公开(公告)号：US20150225837A1

公开(公告)日：2015-08-13

申请号：US14424961

申请日：2013-08-23

Applicant: KANEKA CORPORATION

Inventor： Hironori Hayakawa ,  Takashi Kuchiyama ,  Hiroaki Ueda

IPC: C23C14/08 ,  H05K1/02 ,  H05K1/03 ,  C23C14/34 ,  C23C14/58

CPC classification number: C23C14/086 ,  C23C14/34 ,  C23C14/5806 ,  G06F3/041 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/16 ,  H05K3/22 ,  H05K3/388 ,  H05K2201/0104 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0326 ,  H05K2203/1194

Abstract: A resin substrate with a transparent electrode having a low resistance, and a manufacturing method thereof including: a deposition step wherein a transparent electrode layer of indium tin oxide is formed on a transparent film substrate by a sputtering method, and a crystallization step wherein the transparent electrode layer is crystallized. In the deposition step, a sputtering deposition is performed using a sputtering target containing indium oxide and tin oxide, while a sputtering gas containing argon and oxygen is introduced into a chamber. It is preferable that an effective exhaust rate S, calculated from a rate Q of the sputtering gas introduced into the chamber and a pressure P in the chamber by a formula S (L/second)=1.688×Q (sccm)/P (Pa), is 1,200-5,000 (L/second). It is also preferable that a resistivity of the transparent electrode layer is less than 3×10−4 Ωcm.

Abstract translation: 一种具有低电阻的透明电极的树脂基板及其制造方法，包括：沉积步骤，其中通过溅射法在透明膜基板上形成氧化铟锡的透明电极层，以及结晶步骤，其中透明 电极层结晶。 在沉积步骤中，使用包含氧化铟和氧化锡的溅射靶进行溅射沉积，同时将含有氩和氧的溅射气体引入室中。 优选的是，从引入室中的溅射气体的速率Q和室内的压力P通过公式S（L /秒）= 1.688×Q（sccm）/ P（Pa）计算出的有效排气速度S ）为1,200-5,000（L /秒）。 还优选的是，透明电极层的电阻率小于3×10-4＆OHgr·cm。

公开(公告)号：US20150053465A1

公开(公告)日：2015-02-26

申请号：US14517672

申请日：2014-10-17

Applicant: Honeywell International Inc.

Inventor： Daniel Youngner ,  Son Thai Lu ,  Helen Chanhvongsak ,  Lisa Lust ,  Douglas Carlson

IPC: H05K3/46 ,  H05K3/30 ,  H05K3/06 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4644 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/0058 ,  H05K3/06 ,  H05K3/061 ,  H05K3/24 ,  H05K3/30 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/0104 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/0165 ,  H05K2203/0271

Abstract: An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be patterned and have components attached. More layers of dielectric and patterned metal may be added to the flexible circuit. Also bond pads and connecting vias may be fabricated in the flexible circuit. The flexible circuit may be cut into a plurality of smaller flexible circuits.

公开(公告)号：US20090223700A1

公开(公告)日：2009-09-10

申请号：US12042897

申请日：2008-03-05

Applicant: Daniel Youngner ,  Son Thai Lu ,  Helen Chanhvongsak ,  Lisa Lust ,  Doug Carlson

Inventor： Daniel Youngner ,  Son Thai Lu ,  Helen Chanhvongsak ,  Lisa Lust ,  Doug Carlson

IPC: H05K1/02 ,  H01B13/00

CPC classification number: H05K3/4644 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/0058 ,  H05K3/06 ,  H05K3/061 ,  H05K3/24 ,  H05K3/30 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/0104 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/0165 ,  H05K2203/0271

Abstract: An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be patterned and have components attached. More layers of dielectric and patterned metal may be added to the flexible circuit. Also bond pads and connecting vias may be fabricated in the flexible circuit. The flexible circuit may be cut into a plurality of smaller flexible circuits.

