公开(公告)号：US20060172564A1

公开(公告)日：2006-08-03

申请号：US10595034

申请日：2003-07-07

Applicant: Mattias Nilsson ,  Stefan Johansson

Inventor： Mattias Nilsson ,  Stefan Johansson

IPC: H01R12/00

CPC classification number: H05K3/368 ,  G01R31/046 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/325 ,  H05K3/4614 ,  H05K2201/10348 ,  H05K2201/10378 ,  H05K2203/162

Abstract: A retainer board (25, 27, 28) having at least one hole (10) in which a wire button contact (5) is inserted, wherein the hole (10) is plated and at least one conductor (20) is connected to the plated hole for providing outside access. Moreover a method for testing stacked circuit boards are disclosed comprising the steps of detachably arranging at least two circuits boards (11, 12, 29), testing the individual functionality of the circuit boards (11, 12) and if approved, assembling the circuit boards (11, 12) and the first retainer board (25, 27, 28), and asserting whether the overall functionality of the arrangement is approved.

Abstract translation: 具有插入有电线按钮触点（5）的至少一个孔（10）的保持板（25,27,28），其中所述孔（10）被电镀，并且至少一个导体（20）连接到 电镀孔用于提供外部接入。 此外，公开了一种用于测试堆叠电路板的方法，包括以下步骤：可拆卸地布置至少两个电路板（11,12,29），测试电路板（11,12）的各个功能，并且如果被批准，组装电路板 （11,12）和第一保持板（25,27,28），并且断言该装置的整体功能是否被批准。

公开(公告)号：US20060030170A1

公开(公告)日：2006-02-09

申请号：US11204699

申请日：2005-08-16

Applicant: Jeffrey Brody ,  Hsichang Liu ,  Hai Longworth ,  James Monaco ,  Gerard Nuzback ,  Wei Zou

Inventor： Jeffrey Brody ,  Hsichang Liu ,  Hai Longworth ,  James Monaco ,  Gerard Nuzback ,  Wei Zou

IPC: H01R12/00 ,  H05K3/20

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10348 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuss button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly.

Abstract translation: 提供了一种改进的Land Grid阵列互连结构，其中在基板电接触焊盘上使用小的金属凸块。 凸起与绒头按钮连接的部分互锁，并增加接触垫和大按钮之间的物理接触表面积。 改进的接触减少了由于热机械应力引起的电接触点的位移，并降低了组装过程中所需的致动力。

公开(公告)号：US20050221635A1

公开(公告)日：2005-10-06

申请号：US10708887

申请日：2004-03-30

Applicant: Jeffrey Brody ,  Hsichang Liu ,  Hai Longworth ,  James Monaco ,  Gerard Nuzback ,  Wei Zou

Inventor： Jeffrey Brody ,  Hsichang Liu ,  Hai Longworth ,  James Monaco ,  Gerard Nuzback ,  Wei Zou

IPC: H05K1/18 ,  H01L23/12 ,  H01L23/498 ,  H01R12/00 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10348 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuzz button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly.

Abstract translation: 提供了一种改进的Land Grid阵列互连结构，其中在基板电接触焊盘上使用小的金属凸块。 凸起与绒头按钮连接的部分互锁，并增加接触垫和绒毛按钮之间的物理接触表面积。 改进的接触减少了由于热机械应力引起的电接触点的位移，并降低了组装过程中所需的致动力。

公开(公告)号：US20040016114A1

公开(公告)日：2004-01-29

申请号：US10202726

申请日：2002-07-25

Applicant: International Business Machines Corporation

Inventor： Michael F. McAllister ,  John G. Torok

IPC: H05K003/20 ,  H05K001/00

CPC classification number: H05K1/141 ,  H05K1/0286 ,  H05K1/162 ,  H05K3/325 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/10348 ,  H05K2201/10666 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

公开(公告)号：JP4057395B2

公开(公告)日：2008-03-05

申请号：JP2002317776

申请日：2002-10-31

Applicant: 三菱電機株式会社

Inventor： 武志 伊藤

IPC: H01G2/06 ,  H01G9/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01G2/06 ,  H05K1/141 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/10348 ,  H05K2201/10409 ,  H05K2201/2036

