公开(公告)号：US20140264424A1

公开(公告)日：2014-09-18

申请号：US13948640

申请日：2013-07-23

Applicant: Grote Industries, LLC.

Inventor： Timothy Webster Brooks ,  Scott J. Jones ,  Martin J. Marx ,  Cesar Perez-Bolivar ,  James E. Roberts ,  George M. Richardson, II

IPC: H01L33/64

CPC classification number: H01L33/644 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/10977 ,  H01L2924/00

Abstract: A lighting element, comprising: a first substrate; a first and second conductive elements located on the first substrate; a light-emitting element having first and second contacts that are both on a first surface of the light-emitting element, the first contact being electrically connected to the first conductive element, the second contact being electrically connected to the second conductive element, and the light-emitting element emitting light from a second surface opposite the first surface; a top layer adjacent to the second surface; and an affixing layer located between the first substrate and the top layer, the affixing layer affixing the top layer to the first substrate; and a heat spreading layer having a third surface and a fourth surface opposite the third surface, the heat spreading layer being affixed beneath the first flexible substrate at the third surface, wherein the flexible top layer is substantially transparent to light.

Abstract translation: 1.一种照明元件，包括：第一基板; 位于所述第一基板上的第一和第二导电元件; 具有在所述发光元件的第一表面上的第一和第二触点的发光元件，所述第一触点电连接到所述第一导电元件，所述第二触点电连接到所述第二导电元件， 从与第一表面相对的第二表面发射光的发光元件; 与第二表面相邻的顶层; 以及位于所述第一基板和所述顶层之间的固定层，所述固定层将所述顶层固定到所述第一基板; 以及具有与所述第三表面相对的第三表面和第四表面的散热层，所述热扩散层在所述第三表面处固定在所述第一柔性基板下方，其中所述柔性顶层对于光基本上是透明的。

公开(公告)号：US20140232511A1

公开(公告)日：2014-08-21

申请号：US14236851

申请日：2012-08-03

Applicant: Rainer Durth ,  Thomas Meyer

Inventor： Rainer Durth ,  Thomas Meyer

IPC: H01H37/76

CPC classification number: H01H37/764 ,  H01H37/761 ,  H01T1/14 ,  H05K1/0201 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/1028 ,  H05K2203/047 ,  H05K2203/176

Abstract: Systems and methods are disclosed relating to a thermal overload protection apparatus and processes for protecting an electrical component. In one illustrative implementation, a thermal overload protection apparatus includes a switching element for short-circuiting connections of the component or for isolating an electrically conductive connection between at least one of the connections and a current-carrying element of the overload protection apparatus, an actuator for switching the switching element into a corresponding short-circuiting position or isolating position, and a tripping element that thermosensitively trips the actuator apparatus. and is formed as a separating element. According to further implementations, various other arrangements and methods for producing devices are disclosed.

Abstract translation: 公开了关于热过载保护装置和用于保护电气部件的方法的系统和方法。 在一个说明性实施例中，热过载保护装置包括用于使部件的连接短路或用于隔离至少一个连接件和过载保护装置的载流元件之间的导电连接的开关元件，致动器 用于将开关元件切换到相应的短路位置或隔离位置以及热敏地跳闸致动器装置的脱扣元件。 并形成为分离元件。 根据进一步的实施方式，公开了用于制造装置的各种其它布置和方法。

公开(公告)号：US08705246B2

公开(公告)日：2014-04-22

申请号：US13246903

申请日：2011-09-28

Applicant: Akitaka Kanamori ,  Takahiro Kadowaki

Inventor： Akitaka Kanamori ,  Takahiro Kadowaki

IPC: H05K1/18 ,  H05K7/00

CPC classification number: H05K1/18 ,  H01F27/292 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/1003 ,  H05K2201/1028 ,  H05K2203/0285

Abstract: An electronic part includes an electronic part body, an electrode terminal that protrudes from the electronic part body, and that electrically connects the electronic part to an external electrode when a flexible conductor is joined to an electrode surface, and a holder made of an insulating material, and joined to the electronic part body. The holder is interposed between a mounting plate and the electronic part body when the electronic part is mounted to the mounting plate, and the holder is in contact with a surface of the electrode terminal opposite from the electrode surface.