Abstract translation: 制造薄柔性电路的方法。 电介质层可以具有涂覆有金属的一个或两个表面。 电介质和金属可以各自具有亚密尔厚度。 电介质可以保持在类似于集成电路的固定装置中。 金属可以被图案化并且具有附接的部件。 电介质和图案化的金属层可以添加到柔性电路中。 还可以在柔性电路中制造接合焊盘和连接通孔。 柔性电路可以被切割成多个较小的柔性电路。

公开(公告)号：WO2016151053A1

公开(公告)日：2016-09-29

申请号：PCT/EP2016/056462

申请日：2016-03-23

Applicant: SAFRAN ELECTRONICS & DEFENSE

Inventor： GUILLOT, François ,  SPOOR, Pascal ,  CHETANNEAU, Patrice

IPC: H05K1/02 ,  H05K7/14 ,  H05K3/00

CPC classification number: H05K7/1439 ,  G06F1/184 ,  H01R12/7064 ,  H01R12/716 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/0094 ,  H05K3/421 ,  H05K3/4644 ,  H05K7/1412 ,  H05K7/1445 ,  H05K7/1452 ,  H05K7/1459 ,  H05K2201/0104 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/10189 ,  H05K2201/10295

Abstract: La présente invention concerne une carte électronique de fond de panier (20) présentant une face interne (142) adaptée pour être connectée à des connecteurs de cartes électroniques (12) et une face externe (143) adaptée pour être connectée à un connecteur externe (15), la carte de fond de panier (20) étant caractérisée en ce qu'elle présente des trous borgnes débouchant sur sa face interne (142), et des trous débouchant sur sa face externe (143), les trous étant adaptés pour recevoir des éléments de connexion à insertion par force et former avec eux un point de connexion électrique.

Abstract translation: 本发明涉及一种背板电子板（20），其具有适于连接到电子板连接器（12）的内表面（142）和适于连接到外连接器（15）的外表面（143），所述背板 其特征在于，具有在其内表面（142）上开口的盲孔和在其外表面（143）上开口的孔，该孔适于接收压配合连接元件并形成 电连接点。

公开(公告)号：WO2014070750A1

公开(公告)日：2014-05-08

申请号：PCT/US2013/067280

申请日：2013-10-29

Applicant: YOKLEY, Edward Maxwell ,  OBENG, Yaw Samuel

Inventor： YOKLEY, Edward Maxwell ,  OBENG, Yaw Samuel

IPC: B05D1/38 ,  B05D3/04 ,  B05D3/06

CPC classification number: H05K1/185 ,  B05D1/62 ,  B05D3/142 ,  B05D3/144 ,  B29C59/14 ,  C03C23/006 ,  C03C2218/31 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/0195 ,  H05K2201/09872 ,  H05K2203/095

Abstract: A film deposition process comprising exposing a surface of a substrate to a first plasma treatment having plasma reactants in a plasma chamber to form an activated substrate surface. The activated surface has a lower water contact angle than the substrate surface before the surface activating. The process comprises introducing water vapor into the plasma chamber to form a water layer on the activated surface. The process comprises introducing pre-cursors molecules into the plasma chamber in the presence of a second plasma to graft a layer of reacted pre-cursor molecules on the water layer.

Abstract translation: 一种成膜方法，包括将衬底的表面暴露于在等离子体室中具有等离子体反应物的第一等离子体处理以形成活化的衬底表面。 激活的表面在表面激活之前具有比基底表面更低的水接触角。 该方法包括将水蒸气引入等离子体室中以在活化表面上形成水层。 该方法包括在存在第二等离子体的情况下将预游离子分子引入等离子体室，以在水层上移植一层反应的前体分子。

公开(公告)号：US20240182614A1

公开(公告)日：2024-06-06

申请号：US18282942

申请日：2022-03-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masashi KODA ,  Akira IRIFUNE ,  Mitsuyoshi NISHINO ,  Hisashi FUJINAGA ,  Yuuki HIROKAWA

IPC: C08F212/34 ,  C08J5/24 ,  C08K3/013 ,  C08K3/22 ,  C08K3/36 ,  C08K9/02 ,  C08K9/06 ,  H05K1/03

CPC classification number: C08F212/34 ,  C08J5/244 ,  C08K3/013 ,  C08K9/02 ,  C08K9/06 ,  H05K1/0373 ,  C08K2003/222 ,  C08K3/36 ,  H05K2201/0104 ,  H05K2201/0166 ,  H05K2201/0215

Abstract: A resin composition contains a polyfunctional vinyl aromatic copolymer (A) containing a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound, a curing agent (B), at least one filler (C) selected from the group consisting of a titanate compound filler (C1) and a magnesium oxide filler (C2), and a silica filler (D), in which the content ratio of the high dielectric constant filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.

