公开(公告)号：EP2620043A4

公开(公告)日：2013-10-30

申请号：EP12785334

申请日：2012-05-21

Applicant: TECNOMAR OY

Inventor： MARTTILA TOM

IPC: H05K3/46 ,  G06K19/077 ,  H01L21/677 ,  H01L23/538

CPC classification number: H05K3/46 ,  G06K19/07749 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/1028 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

公开(公告)号：EP2620043A1

公开(公告)日：2013-07-31

申请号：EP12785334.9

申请日：2012-05-21

Applicant: Tecnomar Oy

Inventor： MARTTILA, Tom

IPC: H05K3/46 ,  H01L23/538 ,  H01L21/677 ,  G06K19/077

CPC classification number: H05K3/46 ,  G06K19/07749 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/1028 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A reel to reel manufacturing method of electrical bridges, wherein over a substrate (1) made of electrically insulating material is patterned a conductive pattern (2) from electroconductive material, such as metal foil, and from the said electroconductive material is made at least one strip tongue (3) unattached to the substrate, one side of which is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).

Abstract translation: 一种电桥的卷轴到卷轴的制造方法，其中在由电绝缘材料制成的基板（1）上由导电材料（例如金属箔）图案化导电图案（2），并且将所述导电材料制成至少一个 （3），其一侧连接到所述导电图案（2），并且所述条舌（3）折叠在与所述导电图案（2）电绝缘的区域上，并且所述条状物 舌片3与导电图案2的预定的另一部分5导电连接。

公开(公告)号：EP1984211B1

公开(公告)日：2013-05-22

申请号：EP07703245.6

申请日：2007-02-03

Applicant: Tyco Electronics AMP GmbH

Inventor： CHRITZ, Gunther

IPC: B60R16/023 ,  H05K7/02 ,  H05K1/00

CPC classification number: H05K1/0263 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10053 ,  H05K2201/10272 ,  H05K2201/10553

公开(公告)号：EP2563104A1

公开(公告)日：2013-02-27

申请号：EP11771781.9

申请日：2011-01-26

Applicant: Furukawa Electric Co., Ltd. ,  Furukawa Automotive Systems Inc.

Inventor： HARA, Toshitaka ,  HASHIMOTO, Kyosuke ,  TORATANI, Tomoaki ,  ABE, Kyutaro ,  FUKAI, Hiroyuki

IPC: H05K3/00 ,  H01F27/32

CPC classification number: H05K3/202 ,  H01F41/046 ,  H01F2017/048 ,  H05K1/165 ,  H05K2201/0215 ,  H05K2201/0397 ,  H05K2201/086 ,  H05K2201/09118 ,  Y10T29/49073

Abstract: A substrate 1 has a coil 5 that is a choke coil part and, for example, is used for controlling a motor. At the substrate 1, an electronic component mounting part 9 is formed such that a circuit conductor therein is to be exposed to outside. A portion other than an externally connected portion such as the electronic mounting part 9 is covered with substrate-forming resin to form an injection molded circuit board 3. The coil 5 arranged at the substrate 1 (the injection molded circuit board 3) is provided for smoothing current inputted from outside. A core part 7 is formed at the coil 5 by core-forming resin such that the coil part 7 covers at least a center core part 6 of the coil 5.

Abstract translation: 基板1具有作为扼流线圈部的线圈5，例如用于控制电动机。 在基板1上形成电子部件安装部9，使其内的电路导体露出到外部。 除了外部连接部分之外的诸如电子安装部分9的部分被基板形成树脂覆盖以形成注射成型电路板3.布置在基板1（注射成型电路板3）上的线圈5被设置用于 从外部输入的平滑电流。 芯线部分7通过芯部形成树脂形成在线圈5上，线圈部分7至少覆盖线圈5的中心芯部分6。

公开(公告)号：EP2312916A2

公开(公告)日：2011-04-20

申请号：EP10186521.0

申请日：2010-10-05

Applicant: IBIDEN CO., LTD.

Inventor： Tsukada, Kiyotaka ,  Muraki, Tetsuya

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/202 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10303 ,  H01L2924/00

Abstract: A circuit board ( 10 ) comprises a first conductive post ( 31 ) for electrically connecting to the collector electrode of a semiconductor device ( 50 ), a first metal plate ( 11 ) connecting to the first conductive post ( 31 ), a second conductive post ( 32 ) for electrically connecting to the gate electrode ( 52 ) of the semiconductor device ( 50 ), a second metal plate ( 12 ) connecting to the second conductive post ( 32 ), a third conductive post ( 33 ) for electrically connecting to the emitter electrode ( 53 ) of the semiconductor device ( 50 ), and a third metal plate ( 13 ) connecting to the third conductive post ( 33 ).

