公开(公告)号：WO2016143925A1

公开(公告)日：2016-09-15

申请号：PCT/KR2015/002376

申请日：2015-03-11

Applicant: 서울대학교산학협력단

Inventor： 조맹효 ,  조규진 ,  류정현 ,  고제성 ,  이종구

IPC: H05K1/02 ,  H05K3/12

CPC classification number: H05K1/028 ,  G01B7/18 ,  G01B7/20 ,  G01N27/00 ,  G01N27/02 ,  G01R27/00 ,  G01R27/02 ,  G01R27/08 ,  H05K1/02 ,  H05K3/12 ,  H05K2201/07

Abstract: 본 발명은 유연 기판; 및 상기 유연 기판의 표면에 형성된 것으로 전기전도성 물질로 이루어진 전도체들이 유연 기판의 변형에 따라 접촉/비접촉 거동하도록 배열하여 이루어진 전도성 패턴을 포함하는 전기전도성 물질 패터닝을 이용한 변형 감지 유연성 기판을 제공한다.

Abstract translation: 本发明提供一种使用导电材料图案化的变形感测柔性基板，本发明包括：柔性基板; 以及导电图案，其形成在柔性基板的表面上，并且具有由导电材料形成的导体，其布置成根据柔性基板的变形而接触/非接触地移动。

公开(公告)号：WO2014069061A1

公开(公告)日：2014-05-08

申请号：PCT/JP2013/070723

申请日：2013-07-31

Applicant: 株式会社村田製作所

Inventor： 池本　伸郎 ,  若林　祐貴 ,  多胡　茂

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01P3/082 ,  H01P3/08 ,  H01P11/003 ,  H01R12/62 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/115 ,  H05K1/118 ,  H05K1/147 ,  H05K3/0052 ,  H05K3/363 ,  H05K3/4623 ,  H05K3/4632 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/097 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10204 ,  Y10T29/49016

Abstract: 　屈曲した構造を有する高周波信号線路の製造コストを低減することである。　信号線２０－２は、誘電体素体１２－２に沿って延在している。基準グランド導体２２－２は、信号線２０－２に沿って延在している。信号線２０－１は、誘電体素体１２－１に設けられ、かつ、誘電体素体１２－１に沿って延在している。基準グランド導体２２－１は、誘電体素体１２－１に設けられ、かつ、信号線２０－１に沿って延在している。誘電体素体１２－２の端部における裏面Ｓ４と誘電体素体１２－１の端部における主面Ｓ１とが接合されることによって、誘電体素体１２－１，１２－２との接続部分に角が形成されている。信号線２０－１と信号線２０－２とは電気的に接続されている。基準グランド導体２２－１，２２－２とは電気的に接続されている。

Abstract translation: 这是为了降低具有弯曲结构的高频信号线的制造成本。 信号线20-2沿着电介质主体12-2延伸。 参考接地导体22-2沿着信号线20-2延伸。 信号线路20-1设置在电介质主体12-1中，并沿着电介质主体12-1延伸。 参考接地导体22-1被设置在介电元件主体12-1中并且沿着信号线20-1延伸。 通过将电介质主体12-2的端部的背面S4与电介质主体12-1的端部的主面S1接合，而与电介质主体12-1,12-2 角落形成的部分。 信号线20-1和信号线20-2彼此电连接。 并电连接到参考接地导体22-1和22-2。

公开(公告)号：WO2014069095A1

公开(公告)日：2014-05-08

申请号：PCT/JP2013/073639

申请日：2013-09-03

Applicant: 株式会社村田製作所

Inventor： 池本　伸郎 ,  若林　祐貴 ,  多胡　茂

IPC: H01P3/08 ,  H01P5/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01P3/082 ,  H01P3/08 ,  H01P11/003 ,  H01R12/62 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/115 ,  H05K1/118 ,  H05K1/147 ,  H05K3/0052 ,  H05K3/363 ,  H05K3/4623 ,  H05K3/4632 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/097 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10204 ,  Y10T29/49016