公开(公告)号：JP2005513761A

公开(公告)日：2005-05-12

申请号：JP2003524313

申请日：2002-08-16

Applicant: レイセオン・カンパニーRaytheon Company

Inventor： クゥアン、クリフトン ,  スティット、ジェフリー・ジェイ ,  ディアデン、ティモシー・イー

IPC: H05K1/18 ,  H01L23/02 ,  H01L23/66 ,  H01P1/04 ,  H01P5/08 ,  H05K1/02 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

Abstract: ＲＦ相互接続部は、圧縮可能な中心導体（ファジーボタン）相互接続部を使用して多層ＰＷＢへ直接取付けるためのＲＦモジュールパッケージ50中に設けられる。 モジュールはマイクロ波周波数で動作する回路を有する。 モジュールパッケージは金属底部壁構造54を含む金属ハウジング52を含んでいる。 モジュールは複数のＲＦ相互接続部を含んでおり、それらはパッケージとＰＷＢとの間にＲＦ相互接続部を与える。 各相互接続部は金属底部壁に形成される開口を通って突出する貫通中心ピン72を含んでおり、誘電体貫通端子絶縁体74によって絶縁されている。 中心ピンはモジュールハウジングの底部壁の外部表面に取付けられている遮蔽ピンのリング76で囲まれている。 ピンはＰＷＢに形成された穴に挿入可能であり、穴に配置されたファジーボタン相互接続部130 、12と接触する。 回路はファジーボタン相互接続部を接地およびＲＦ信号伝導のためにＰＷＢの適切なレベルに接続する。

公开(公告)号：JP2004153097A

公开(公告)日：2004-05-27

申请号：JP2002317776

申请日：2002-10-31

Applicant: Mitsubishi Electric Corp ,  三菱電機株式会社

Inventor： ITO TAKESHI

IPC: H01G2/06 ,  H01G9/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01G2/06 ,  H05K1/141 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/10348 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: PROBLEM TO BE SOLVED: To allow an electrolytic capacitor to be replaced simply and easily.
SOLUTION: Electrode lead wires 3A, 3B of each of capacitors 1 are soldered to land patterns of an insulative attachment plate 10. Spacers 2A, 2B with a flexible structure comprising woven metal threads are mounted on electrode patterns 5A, 5B printed on a printed-circuit board 6. Apical portions 3TA, 3TB of the electrode lead wires protruding from the attachment plate 10 are thrust into the spacers 2A, 2B to make the apical portions 3TA, 3TB contact mechanically the spacers 2A, 2B. Maintaining the contacting state, the attachment plate 10 is bolted to the printed-circuit board 6. Thereby, the capacitor assembly is formed. When replacing the capacitors 1, only loosening the bolting detaches the capacitors 1 together with the attachment plate 10 from the circuit board 6.
COPYRIGHT: (C)2004,JPO

公开(公告)号：KR20100000328A

公开(公告)日：2010-01-06

申请号：KR20080059780

申请日：2008-06-24

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： CHUNG HYUN SOO ,  CHO JAE SHIN ,  HWANG SEONG DEOK ,  KIM JUM GON ,  KIM KI HYUK

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L23/525 ,  H01L23/53252 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/325 ,  H05K2201/10348 ,  H05K2201/10977 ,  H01L2924/00014

Abstract: PURPOSE: A semiconductor package with joint reliability and method of fabricating the same are provided to alleviate the stress between the printed circuit board and the semiconductor chip by using the solder wire. CONSTITUTION: The semiconductor package comprises the connection pad(120), and the first insulating layer(140) and rerouting line. The connection pad is arranged on the semiconductor substrate(110). The first insulating layer has the first opening(145) while covering the semiconductor substrate and connection pad. The first opening partly exposes the connection pad. The reinterconnection line is arranged on the first insulating layer. The rerouting line touches through the first opening with the connection pad. The semiconductor package more includes the second insulating layer(170) and connection terminal(180). The second insulating layer has the second opening(175) while being located on surface the rerouting line and the first insulating layer. The second opening partly exposes the rerouting line. The connection terminal contacts with the reinterconnection line exposing through the second opening. The connection terminal is included of the tangled wire.