公开(公告)号：US11643525B2

公开(公告)日：2023-05-09

申请号：US17012348

申请日：2020-09-04

Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Jeongsook Ha ,  Jungwook Kim

IPC: H05K1/03 ,  C08L1/04 ,  C08B15/02 ,  C08L29/04 ,  H01G4/015

CPC classification number: C08L1/04 ,  C08B15/02 ,  C08L29/04 ,  H01G4/015 ,  H05K1/036 ,  H05K1/0353 ,  C08L2203/20 ,  H05K2201/0104

Abstract: An electronic device with self-recovering properties including a substrate including a polymer composite, a conductive pattern disposed on the substrate, and an electrode disposed on the conductive pattern is provided, and the polymer composite includes a composite of different first and second polymers, the first polymer includes a first functional group capable of forming a hydrogen bond between polymer chains, and the second polymer includes a second functional group capable of forming a hydrogen bond between polymer chains.

公开(公告)号：US09763322B2

公开(公告)日：2017-09-12

申请号：US15394831

申请日：2016-12-30

Applicant: Industrial Technology Research Institute

Inventor： Chao-Jen Wang ,  Jia-Chong Ho

IPC: H05K1/02 ,  H05K3/22 ,  H05K3/28 ,  H05K13/08

CPC classification number: H05K1/0281 ,  B29C37/0082 ,  B29C73/02 ,  B29K2995/0092 ,  H05K1/0269 ,  H05K3/22 ,  H05K3/28 ,  H05K13/08 ,  H05K2201/0104 ,  H05K2203/16

Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.

公开(公告)号：US20170094787A1

公开(公告)日：2017-03-30

申请号：US15255899

申请日：2016-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-yong JOO ,  Jin-hyung LEE

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0366 ,  H05K1/0257 ,  H05K1/0298 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K3/4617 ,  H05K2201/0104 ,  H05K2201/0284 ,  H05K2201/0355 ,  H05K2203/0278

Abstract: Disclosed is a printed circuit board, to which at least one circuit device is mountable, including a base layer with a plurality of paper layers; a waterproof insulation layer laid on a first surface of the base layer; a copper foil layer laid on a second surface opposite to the first surface of the base layer and printed with a signal line pattern connectable with the at least one circuit device; and an adhesive layer configured to be interposed between the base layer and the copper foil layer that includes an adhesive material for adhering the base layer and the copper foil layer.

公开(公告)号：US09412726B2

公开(公告)日：2016-08-09

申请号：US14679306

申请日：2015-04-06

Applicant: Japan Display Inc.

Inventor： Tsuneyuki Asaka

IPC: H01L27/32 ,  H01L25/18 ,  H01L27/12 ,  G02F1/1345 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32

CPC classification number: H01L25/18 ,  G02F1/1345 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/3248 ,  H01L27/3253 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0104 ,  H05K2201/0326 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display device includes a substrate on which a plurality of pixels are arranged and a circuit for displaying images with respect to each pixel is formed, a substrate terminal as a terminal formed on the substrate, and an electronic component terminal as a terminal of an electronic component electrically connected to the terminal via an anisotropic conductive film. A conductive region that conducts to the anisotropic conductive film in the substrate terminal has a light transmissive part in which a material having light transmissivity penetrates the substrate surface in a perpendicular direction.

Abstract translation: 一种显示装置，其特征在于，具备：配置有多个像素的基板，形成相对于各像素显示图像的电路，形成在所述基板上的作为端子的基板端子和作为电子端子的电子部件端子 部件通过各向异性导电膜电连接到端子。 在基板端子中向各向异性导电膜导通的导电区域具有透光性部分，其中具有透光性的材料在垂直方向上穿透基板表面。