Abstract translation: 电子部件包括电子部件体，从电子部件体突出的电极端子，并且当柔性导体接合到电极表面时将电子部件电连接到外部电极，以及由绝缘材料制成的保持器 并加入电子零件体。 当电子部件安装到安装板上时，保持器插入在安装板和电子部件主体之间，并且保持器与电极端子的与电极表面相对的表面接触。

公开(公告)号：US20140021640A1

公开(公告)日：2014-01-23

申请号：US13937546

申请日：2013-07-09

Applicant: ABB Technology AG

Inventor： Gontran PÂQUES ,  Dominik Trüssel ,  Waldemar Groot ,  Stefan Ellenbroek ,  David Hajas

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/32 ,  H01L25/071 ,  H01L25/074 ,  H01L25/162 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H05K1/0254 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/09163 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2045 ,  H01L2924/00

Abstract: A method and arrangement are disclosed for electrically connecting a contact of a first substrate to a contact of a second substrate, whereby the first substrate is positioned relative the second substrate. The method includes providing the first substrate with its contact facing towards the second substrate, providing the second substrate with its contact facing away from the first substrate, bonding a bonding medium to the contact of the first substrate, bonding the bonding medium to the first substrate thereby forming a loop, electrically connecting the contact of the second substrate to the bonding medium, and providing the second substrate with the contact on a nose or tongue extending from an edge of the second substrate. The first substrate can be positioned below the second substrate, with a contact of the first substrate connected to a contact of the second substrate.

Abstract translation: 公开了一种用于将第一基板的触点电连接到第二基板的触点的方法和装置，由此第一基板相对于第二基板定位。 该方法包括提供其第一基底的接触面朝向第二基底，使第二基底的接触面远离第一基底，将接合介质粘合到第一基底的接触面上，将接合介质粘合到第一基底 从而形成环路，将第二基板的接触电连接到接合介质，以及将第二基板提供在从第二基板的边缘延伸的鼻或舌上的接触。 第一基板可以位于第二基板的下方，第一基板的接触连接到第二基板的接触。

公开(公告)号：US08572840B2

公开(公告)日：2013-11-05

申请号：US12895623

申请日：2010-09-30

Applicant: Michael A Christo ,  Julio A Maldonado ,  Roger D Weekly ,  Tingdong Zhou

Inventor： Michael A Christo ,  Julio A Maldonado ,  Roger D Weekly ,  Tingdong Zhou

IPC: H05K3/20

CPC classification number: H05K1/112 ,  H05K1/0263 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/1028 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

Abstract translation: 可以根据各种技术向电子模块供电。 在一般的实施方案中，例如，用于向电子模块供电的系统可以包括印刷电路板，电子模块和导电箔。 板可以包括在第一侧上的多个接触位置，其中至少一个接触位置电耦合到通孔到板的第二侧。 电子模块可以电耦合到板的第一侧上的接触位置，并且通过电耦合到通孔的至少一个接触位置接收电力。 箔可以适于传送用于电子模块的电力并且电耦合到电路板的第二侧上至少通过电气耦合到接收用于电子模块的电力的接触位置的通孔。

公开(公告)号：US20130118783A1

公开(公告)日：2013-05-16

申请号：US13429450

申请日：2012-03-26

Applicant: Chih Sheng Huang

Inventor： Chih Sheng Huang

IPC: H05K1/00

CPC classification number: H01R12/718 ,  H05K1/117 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/09854 ,  H05K2201/1028

Abstract: A circuit board includes a first pinout set of USB 2.0 standard provided on the circuit board; a second pinout set provided on the circuit board; and a flexible metal strip having a jut and four pinouts corresponding to StdA_SSRX−, StdA_SSRX+, StdA_SSTX−, and StdA_SSTX+ of USB 3.0 standard.

