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公开(公告)号：KR1020090058169A
公开(公告)日：2009-06-09
申请号：KR1020070124835
申请日：2007-12-04
Applicant: 삼성전자주식회사
Abstract: A manufacturing method of white light emitting diode is provided to improve the color uniformity and color reproducibility by separately making the fluorescent film which uniformly disperses the fluorescent substance and adheres to the encapsulating material molded on the light-emitting device chip. An electrode pattern(210) is prepared in the bottom surface of the groove formed in the upper plate(240). A lower plate(220) has an electrode pattern. The bottom surface of the groove portion has the LED chip(230). A terminal and an electrode pattern of the LED chip are electrically connected through a wire. The LED chip is fixed to the bonding method such as the epoxy and eutectic solder on the lower plate.
Abstract translation: 提供白色发光二极管的制造方法，通过分别制造均匀地分散荧光物质并附着在模制在发光元件芯片上的封装材料的荧光膜来提高色彩均匀性和色彩再现性。 在形成在上板（240）中的槽的底面中制备电极图案（210）。 下板（220）具有电极图案。 凹槽部分的底表面具有LED芯片（230）。 LED芯片的端子和电极图案通过导线电连接。 LED芯片固定在下板上的环氧树脂和共晶焊料等接合方法。
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公开(公告)号：KR101757230B1
公开(公告)日：2017-07-13
申请号：KR1020100005363
申请日：2010-01-20
Applicant: 삼성전자주식회사
Inventor： 박일우
IPC: G06Q50/10
CPC classification number: H04L65/60 , H04L12/2809 , H04L12/281 , H04L12/2816 , H04L65/4076 , H04L65/604 , H04L65/605 , H04L67/42 , H04L2012/2849
Abstract: 본발명은컨텐츠를제공하는컨텐츠서버와상기컨텐츠서버로부터제공된상기컨텐츠를재생하기위한복수의클라이언트장치를포함하는멀티미디어데이터제공시스템에서, 제1 장치가재생중인컨텐츠를제2 장치에서이어서재생하기위한컨텐츠재생방법에있어서, 상기제1 장치가상기컨텐츠서버로부터스트리밍된컨텐츠를재생하는과정과, 상기제1 장치가자신이재생중인컨텐츠를상기제2 장치에서이어서재생하기위해, 상기제1 장치가상기제1 장치의아이디를포함하는제1 요청메시지를근거리통신을통해상기제2 장치로전송하는과정-상기제1 장치의아이디는상기제1 장치의 IP(internet protocol) 주소, 장치명, 재생능력에기반하여생성됨-을포함할수 있다.
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公开(公告)号：KR1020170059048A
公开(公告)日：2017-05-30
申请号：KR1020150162535
申请日：2015-11-19
Applicant: 삼성전자주식회사
IPC: H01L23/495 , H01L23/00 , H01L23/485 , H01L23/58 , H01L29/40
CPC classification number: H01L33/62 , F21V19/006 , F21V23/02 , F21V29/77 , G02B6/0031 , G02B6/0073 , G02B6/0083 , H01L24/45 , H01L25/0753 , H01L33/06 , H01L33/145 , H01L33/32 , H01L33/42 , H01L33/46 , H01L33/502 , H01L33/54 , H01L2224/45139 , H01L2224/45565 , H01L2224/45644 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/12041 , H01L2924/181 , H05B37/0272 , H01L2924/00014
Abstract: 본발명의실시예에따른반도체패키지용본딩와이어는, 은을포함하는코어부, 2nm 내지 23nm 두께로상기코어부를둘러싸며, 금을포함하는쉘층을포함한다. 본발명의실시예에따른반도체패키지는, 제1 및제2 전극구조를가지는패키지본체, 상기제1 및제2 전극구조와각각전기적으로연결되는제1 및제2 전극부를포함하는반도체소자, 및상기제1 및제2 전극구조중 적어도하나와상기반도체소자를연결하는본딩와이어를포함한다.