Abstract: 　屈曲した構造を有する高周波信号線路の製造コストを低減することである。　信号線（２０－２）は、誘電体素体（１２－２）に沿って延在している。基準グランド導体（２２－２）は、信号線（２０－２）に沿って延在している。信号線（２０－１）は、誘電体素体（１２－１）に設けられ、かつ、誘電体素体（１２－１）に沿って延在している。基準グランド導体（２２－１）は、誘電体素体（１２－１）に設けられ、かつ、信号線（２０－１）に沿って延在している。誘電体素体（１２－２）の端部における裏面（Ｓ４）と誘電体素体（１２－１）の端部における主面（Ｓ１）とが接合されることによって、誘電体素体（１２－１，１２－２）との接続部分に角が形成されている。信号線（２０－１）と信号線（２０－２）とは電気的に接続されている。基準グランド導体（２２－１，２２－２）とは電気的に接続されている。

Abstract translation: 本发明降低了制造具有弯曲结构的高频信号线的成本。 信号线（20-2）沿着电介质元件（12-2）延伸。 参考接地导体（22-2）沿着信号线（20-2）延伸。 信号线（20-1）设置在电介质元件（12-1）上，沿电介质元件（12-1）延伸。 参考接地导体（22-1）被提供到电介质元件（12-1），并且沿着信号线（20-1）延伸。 在电介质元件（12-2）的端部处的背面（S4）和电介质元件（12-1）的端部处的主表面（S1）被接合以在该部分 其中电介质元件（12-1,12-2）接触。 信号线（20-1）和信号线（20-2）电连接。 参考接地导体（22-1,22-2）电连接。

公开(公告)号：WO2012018378A1

公开(公告)日：2012-02-09

申请号：PCT/US2011/001341

申请日：2011-07-29

Applicant: TYCO ELECTRONICS CORPORATION ,  BOPP, Steven Richard ,  NAY, Neil Ktul

Inventor： BOPP, Steven Richard ,  NAY, Neil Ktul

IPC: H01R13/6469 ,  H01R107/00

CPC classification number: H01R13/6466 ,  H01R13/6461 ,  H01R13/6469 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/0239 ,  H05K1/11 ,  H05K2201/07 ,  H05K2201/10189

Abstract: An electrical connector (100) that includes a circuit board (124) having a board substrate (125) that has opposite board surfaces (202, 204) and a thickness (T 1 )measured along an orientation axis (192) that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals (220, 222) and signal traces (231-238) that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors (116, 130), respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces (235, 236) form a broadside-coupling region (250) in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance (D CRT1 ).

Abstract translation: 一种电连接器（100），包括具有板基板（125）的电路板（124），该基板具有相对的板表面（202,204）和沿着定向轴线（192）测量的厚度（T1） 板表面。 电路板具有相关联的输入和输出端子对（220,222）和电连接相关联的输入和输出端子对的信号迹线（231-238）。 所述输入和输出端子分别被配置为可通信地耦合到配合电缆导体（116,130）。 每个相关联的输入和输出端子对通过相应的信号迹线电连接，该对应的信号迹线具有沿对应的输入和输出端子之间的板基板延伸的导电路径。 至少两个信号迹线（235,236）形成宽侧耦合区域（250），其中至少两个信号迹线的导电路径沿着取向轴线堆叠并且通过厚度间隔开并且彼此平行地延伸，以便 减少串扰的距离（DCRT1）。

公开(公告)号：US20240172365A1

公开(公告)日：2024-05-23

申请号：US18354778

申请日：2023-07-19

Applicant: HYUNDAI MOBIS CO., LTD.

Inventor： Sae Jun PARK

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/181 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/14 ,  H05K2201/07 ,  H05K2201/10113 ,  H05K2201/10325

Abstract: A power supply apparatus is provided. The power supply apparatus includes a flexible board including a first surface and a second surface disposed opposite to the first surface, a connecting terminal disposed on the first surface of the flexible board, and a fixing plate disposed on the second surface of the flexible board and disposed opposite to the connecting terminal.