Abstract translation: 目的：提供具有联合可靠性的半导体封装及其制造方法，以通过使用焊丝来减轻印刷电路板与半导体芯片之间的应力。 构成：半导体封装包括连接焊盘（120）和第一绝缘层（140）和重新布线。 连接焊盘设置在半导体衬底（110）上。 第一绝缘层具有第一开口（145），同时覆盖半导体衬底和连接衬垫。 第一个开口部分露出连接垫。 再连接线布置在第一绝缘层上。 重新布线通过连接板穿过第一个开口。 半导体封装还包括第二绝缘层（170）和连接端子（180）。 第二绝缘层具有第二开口（175），同时位于重新布线和第一绝缘层的表面上。 第二个开口部分暴露了重新布线。 连接端子通过第二开口与再连接线接触。 连接端子包括纠缠线。

公开(公告)号：JP2005286331A

公开(公告)日：2005-10-13

申请号：JP2005090543

申请日：2005-03-28

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： BRODY JEFFREY A ,  LIU HSICHANG ,  HAI PHAM LONGWORTH ,  MONACO JAMES C ,  NUZBACK GERARD J ,  ZOU WEI

IPC: H05K1/18 ,  H01L23/12 ,  H01L23/498 ,  H01R12/00 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10348 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To improve a physical contact surface region with the aid of minute bumps and to provide an LGA (Land Grid Array) interconnection the electrical interconnection of which has been improved. SOLUTION: An improved LGA interconnection structure using small metal bumps on an electrically contact pad 20 of a substrate is provided. The bump 21 is interlocked with a portion of a fuzz button connection to increase the physically the contact surface region between a contact pad 20 and the fuzz button. Due to the improvement of the contact, displacement of an electrically contact point by a thermal mechanical stress is reduced and an active force required between assemblies is reduced. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：借助于微小的凸块来改善物理接触表面区域并提供其电互连已经得到改善的LGA（陆地网格阵列）互连。 提供了一种在衬底的电接触焊盘20上使用小金属凸块的改进的LGA互连结构。 凸起21与毛绒按钮连接的一部分互锁，以物理地增加接触垫20和绒毛按钮之间的接触表面区域。 由于接触的改善，电接触点由热机械应力的位移减小，并且组件之间所需的主动力减小。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2011071435A

公开(公告)日：2011-04-07

申请号：JP2009223178

申请日：2009-09-28

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： TAMURA AKIRA

IPC: H01L23/32

CPC classification number: H05K3/32 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/1316 ,  H01L2224/14131 ,  H01L2224/81101 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H05K2201/0314 ,  H05K2201/09681 ,  H05K2201/09854 ,  H05K2201/1028 ,  H05K2201/10348 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/01024 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an interposer which is compact and reliable, and has a simple structure. SOLUTION: The interposer 20 that electrically connects a plurality of external electrodes 4, 6, positioned in a vertically opposed state, in a compressed state is constituted of: a flat plate-like substrate 8 having through-holes 9 bored in a grid array shape and made of a dielectric material, and elastic contactors 10 each inserted into corresponding through-holes 9. The elastic contacts 10 are each made of a meshed elastic conductive sheet which has a width larger than the overall length of the through-hole 9 and a length longer than the length of a circumference of a circle inscribed in the through-hole 9, and inserted into the through-hole 9 in a rolled-up state. The elastic conductive sheet inserted into the through-hole 9 can overlap itself within the through-hole 9, and is protruded from both the top and bottom sides of the through-hole 9. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种紧凑可靠的中介层，结构简单。 解决方案：以压缩状态电连接位于垂直相对状态的多个外部电极4,6的插入器20由以下部件构成：平板状基板8，其具有在 栅格阵列形状，由电介质材料制成，弹性接触器10分别插入对应的通孔9.弹性接触件10由网状弹性导电片制成，其宽度大于通孔的总长度 并且长度比内通在通孔9中的圆的圆周的长度长，并且在卷起状态下插入到通孔9中。 插入到通孔9中的弹性导电片可以在通孔9内自身重叠，并且从通孔9的顶面和底面都突出。（C）2011，JPO＆INPIT