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公开(公告)号：US09974167B1
公开(公告)日：2018-05-15
申请号：US15801375
申请日：2017-11-02
Applicant: FUJITSU LIMITED
Inventor： Shunji Baba , Noritsugu Ozaki
CPC classification number: H05K1/0296 , H05K1/0393 , H05K2201/05
Abstract: A wiring board includes: a base member having stretchability; and a wiring including a plurality of conductive thread-like members that are sewn in the base member in a meandering manner and do not have stretchability.
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352.发明授权公开(公告)号：US09970617B2
公开(公告)日：2018-05-15
申请号：US15181897
申请日：2016-06-14
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Seung Woo Choi , Ho Sub Kim , Young Do Kim , Cheol Ho Kim
CPC classification number: F21S41/141 , C08J2379/08 , F21S48/115 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K1/09 , H05K3/0014 , H05K3/022 , H05K2201/0154 , H05K2201/0195 , H05K2201/05 , H05K2201/10106 , H05K2201/10113
Abstract: A flexible copper-clad laminate for a vehicle LED lamp is provided and includes a copper-clad layer and a composite layer that are laminated. The composite layer includes a polyimide layer and thermoplastic polyimide layers. An outermost layer of the composite layer is formed as a thermoplastic polyimide layer. A total thickness of the thermoplastic polyimide layers and an entire thickness of the polyimide layer with respect to a total thickness of the composite layer is about 10 to 50% and 50 to 90%, respectively. The total thickness of the thermoplastic polyimide layers and the entire thickness of the polyimide layer with respect to the thickness of the composite layer is about 20 to 40% and 60 to 80%, respectively. A thickness of the copper-clad layer is about 30 to 80 μm, and the total thickness of the composite layer is about 10 to 15 μm.
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公开(公告)号：US09940957B2
公开(公告)日：2018-04-10
申请号：US15223241
申请日：2016-07-29
Applicant: Nitto Denko Corporation
Inventor： Daisuke Yamauchi , Hiroyuki Tanabe
CPC classification number: G11B5/4833 , G11B5/484 , H05K1/056 , H05K1/09 , H05K1/111 , H05K3/244 , H05K3/388 , H05K2201/0341 , H05K2201/0347 , H05K2201/05 , Y02P70/611
Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.
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公开(公告)号：US09936573B2
公开(公告)日：2018-04-03
申请号：US14941887
申请日：2015-11-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Phillip Duane Isaacs , David C. Long
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≤200 μm, as well as a line-to-line spacing width Ws≤200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
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公开(公告)号：US09933890B2
公开(公告)日：2018-04-03
申请号：US15222541
申请日：2016-07-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Soo Kim , Keun Sik Lee
CPC classification number: G06F3/0416 , G06F3/044 , G06F2203/04102 , G06F2203/04103 , G06F2203/04104 , G06F2203/04111 , H05K1/028 , H05K1/0298 , H05K2201/0145 , H05K2201/05 , H05K2201/10128
Abstract: Disclosed are a touch panel and a method for manufacturing the same. A touch panel can include a substrate, a transparent electrode base on the substrate, a first transparent electrode on the transparent electrode base and extending in a first direction, and a second transparent electrode on the transparent electrode base and extending in a second direction. A method of manufacturing a touch panel can include preparing a substrate and a transparent electrode base, forming a transparent electrode over the transparent electrode base, and forming an electrode material over the transparent electrode base.
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Patent Agency Ranking
公开(公告)号：US09924591B2
公开(公告)日：2018-03-20
申请号：US14865632
申请日：2015-09-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Phillip Duane Isaacs , David C. Long
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
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公开(公告)号：US20180070444A1
公开(公告)日：2018-03-08
申请号：US15800497
申请日：2017-11-01
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , James A. BUSBY , Phillip Duane ISAACS , David C. LONG
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
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公开(公告)号：US09907171B2
公开(公告)日：2018-02-27
申请号：US14905728
申请日：2014-07-24
Applicant: LG Display Co., Ltd.
Inventor： Ducksu Oh , Sung Soo Park , Minsoo Kang
CPC classification number: H05K1/142 , H01L51/5203 , H01L2251/5338 , H05K1/028 , H05K1/111 , H05K1/117 , H05K1/118 , H05K1/14 , H05K1/141 , H05K1/147 , H05K3/361 , H05K3/363 , H05K3/403 , H05K2201/0397 , H05K2201/05 , H05K2201/097 , H05K2201/10128 , H05K2201/10681
Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.
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公开(公告)号：US20180046315A1
公开(公告)日：2018-02-15
申请号：US15792383
申请日：2017-10-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Soo Kim , Keun Sik Lee
CPC classification number: G06F3/0416 , G06F3/044 , G06F2203/04102 , G06F2203/04103 , G06F2203/04104 , G06F2203/04111 , H05K1/028 , H05K1/0298 , H05K2201/0145 , H05K2201/05 , H05K2201/10128
Abstract: Disclosed are a touch panel and a method for manufacturing the same. A touch panel can include a substrate, a transparent electrode base on the substrate, a first transparent electrode on the transparent electrode base and extending in a first direction, and a second transparent electrode on the transparent electrode base and extending in a second direction. A method of manufacturing a touch panel can include preparing a substrate and a transparent electrode base, forming a transparent electrode over the transparent electrode base, and forming an electrode material over the transparent electrode base.
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360.发明申请公开(公告)号：US20180042116A1
公开(公告)日：2018-02-08
申请号：US15365664
申请日：2016-11-30
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Yen-Po Huang , Tsung-Hsien Tsai
IPC: H05K3/00 , C03C17/34 , H01L23/498 , H05K1/03 , H01L21/683
CPC classification number: H05K3/007 , C03C17/30 , C03C17/32 , C03C17/3405 , C03C2218/11 , C03C2218/32 , C03C2218/355 , C08G73/1039 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08L79/08 , C08L2203/20 , C09D179/08 , H01L21/6835 , H01L23/4985 , H01L23/49894 , H01L2221/68345 , H01L2221/68386 , H05K1/0393 , H05K3/4682 , H05K3/4691 , H05K2201/0154 , H05K2201/05 , H05K2203/0152 , H05K2203/016 , H05K2203/0264 , C08L27/18 , C08K5/544
Abstract: A method of fabricating a flexible substrate assembly includes forming a first polyimide layer on a rigid support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution, an adhesion promoting agent and a release agent for achieving different adhesion strength at two opposite sides of the first polyimide layer, and forming a flexible second polyimide layer on the first polyimide layer, the second polyimide layer being adhered in contact with the first polyimide layer, and a peeling strength between the first and second polyimide layers being less than a peeling strength between the first polyimide layer and the support base so that the second polyimide layer is peelable from the first polyimide layer while the first polyimide layer remains adhered in contact with the support base.
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