公开(公告)号：US20240032192A1

公开(公告)日：2024-01-25

申请号：US18343772

申请日：2023-06-29

Applicant: Innolux Corporation

Inventor： Zhi-Fu Huang

IPC: H05K1/11 ,  H05K3/32

CPC classification number: H05K1/111 ,  H05K3/32 ,  H05K2201/0317 ,  H05K2201/09409 ,  H05K2201/07

Abstract: An electronic device, including multiple electronic elements, a first substrate, a second substrate, and a third substrate, is provided. The first substrate includes a first device element and a first connection pad. The second substrate includes a second device element and a second connection pad. The third substrate includes a first connection line, wherein the first connection pad and the second connection pad are coupled to the first connection line, and the first substrate, the second substrate, and the electronic elements are disposed on the third substrate.

公开(公告)号：US20190037718A1

公开(公告)日：2019-01-31

申请号：US16152508

申请日：2018-10-05

Applicant: International Business Machines Corporation

Inventor： Michael J. Shapiro ,  Brian C. Twichell ,  Brent W. Yardley

IPC: H05K5/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K5/0217 ,  H05K1/11 ,  H05K1/181 ,  H05K7/20727 ,  H05K2201/07 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2201/2027 ,  Y02P70/611

Abstract: An apparatus includes a particle trap coupled to a first surface of an enclosure, wherein the first surface of the enclosure is opposite a top surface of a circuit board. A particle guard coupled to the top surface on a first side of the circuit board located in the enclosure, wherein the enclosure includes one or more apertures on a second surface of the enclosure where the first side of the circuit board is introduced to an external airflow.

公开(公告)号：US09961765B2

公开(公告)日：2018-05-01

申请号：US15271800

申请日：2016-09-21

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Brian M. Erwin

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K1/03 ,  H05K3/28 ,  B05D3/10 ,  B41N1/08 ,  C23C22/76 ,  C23C22/66 ,  C23C22/78

CPC classification number: H05K1/0275 ,  B05D3/102 ,  B41N1/083 ,  C23C22/66 ,  C23C22/76 ,  C23C22/78 ,  C25D11/04 ,  C25D11/045 ,  C25D11/16 ,  H01L23/57 ,  H05K1/00 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/115 ,  H05K1/16 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/07 ,  H05K2201/09681 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/033 ,  H05K2203/0369 ,  H05K2203/0392 ,  H05K2203/0733 ,  H05K2203/1142

Abstract: A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

公开(公告)号：US09900970B2

公开(公告)日：2018-02-20

申请号：US14975951

申请日：2015-12-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Mill-Jer Wang ,  Ching-Nen Peng ,  Hung-Chih Lin ,  Hao Chen

IPC: H01H47/00 ,  H05F3/02 ,  H02H9/04 ,  G01R1/073 ,  G01R1/36 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05F3/02 ,  G01R1/07378 ,  G01R1/36 ,  H01L2924/15174 ,  H01L2924/15311 ,  H02H9/046 ,  H05K1/11 ,  H05K1/181 ,  H05K2201/07 ,  H05K2201/10734

Abstract: The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.

公开(公告)号：US09774070B2

公开(公告)日：2017-09-26

申请号：US14537059

申请日：2014-11-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuo Ikemoto ,  Yuki Wakabayashi ,  Shigeru Tago

IPC: H01P3/08 ,  H01P11/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H01R12/62 ,  H05K3/00 ,  H05K3/46 ,  H01R103/00 ,  H01R24/50

CPC classification number: H01P3/082 ,  H01P3/08 ,  H01P11/003 ,  H01R12/62 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/115 ,  H05K1/118 ,  H05K1/147 ,  H05K3/0052 ,  H05K3/363 ,  H05K3/4623 ,  H05K3/4632 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/097 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10204 ,  Y10T29/49016

Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.