-
公开(公告)号：KR1020120009872A
公开(公告)日：2012-02-02
申请号：KR1020100070834
申请日：2010-07-22
Applicant: 삼성전자주식회사
CPC classification number: H05K3/0058 , B32B37/1207 , B32B37/185 , B32B38/145 , B32B2037/1223 , B32B2038/0092 , B32B2309/105 , B32B2457/14 , H05K2201/0999 , H05K2201/10098 , H05K5/0247 , H01G9/2095 , H04B1/088 , H05K3/281 , Y10S526/935
Abstract: PURPOSE: A case structure of electronic products which include a film type electronic circuit and a manufacturing method thereof are provided to utilize space by directly arranging an antenna in a terminal case. CONSTITUTION: A case structure(1) includes a case(10) and a film type electronic circuit which is attached on the case. The film type electronic circuit is attached on the inner surface of the case. The case is comprised of a material which is able to be attached to the film type electronic circuit. The film type electronic circuit comprises all electronic circuits which is able to be formed into a film shape. The film type electronic circuit comprises an electronic circuit layer(22), a first film(21), and a second film(23) which protects the first film. The electronic circuit layer is able to be formed into an antenna of a mobile communication terminal. The first film insulates the electronic circuit layer from the outside.
Abstract translation: 目的：提供包括薄膜式电子电路及其制造方法的电子产品的壳体结构，以通过在端子壳体中直接布置天线来利用空间。 构成：壳体结构（1）包括壳体（10）和附接在壳体上的膜型电子电路。 胶片式电子电路安装在外壳的内表面上。 该壳体由能够附着于薄膜式电子电路的材料构成。 薄膜式电子电路包括能够形成为薄膜形状的所有电子电路。 膜型电子电路包括保护第一膜的电子电路层（22），第一膜（21）和第二膜（23）。 电子电路层能够形成为移动通信终端的天线。 第一个膜将电子电路层与外部绝缘。
-
公开(公告)号：KR1020110123350A
公开(公告)日：2011-11-15
申请号：KR1020100042787
申请日：2010-05-07
Applicant: 삼성전자주식회사
CPC classification number: H05K1/0283 , H01B7/06 , H05K1/0218 , H05K1/0219 , H05K2201/09263 , H05K2201/09672 , H05K2201/09681
Abstract: PURPOSE: A multi-layer elastic wiring is provided to transmit an electrical signal at a high speed by minimizing electro-magnetic interference. CONSTITUTION: A flexible film(1) is prepared with an upper film and a lower film. A conductive line, which is arranged in the upper layer, is used as a signal wire(2). The conductive line, which is arranged in a lower layer, is used as a ground wire(3). The signal wire and the ground wire become freely flexible with outer stress by being arranged as a zig-zag shape.
Abstract translation: 目的：提供多层弹性布线，通过最小化电磁干扰来高速传输电信号。 构成：用上膜和下膜制备柔性膜（1）。 布置在上层的导线用作信号线（2）。 布置在下层中的导线用作接地线（3）。 信号线和接地线通过布置成Z字形而变得具有外应力自由柔性。
-
公开(公告)号：KR1020110052931A
公开(公告)日：2011-05-19
申请号：KR1020090109682
申请日：2009-11-13
Applicant: 삼성전자주식회사
CPC classification number: H01H19/585 , G03B3/10 , G03B5/00 , G03B2217/002 , H03K17/965 , H03K2217/94063 , H03K2217/94068 , G02B7/04 , H04N5/232
Abstract: PURPOSE: A zoom switch assembly, image photographing apparatus with the same, and zoom lens control method are provided to detect the location of a rotation member or a knob by a conduction method. CONSTITUTION: A zoom switch assembly(1) for an image photographing apparatus comprises a fixing member(2), a rotation member(3), a conduction unit(41), and a location detection pattern. The fixing member comprises a flat unit(11). The rotation member can rotate on the fixing member. The conduction unit is installed in the rotation member. The conduction unit rotates if the rotation member rotates. The location detection pattern is selectively conductive according to the rotation angle of the conduction unit.
