Abstract:
본 발명의 실시 예에 따른 불휘발성 메모리 장치를 제어하는 메모리 컨트롤러의 동작 방법은 외부 장치로부터 커맨드를 수신하는 단계; 불휘발성 메모리 장치가 온도 제어 모드인지 판별하는 단계; 및 판별 결과에 따라 불휘발성 메모리 장치가 온도 제어 모드인 경우, 수신된 커맨드의 타임 아웃 시간 및 예상 처리 시간을 기반으로 수신된 커맨드를 불휘발성 메모리 장치로 전송하는 단계를 포함하고, 온도 제어 모드는 불휘발성 메모리 장치가 유휴 상태로 동작하는 모드이다.
Abstract:
The present invention relates to a mobile robot and a method for localizing and mapping the position of a mobile robot. The present invention is to highly enhance a position error in localizing and mapping the position of a mobile robot by correcting the cumulative error of relative coordinates using multiple vector field sensors. The method for localizing and mapping the position of a mobile robot according to the present invention comprises obtaining the relative coordinates within a moving space using an encoder; obtaining an absolute coordinate within the moving space through at least one among the strength and direction of a signal using the multiple vector field sensors; defining multiple arbitrary cells on the surface of the moving space and defining the multiple cells having multiple nodes at predetermined positions; and performing the localization and mapping within the moving space while updating the position information of the multiple nodes of one or more cells using the relative coordinates obtained by the encoder and the multiple vector field sensors, and determining the position information of a previous node while localizing the position information of a new node during movement.
Abstract:
The present invention relates to a robot cleaner capable of moving in multiple directions and capable of improving a cleaning effect by increasing a frictional force between a pad and a floor. The robot cleaner according to an embodiment of the present invention comprises the following: a case installed outside a main body and forming the appearance of the robot cleaner; and the main body with at least two driving units. These units include the following: a motor transmitting a rotational force; a first sub frame connected to the motor and rotated when receiving the rotational force from the motor; and a rotary plate assembly mounted at the first sub frame, having a bottom surface which is inclined to the floor when the first sub frame is rotated, and which is capable of being rotated clockwise or counterclockwise when receiving the rotational force from the motor; and the pad installed on the bottom surface of the rotary plate assembly which touches the floor, wherein the bottom surface of the rotary plate assembly is installed to be inclined to the floor so that the uneven frictional force is generated between the bottom surface of the pad and the floor, hence the robot cleaner can be driven in a certain direction by the uneven frictional force.
Abstract:
Disclosed are a method for controlling the operation timing of memory devices comprising a storage device and a memory system using the same. The method for controlling memory operation timing comprises the steps of: controlling the operation timing to limit the number of the memory devices which simultaneously perform operations according to a host request within a reference value; and issuing the operation based on the controlled operation timing and transmitting the operation to the memory devices. [Reference numerals] (AA) Start;(BB) End;(S101) Controlling the operation timing based on the number of the memory devices which simultaneously perform operations;(S102) Issuing the operation
Abstract:
PURPOSE: A chemical mechanical polishing apparatus for manufacturing a semiconductor device is provided to increase the polishing uniformity in the central part and the edge parts of a wafer surface. CONSTITUTION: A spin chuck(1) rotates a wafer(W) around a rotary shaft(2). A polisher(5) comprises a polishing pad(4). The polisher moves along with a wafer surface by a polishing arm. A polisher support device(100) levels the polisher. The polisher support device includes a support head(10) and an elevating device(20).
Abstract:
PURPOSE: A printed circuit board and a semiconductor package having a bond finger is provided to enhance the arrangement efficiency of a first bond finger and a second bond finger by increasing a distance between electrical interconnections due to level difference of printed circuit board. CONSTITUTION: A printed circuit board(110) comprises a first bond finger(113) and a second bond finger(114). The first bond fingers are formed in the bond finger domain. The second bond fingers are formed on a level different from a level where the first bond fingers are. A semiconductor chip comprises the first and second chip pads which are adjacently formed. Electric connections are formed between the first, second bond fingers, and semiconductor chip.