Abstract translation: 电路板（10）包括用于电连接到半导体器件（50）的集电极的第一导电柱（31），连接到第一导电柱（31）的第一金属板（11），第二导电柱 （32），用于电连接到所述半导体器件（50）的栅极（52）;连接到所述第二导电柱（32）的第二金属板（12），用于电连接到所述第二导电柱 半导体器件（50）的发射极（53）和连接到第三导电柱（33）的第三金属板（13）。

公开(公告)号：EP1895821A4

公开(公告)日：2010-11-17

申请号：EP06833716

申请日：2006-11-30

Applicant: IBIDEN CO LTD

Inventor： KARIYA TAKASHI ,  FURUTANI TOSHIKI ,  KAWANISHI TAKESHI

IPC: H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/28 ,  H05K3/341 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0397 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

公开(公告)号：EP1581033B1

公开(公告)日：2010-11-17

申请号：EP05101893.5

申请日：2005-03-11

Applicant: DAV

Inventor： Vanhell, Stephane ,  Ducruet, Rene M.

IPC: H05K3/30 ,  H01R33/72

CPC classification number: H05K3/301 ,  H01R12/7076 ,  H05K3/202 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/1059

公开(公告)号：EP1382232B1

公开(公告)日：2009-06-17

申请号：EP02766831.8

申请日：2002-04-26

Applicant: Hewlett-Packard Company

Inventor： PAN, Alfred, I-Tsung

IPC: H05K3/28 ,  H01L21/56 ,  B41J2/16

CPC classification number: B41J2/16 ,  B41J2/14072 ,  B41J2/1643 ,  H05K1/184 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/10674 ,  H05K2203/135 ,  Y10T29/49083 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49401

Abstract: A method, and structure formed thereof, for processing an exposed conductive connection between an thermal inkjet print head device (12) and a flexible tape circuit (15) connectable to control signals for driving the inkjet device. According to the method of processing, the exposed conductive connection (14, 16) is electrophoretically plated with a polymer (19) to protect it against corrosive damage by coupling the exposed conductive connection (14, 16) to a first voltage potential and immersing it into an electrophoretic polymer solution in contact with an electrode at a second voltage potential thereby establishing a current between the electrode and the exposed connection (14, 16) such that the exposed connection (14, 16) is coated with a thin film of polymer (19) of uniform thickness.

公开(公告)号：EP2009967A2

公开(公告)日：2008-12-31

申请号：EP08158496.3

申请日：2008-06-18

Applicant: Kabushiki Kaisha T AN T

Inventor： Soga, Hisashi ,  Kawagoe, Junji

IPC: H05K1/02 ,  H05K3/20

CPC classification number: H05K3/202 ,  H05K1/184 ,  H05K3/103 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10113 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/1059 ,  H05K2201/2027

Abstract: A wiring board formed with electric circuits is provided, wherein said electric circuits are formed by comprising straight bus bar segments (11-13), each of the straight bus bar segments having contact portions (11a-13a) at opposite ends thereof, said wiring board having means for bringing the respective contact portions into electrical contact.

Abstract translation: 提供了形成有电路的布线板，其中所述电路通过包括直母线段（11-13）形成，每个直母线段在其相对端具有接触部分（11a-13a），所述布线 板具有用于使各个接触部分进行电接触的装置。

公开(公告)号：EP1925192A1

公开(公告)日：2008-05-28

申请号：EP06791940.7

申请日：2006-09-08

Applicant: W.C. Heraeus GmbH

Inventor： DITZEL, Eckhard ,  WALTER, Siegfried ,  GRESCH, Manfred

IPC: H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H01L23/50

CPC classification number: H05K3/0097 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/202 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2203/1545 ,  Y10T156/1049 ,  Y10T428/24008 ,  Y10T428/24281 ,  Y10T428/24289 ,  H01L2924/00

Abstract: The invention relates to a laminated substrate producing method for mounting semiconductor chips, wherein at least respective metal and plastic structure films having respective different recurrent contour are laminated together in such a way that a material strip is obtained and said lamination is followed by perforations or cuttings, the inventive method is characterised by at least one of the following steps: A) the films are structured in such a way that the superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total thickness thereof; B) the films are not laminated through the total thickness of the laminate in partly recurrent areas; and C) the reccurent cross-sections of the reccurent contours are curved from the surface of the laminated strip starting from said laminate.