Abstract translation: 目的：提供一种变焦开关组件，具有相机的摄像装置和变焦镜头控制方法，以通过传导方法检测旋转部件或旋钮的位置。 构成：用于图像拍摄装置的变焦开关组件（1）包括固定构件（2），旋转构件（3），导电单元（41）和位置检测图案。 固定构件包括平坦单元（11）。 旋转构件可以在固定构件上旋转。 导通单元安装在旋转构件中。 如果旋转构件旋转，则传导单元旋转。 位置检测图案根据导电单元的旋转角度选择性地导电。
-
公开(公告)号：KR1020110012280A
公开(公告)日：2011-02-09
申请号：KR1020090069938
申请日：2009-07-30
Applicant: 삼성전자주식회사
IPC: H01B13/008 , H01B7/04
CPC classification number: H01B13/008 , H01B7/0838 , H05K1/0283 , H05K3/103 , H05K3/281 , H05K2201/0133 , H05K2201/09263 , H05K2201/10287 , H05K2203/1545
Abstract: PURPOSE: A flexible cable manufacturing apparatus, a manufacturing method thereof, and an electronic device using the same are provided to improve the productivity of a flexible cable by manufacturing a flexible cable by a simple operation of reciprocally moving the conductive line. CONSTITUTION: A conductive line supplying unit(30) supplies at least one conductive line(10). An alignment unit(40) aligns the conductive line supplied from the conductive line supplying unit. The alignment unit is arranged between the flexible films(20) in zigzag shape. A film supplying unit supplies the flexible film to surround the conductive line supplied from the aligning unit.
Abstract translation: 目的：提供一种柔性电缆制造装置及其制造方法以及使用其的电子装置，通过使导电线的往复移动的简单操作来制造柔性电缆来提高柔性电缆的生产率。 构成：导线供给单元（30）提供至少一根导线（10）。 对准单元（40）对准从导线供给单元提供的导线。 对准单元以曲折形状布置在柔性膜（20）之间。 胶片供给单元提供柔性膜以包围从对准单元提供的导线。
-
公开(公告)号：KR1020090024946A
公开(公告)日：2009-03-10
申请号：KR1020070089940
申请日：2007-09-05
Applicant: 삼성전자주식회사
CPC classification number: H05K1/0284 , H04M1/0249 , H05K3/185 , H05K2201/0999 , H05K2203/107
Abstract: A method for setting up the part within the appearance case of the electronic device is provided to minimize the size of the electronic product. The electronic device(10) using the LDS is comprised of the upper appearance case(11) and the lower appearance case(12). The resin(30) for LDS is attached within the lower appearance case by the double injection and insert injection. The parts of the electronic device are successively mounted in the resin for LDS. The antenna(90), the earphone jack(50), the RXD, the other hardware component etc are equipped In the lower appearance case. The miniaturized printed circuit board(60) is mounted and connected to upper and lower appearance case.
Abstract translation: 提供了一种用于在电子设备的外观情况下设置部件的方法，以最小化电子产品的尺寸。 使用LDS的电子设备（10）由上部外壳（11）和下部外壳（12）组成。 用于LDS的树脂（30）通过双重注射和插入注入附接在较低外观的情况下。 电子设备的部件依次安装在用于LDS的树脂中。 天线（90），耳机插孔（50），RXD，其他硬件组件等都配备在外观较差的情况下。 小型化印刷电路板（60）安装并连接到上下外壳。
-
Patent Agency Ranking
公开(公告)号：KR1020050010268A
公开(公告)日：2005-01-27
申请号：KR1020030049311
申请日：2003-07-18
Applicant: 삼성전자주식회사
IPC: H01L21/52
CPC classification number: H01L24/81 , H01L21/563 , H01L24/29 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/83104 , H01L2224/83191 , H01L2224/83856 , H01L2224/92125 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/1579 , H01L2924/00 , H01L2924/00014 , H01L2924/0665
Abstract: PURPOSE: A surface mounting method of a semiconductor chip is provided to simplify mounting processes without packing materials necessary to transfer a semi-finished semiconductor chip structure to a predetermined position. CONSTITUTION: A plurality of semiconductor chips are arranged on a semiconductor wafer. A plurality of solder bumps are formed on a backside of the wafer corresponding to conductive contact portions of each semiconductor chip(S1). An under-fill material is coated on the entire backside of the wafer(S2). The under-fill material is partially cured to obtain adhesiveness from the under-fill material(S3). The wafer is cut into a plurality of semiconductor chips and the chips are directly arranged on a PCB(Printed Circuit Board)(S4,S5). The resultant structure is heated at a predetermined temperature range(S6).
