珠的金属球镶嵌在相应的焊料柱中，使得焊接柱和镶嵌在其中的金属球构成导电的通孔。 基板的两个表面被平坦化，使得导电通孔的两个端部分别暴露于基板的两个表面，并分别与基板的两个表面齐平。 在衬底的每个表面处制造再分布层，使得每个导电通孔的两端分别连接重新分布层。 此外，还提供了应用了插入器的插入器和芯片封装结构。