Abstract translation: 根据本发明的一个实施例的半导体封装的接合线包括含有银的芯部分，所述的部分芯由23nm厚度包围2nm至所述，并且包括外壳层包括金。 根据本发明，包括具有封装体，第一mitje第二电极结构和所述第一mitje第二电极部各自电连接到第一mitje第二电极结构的半导体器件的实施例的半导体封装件，并且所述第一 以及将第一和第二电极结构中的至少一个连接到半导体元件的键合线。
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公开(公告)号：KR1020160084562A
公开(公告)日：2016-07-14
申请号：KR1020150000803
申请日：2015-01-05
Applicant: 삼성전자주식회사
CPC classification number: H01L33/0079 , H01L33/20 , H01L33/50 , H01L2224/11 , H01L2924/10155 , H01L33/60 , H01L33/62
Abstract: 본발명의실시예에따른반도체발광소자패키지의제조방법은, 성장기판상에순차적으로적층된제1 도전형반도체층, 활성층및 제2 도전형반도체층을포함하는발광구조물을형성하는단계, 상기제2 도전형반도체층이형성된상기발광구조물의제1 면상에반사층을형성하는단계, 상기발광구조물의상기제1 면상에상기제1 및제2 도전형반도체층각각과전기적으로연결되며상기반사층으로부터돌출되는범프들을형성하는단계, 상기발광구조물의상기제1 면상에지지기판을부착하는단계, 상기성장기판을제거하는단계, 상기성장기판이제거된상기발광구조물의제2 면상에파장변환층이코팅된투광성기판을부착하는단계, 및상기지지기판을제거하는단계를포함하고, 상기반사층은상기발광구조물의측면의적어도일부및 상기범프들의측면의적어도일부를덮는다.
Abstract translation: 根据本发明的实施例，一种制造半导体发光器件封装的方法包括以下步骤：形成包括第一导电半导体层，有源层和第二导电半导体层的发光结构， 其依次堆叠在生长衬底上; 在其上形成有第二导电半导体层的发光结构的第一表面上形成反射层; 在所述发光结构的第一表面上形成与所述第一导电半导体层和所述第二导电半导体层中的每一个电连接并从所述反射层突出的凸块; 在所述发光结构的所述第一表面上附着支撑基板; 去除生长底物; 在被除去生长基板的发光结构体的第二面上附着涂布有波长转换层的透光性基板; 并移除支撑衬底。 反射层覆盖发光结构的一侧的至少一部分和凸块的至少一部分侧面。
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Patent Agency Ranking
公开(公告)号：KR1020130005323A
公开(公告)日：2013-01-16
申请号：KR1020110066640
申请日：2011-07-06
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/005 , H01L33/0095 , H01L2933/0041
Abstract: PURPOSE: A method for manufacturing a semiconductor light emitting device and a paste coating device used fro the same are provided to improve light uniformity by omitting an alignment process in a light emitting device. CONSTITUTION: An active layer is formed in a light emitting structure(20). A first conductive semiconductor layer and a second conductive semiconductor layer are formed in the light emitting structure. A mask is arranged in the light emitting structure. Paste(30) is coated through an opening part of the mask. The coated paste is planarized using a roller.
Abstract translation: 目的：提供一种用于制造半导体发光器件的方法和使用其的糊状涂覆器件，以通过省略发光器件中的取向处理来提高光均匀性。 构成：在发光结构（20）中形成有源层。 在发光结构中形成第一导电半导体层和第二导电半导体层。 在发光结构中设置掩模。 糊剂（30）通过掩模的开口部分涂覆。 使用辊将涂覆的糊状物平坦化。
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公开(公告)号：KR1020110091209A
公开(公告)日：2011-08-11
申请号：KR1020100010926
申请日：2010-02-05
Applicant: 삼성전자주식회사
Abstract: PURPOSE: Device and method for evaluating optical characteristic of an LED and a method of manufacturing an LED device are provided to reduce color dispersion of an LED device emitting a particular color of light including white and realize desired color coordinates easily and effectively. CONSTITUTION: A device(100) for evaluating optical characteristic of an LED emits white light through an optical converting filter(151) in a process of evaluating light emitting from an LED bare package(50) and measures color coordinates of the emitted white light. The LED bare package is formed by die bonding of an LED chip(10) to a package body(20) and by connecting of a chip to the lead frame(not shown) of the body by wire bonding if necessary. The LED bare package is an intermediate product before phosphor bearing resin(including a bag) is coated. The package body comprises a reflective cup and an LED chip can be mounted in the reflective cup.