Abstract translation: 电路板包括电路板上提供的第一个USB 2.0标准引脚， 设置在电路板上的第二引脚排列; 以及具有对应于USB 3.0标准的StdA_SSRX-，StdA_SSRX +，StdA_SSTX-和StdA_SSTX +的突出和四个引脚的柔性金属条。

公开(公告)号：US08431830B2

公开(公告)日：2013-04-30

申请号：US12884701

申请日：2010-09-17

Applicant: Akira Tamura

Inventor： Akira Tamura

IPC: H05K1/03

CPC classification number: H05K3/32 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/1316 ,  H01L2224/14131 ,  H01L2224/81101 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H05K2201/0314 ,  H05K2201/09681 ,  H05K2201/09854 ,  H05K2201/1028 ,  H05K2201/10348 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/01024 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole.

Abstract translation: 用于连接半导体和电路板的插入件包括绝缘材料片，形成在绝缘材料片中的通孔和由弹性导电片形成并设置在通孔中的弹性导电接触。

公开(公告)号：US08405812B2

公开(公告)日：2013-03-26

申请号：US12861853

申请日：2010-08-24

Applicant: Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

Inventor： Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

IPC: G02F1/1345 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09845 ,  H05K2201/10136 ,  H05K2201/1028

Abstract: A connecting structure of the present invention includes a first substrate, a second substrate on which the first substrate is laminated, and a sheet like connection body having one end connected to one principal surface of the first substrate and another end connected to one principal surface of the second substrate, wherein a lengthwise direction of the sheet like connection body is parallel to a perimeter part of the first substrate, and the sheet like connection body has a slit part extending from one of end portions thereof to a part thereof along the lengthwise direction, and has a first end and a second end divided by the slit part at one of end portions, the first end is connected to a principal surface of the first substrate in vicinity of a peripheral part of the first substrate, and the second end is connected to a principal surface of the second substrate in vicinity of a peripheral part of the first substrate.

Abstract translation: 本发明的连接结构包括第一基板，层叠有第一基板的第二基板以及与第一基板的一个主面连接的一端的片状连接体， 第二基板，其中片状连接体的长度方向平行于第一基板的周边部分，并且片状连接体具有从其一个端部沿其长度方向延伸到其一部分的狭缝部分 并且具有在一个端部处被狭缝部分分割的第一端和第二端，所述第一端在所述第一基板的周边部分附近与所述第一基板的主表面连接，并且所述第二端是 在第一基板的周边部分附近与第二基板的主表面连接。

公开(公告)号：US08354594B2

公开(公告)日：2013-01-15

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising etched strip conductors (2) and wire conductors (6), which wire conductors run on and/or in the circuit board or card (1) between connection points (4). At least one of the wire conductors (6) has an essentially rectangular, for example, a square, cross-section.

Abstract translation: 本发明涉及一种包括蚀刻带状导体（2）和导线导体（6）的线印刷电路板或卡（1），其中导线在连接点之间和/或电路板或卡（1）之间延伸， 4）。 电线导体（6）中的至少一个具有基本上矩形的，例如正方形的横截面。

公开(公告)号：US20130005163A1

公开(公告)日：2013-01-03

申请号：US13579687

申请日：2011-03-03

Applicant: Dieter Holste ,  Ulrich Rosemeyer

Inventor： Dieter Holste ,  Ulrich Rosemeyer

IPC: H01R12/00

CPC classification number: H05K3/3405 ,  H05K3/4015 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/1034 ,  H05K2201/2072 ,  H05K2203/0455 ,  H05K2203/1178 ,  Y02P70/611

Abstract: The invention relates to an electrical contact arrangement of a spring contact element (10) on a printed circuit board (12) with a soldering area (16) arranged on a surface of the printed circuit board (12) and a planar contact area (18) arranged on the soldering area (16), wherein the spring contact element (10) can be arranged on the contact area (18).

Abstract translation: 本发明涉及一种弹性接触元件（10）在印刷电路板（12）上的电接触布置，其中布置在印刷电路板（12）的表面上的焊接区域（16）和平面接触区域（18） ）布置在焊接区域（16）上，其中弹簧接触元件（10）可以布置在接触区域（18）上。