Abstract translation: 目的：提供半导体芯片的表面安装方法，以简化安装过程，而不需要将半成品半导体芯片结构传送到预定位置所需的材料。 构成：半导体晶片上布置有多个半导体芯片。 在对应于每个半导体芯片（S1）的导电接触部分的晶片的背面上形成多个焊料凸块。 底部填充材料涂覆在晶片的整个背面（S2）上。 底部填充材料被部分固化以获得来自底部填充材料的粘合性（S3）。 将晶片切割成多个半导体芯片，并将芯片直接布置在PCB（印刷电路板）（S4，S5）上。 所得结构在预定温度范围内被加热（S6）。
-
-
公开(公告)号：KR101772490B1
公开(公告)日：2017-08-30
申请号：KR1020110098254
申请日：2011-09-28
Applicant: 삼성전자주식회사
CPC classification number: H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012
Abstract: 본발명의일 측면은웨이퍼자체를인쇄회로기판으로사용하여전기부품을웨이퍼레벨로실장할수 있도록한 인쇄회로기판어셈블리를개시한다. 인쇄회로기판어셈블리는복수의전자부품과, 복수의전자부품이실장되는인쇄회로기판과, 인쇄회로기판전체를덮는보호체와, 일단이상기보호체의외부로노출되어인쇄회로기판이보호체외부의서브기판과전기적으로연결될수 있도록구성된연결유닛을포함하고, 인쇄회로기판은웨이퍼로형성되는웨이퍼인쇄회로기판을포함하는것을특징으로한다.
-
公开(公告)号：KR1020170048043A
公开(公告)日：2017-05-08
申请号：KR1020150148911
申请日：2015-10-26
Applicant: 삼성전자주식회사
Abstract: 본발명은금속케이스를구비한전자기기에관한것으로서, 전자기기는, 적어도한 개의전자회로또는안테나가형성된금속케이스, 상기금속케이스에마련되며상기적어도한 개의전자회로또는안테나에전기적으로연결된금속패드, 상기금속패드의일면에부착된금속시트, 및상기금속시트에분리가능하게접촉되는접속용금속기구물을통해상기금속케이스의적어도한 개의전자회로또는안테나와전기적으로연결되는전자회로기판을포함한다.
Abstract translation: 本发明涉及到电连接到所述至少一个电子电路或天线设置有金属的情况下，电子设备中，有在单个电子电路或天线的金属外壳至少提供了一种电子装置被形成时，金属外壳，金属垫 ，电子电路板通过附着到金属焊盘的一个表面的金属片电连接到金属壳体的至少一个电子电路或天线，以及金属配件，用于与金属片可拆卸地接触 。
-
公开(公告)号：KR1020160073860A
公开(公告)日：2016-06-27
申请号：KR1020140182700
申请日：2014-12-17
Applicant: 삼성전자주식회사
CPC classification number: H01B7/08 , H01B7/04 , H01B7/0807
Abstract: 연성평판케이블및 연성회로기판을상호접합한연성케이블이개시된다. 개시된연성케이블은제1 신호라인을포함하는연성평판케이블; 상기제1 신호라인과전기적으로연결되는제2 신호라인을포함하는연성회로기판; 및상기연성평판케이블및 상기연성회로기판의제1 면과상기연성평판케이블및 상기연성회로기판의제2 면을각각덮는제1 및제2 보호필름부;를포함하며, 상기연성회로기판중 일단부가커넥터부로이루어지며, 상기커넥터부에속한제2 신호라인은일면이노출되고, 타면은상기제1 또는제2 보호필름부로덮인다.
Abstract translation: 公开了通过将柔性平板电缆与柔性电路基板互连而获得的柔性电缆。 所公开的柔性电缆包括：柔性平板电缆，包括第一信号线; 柔性电路基板，包括与第一信号线电连接的第二信号线; 以及第一和第二保护膜单元，用于各自覆盖柔性平板电缆和柔性电路基板的第一表面，以及柔性平板电缆和柔性电路基板的第二表面。 柔性电路基板的一端由连接器单元组成，其中包括在连接器单元中的第二信号线具有一个表面露出，另一侧被第一或第二保护膜单元覆盖。
-
-
-
-
-
-
-
-
-
Search Results
47
records
(took 0.021 seconds)
