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    ELECTRO-FORMED RING INTERCONNECTION SYSTEM
    21.
    发明申请
    ELECTRO-FORMED RING INTERCONNECTION SYSTEM 审中-公开
    电铸成型互连系统

    公开(公告)号：WO2005119850A1

    公开(公告)日：2005-12-15

    申请号：PCT/US2005/018948

    申请日：2005-05-27

    Applicant: MOLEX INCORPORATED

    Inventor： NODA, Atsuhito ,  ICHIJO, Yasuhiro ,  HOSHIKAWA, Shigeyuki

    IPC: H01R4/02

    CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

    Abstract: Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (8) and a microelectronic device package (4). Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film (30) in which H-shaped cutouts (32) are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

    Abstract translation: 由柔韧材料制成的多个小导电和柔性中空环（10）提供用于衬底（8）和微电子器件封装（4）之间的柔性连接介质。 每个环被焊接到基板和装置两者，并且在制造期间通过形成有H形切口（32）的柔性非导电膜（30）保持在适当的位置，并且导电环被插入其中。 H形切口的内部部分延伸到导电环中，并在制造过程中将环保持在适当位置。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

    プリント回路板、半導体装置の接合構造及びプリント回路板の製造方法
    26.
    发明专利
    プリント回路板、半導体装置の接合構造及びプリント回路板の製造方法 审中-公开
    印刷电路板，半导体器件接合结构和印刷电路板制造方法

    公开(公告)号：JP2015026822A

    公开(公告)日：2015-02-05

    申请号：JP2014109101

    申请日：2014-05-27

    Applicant: キヤノン株式会社 ,  Canon Inc

    Inventor： SHIBUYA RYUICHI

    IPC: H01L21/60 ,  H01L23/12 ,  H05K1/18 ,  H05K3/34

    CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L25/105 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/181 ,  H05K1/186 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: 【課題】パッケージ基板やプリント配線板等の反り量の増大を抑制しつつ、隣接するはんだ接合部や隣接部品とのはんだのブリッジの発生を低減させる。【解決手段】半導体パッケージ200は、表面201aに配置された複数の電極パッド211を有するパッケージ基板201と、パッケージ基板201に実装された半導体素子202とを有する。プリント配線板300は、表面300aに配置され、各電極パッド211に対向する複数の電極パッド311を有する。これら電極パッド211と電極パッド311とを接合する複数のはんだ接合部400は、はんだ接合部400bと、断面積がはんだ接合部400bよりも大きく形成され、かつ最外周に配置されたはんだ接合部400aと、を有する。はんだ接合部400aは、囲い部材500で囲われている。【選択図】図1

    Abstract translation: 要解决的问题：减少相邻焊接接合部件或相邻部件之间的焊料桥的发生，同时抑制封装基板，印刷线路板等的翘曲量的增加。解决方案：印刷电路板包括： 包括具有布置在表面201a上的多个电极焊盘211和安装在封装基板201上的半导体元件202的封装基板201的半导体封装200; 包括布置在表面300a上并与各个电极焊盘211相对的多个电极焊盘311的印刷线路板300; 用于接合电极焊盘211和电极焊盘311的多个焊料接合部分400，其具有布置在最外周上的焊料接合部分400b和焊料接合部分400a，并且每个焊接接合部分形成为具有大于 焊接接合部400b的焊接接合部; 以及围绕各焊接接合部400a的周围部件500。

    Circuit board and power supply apparatus
    30.
    发明授权
    Circuit board and power supply apparatus 有权

    公开(公告)号：US09942988B2

    公开(公告)日：2018-04-10

    申请号：US15281340

    申请日：2016-09-30

    Applicant: TDK Corporation

    Inventor： Kazuharu Kitatani ,  Yasunobu Noguchi

    IPC: H05K7/00 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K1/181 ,  H05K1/0263 ,  H05K1/11 ,  H05K3/306 ,  H05K3/34 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/10272

    Abstract: A circuit board includes a base substrate, a busbar disposed on a mounting surface of the base substrate; and an electronic component disposed on the mounting surface and including a plurality of terminals. At least one of the terminals is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion is inserted. A first insertion portion is provided in the component connecting end portion. The terminal is inserted through the first insertion portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface positioned closer to a rear surface of the base substrate than the component mounting surface. The soldering surface is on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes.

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