Abstract translation: 目的：提供用于评估LED的光学特性的装置和方法以及制造LED装置的方法，以减少发射包括白色的特定颜色的LED的LED装置的色散，并且容易且有效地实现所需的色坐标。 构成：用于评估LED的光学特性的装置（100）在评估来自LED裸封装（50）的发光的过程中通过光转换滤光器（151）发射白光并测量所发射的白光的颜色坐标。 通过LED芯片（10）与封装主体（20）的裸片接合，并且如果需要，通过引线接合将芯片连接到主体的引线框架（未示出）而形成LED裸封装置。 LED裸露包装是在涂覆荧光体轴承树脂（包括袋子）之前的中间产品。 包装体包括反射杯，LED芯片可以安装在反射杯中。
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公开(公告)号：KR1020100058769A
公开(公告)日：2010-06-04
申请号：KR1020080117298
申请日：2008-11-25
Applicant: 삼성전자주식회사
IPC: H01L33/56
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
Abstract: PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to overcome limitation of appearance and design of the light emitting diode package by forming a thin film on the top of the package mold and covering the original color of fluorescent substance. CONSTITUTION: A pair of lead frames(110) is prepared. A package mold(120) comprises a molding material filling space. An LED chip(130) is mounted on the lead frame inside the package mold. A thin film(160) opens and shuts the molding material fill space of the package mold. A molding material(150) is filled in the molding material filling space of the package mold.
Abstract translation: 目的：提供一种发光二极管封装及其制造方法，以通过在封装模具的顶部形成薄膜并覆盖荧光物质的原始颜色来克服对发光二极管封装的外观和设计的限制。 构成：准备一对引线框架（110）。 包装模具（120）包括模制材料填充空间。 LED芯片（130）安装在封装模具内的引线框架上。 薄膜（160）打开并关闭包装模具的成型材料填充空间。 成型材料（150）填充在包装模具的成型材料填充空间中。
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公开(公告)号：KR1020090055961A
公开(公告)日：2009-06-03
申请号：KR1020070122863
申请日：2007-11-29
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: A light emitting diode package and a method of manufacturing the same are provided to make the color distribution of a phosphor powder while obtaining uniform brightness distribution through a wide operation angle. A reflector(100) is made of a material having a high reflection coefficient, and an electrode(110) received inside the reflector and a part of the electrode is exposed to the outside through the reflector. An LED chip(120) is mounted on the surface of the reflector positioned between an exposed part of the electrode and the electrode. The LED chip and electrode are connected through an electrode connecting unit(130) which is received in the reflector. An encapsulant including a phosphor powder in order to cover the LED chip on the reflector is injection-molded.
Abstract translation: 提供一种发光二极管封装及其制造方法，以在通过宽的操作角度获得均匀的亮度分布的同时进行荧光体粉末的颜色分布。 反射器（100）由具有高反射系数的材料制成，并且电极（110）容纳在反射器内部，并且电极的一部分通过反射器暴露于外部。 LED芯片（120）安装在反射器的位于电极的暴露部分和电极之间的表面上。 LED芯片和电极通过接收在反射器中的电极连接单元（130）连接。 包含荧光体粉末以便覆盖反射器上的LED芯片的密封剂被注射成型。
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公开(公告)号：KR101811689B1
公开(公告)日：2017-12-22
申请号：KR1020110066640
申请日：2011-07-06
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/005 , H01L33/0095 , H01L2933/0041
Abstract: 본발명은반도체발광소자제조방법및 이에이용되는페이스트도포장치에관한것으로, 본발명의일 실시형태에따른반도체발광소자제조방법은, 제1 도전형반도체층, 활성층및 제2 도전형반도체층을포함하는발광구조물을마련하는단계와, 상기발광구조물상에상기발광구조물의일부를노출시키는개구부를갖는마스크를배치하는단계와, 가압수단을이용하여상기마스크의상기개구부를통해상기발광구조물상에파장변환물질을포함하는페이스트를도포하는단계와, 롤러를이용하여상기도포된페이스트를평탄화하는단계를포함한다.
Abstract translation: 本发明涉及制造半导体发光器件的方法和用于此的半导体发光器件以及制造半导体发光器件的方法，其中制造半导体发光器件的方法是制造半导体发光器件的方法， 该方法包括以下步骤：在衬底上提供包括发光结构的发光结构;布置具有用于暴露发光结构的一部分的开口的掩模; 应用含有波长转换材料的糊剂，并使用辊将所施加的糊剂平面化。
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