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公开(公告)号:KR1019970052627A
公开(公告)日:1997-07-29
申请号:KR1019950047177
申请日:1995-12-06
Applicant: 삼성전자주식회사
IPC: H01L21/304
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公开(公告)号:KR1020060032001A
公开(公告)日:2006-04-14
申请号:KR1020040081002
申请日:2004-10-11
Applicant: 삼성전자주식회사
IPC: H01L21/304
CPC classification number: H01L21/67028 , B08B3/12
Abstract: 본 발명은 웨이퍼 클리닝 시스템에 관한 것으로, 구동장치를 구비한 진공척과; 상기 진공척에 척킹된 웨이퍼를 향해 이산화탄소를 분사하는 이산화탄소건과; 상기 이산화탄소건으로 이산화탄소를 제공하는 이산화탄소 응축기와; 상기 이산화탄소건에 의해 분사된 이산화탄소에 의해 웨이퍼에서 탈락되는 파티클을 외부로 배출시키는 배출기와; 상기 진공척에 척킹된 웨이퍼상의 파티클을 관찰하는 카메라와; 상기 카메라에 의해 관찰된 파티클의 사이즈를 판별하여 파티클의 스캔 속도를 조절하는 비전시스템을 포함하는 것을 특징으로 한다. 이에 의하면, 이산화탄소건, 비전시스템, 배출기, 웨이퍼 틸트 장치를 이용하여 임플란트 공정을 비롯한 반도체 제조 공정의 웨이퍼 손상으로 인한 실리콘 오염원을 효과적으로 제거할 수 있게 된다.
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公开(公告)号:KR1020040031386A
公开(公告)日:2004-04-13
申请号:KR1020020060810
申请日:2002-10-05
Applicant: 삼성전자주식회사
IPC: H01L21/205
Abstract: PURPOSE: An apparatus for forming a film on a semiconductor substrate is provided to be capable of preventing air from flowing into a chamber through an exposed groove of a susceptor. CONSTITUTION: An apparatus is provided with a chamber(200), a plurality of heaters(204a,204b) installed in the chamber for heating a substrate, and a susceptor(202) installed on the heater for supporting the substrate. At this time, the susceptor has a groove at its lateral portion. The apparatus further includes a protecting line(238) prolonged from the groove to the outside, a thermocouple(230), and an encapsulating part(240) for preventing the inflow of air. Preferably, the encapsulating part is formed between a sheath and the protecting line. Preferably, the encapsulating part is made of Ag or Pb.
Abstract translation: 目的:提供一种用于在半导体基板上形成膜的装置,以能够防止空气通过基座的暴露槽流入室。 构成:装置设置有室(200),安装在用于加热基板的室中的多个加热器(204a,204b)和安装在加热器上用于支撑基板的基座(202)。 此时,基座在其侧部具有凹槽。 该装置还包括从槽延伸到外部的保护线(238),热电偶(230)和用于防止空气流入的封装部分(240)。 优选地,封装部分形成在护套和保护线之间。 优选地,封装部分由Ag或Pb制成。
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公开(公告)号:KR100395989B1
公开(公告)日:2003-11-28
申请号:KR1019950047177
申请日:1995-12-06
Applicant: 삼성전자주식회사
IPC: H01L21/304
Abstract: PURPOSE: A shower apparatus of semiconductor equipment is provided to be capable of conveniently showering without a foot or handle pedal. CONSTITUTION: A shower apparatus of a semiconductor equipment includes an eye shower part(25) capable of washing eye portion using fluid and a body shower part(23) capable of washing the whole body as one piece. A plurality of proximity sensors(27,28) are installed at the eye shower part and the body shower part for detecting a user in position. A plurality of automatic switching valves(35,36) are installed at each fluid supply line(21) for controlling the fluid according to a detection signal of the proximity sensors. Preferably, a passive switching valves(33) is further installed at each fluid supply line. Preferably, the shower apparatus further includes a flexible deionized water gun.
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公开(公告)号:KR1020030082823A
公开(公告)日:2003-10-23
申请号:KR1020020021319
申请日:2002-04-18
Applicant: 삼성전자주식회사
IPC: H01L21/26
CPC classification number: H01J37/3171 , H01J37/3045 , H01J2237/30472
Abstract: PURPOSE: A method for measuring an angle of inclination of an ion beam is provided to precisely control the quantity of ions implanted into a wafer by efficiently preventing a channeling effect and a shadow effect in an ion implantation process and by accurately measuring the quantity of ions included in the ion beam. CONSTITUTION: The ion beam(12) supplied from an ion supply source(10) is received. The variation of ion current of the ion beam is measured while varying the angle of the received ion beam. The slope angle of the ion beam is calculated from the variation of the ion current.
Abstract translation: 目的:提供一种用于测量离子束倾斜角的方法,通过有效地防止离子注入工艺中的沟道效应和阴影效应,并通过精确测量离子量来精确控制植入晶片的离子量 包括在离子束中。 构成:接收从离子供给源(10)供给的离子束(12)。 在改变接收离子束的角度的同时测量离子束的离子电流的变化。 根据离子电流的变化计算离子束的倾斜角。
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36.
公开(公告)号:KR1020030044199A
公开(公告)日:2003-06-09
申请号:KR1020010074866
申请日:2001-11-29
Applicant: 삼성전자주식회사
IPC: H01L21/205
Abstract: PURPOSE: Radio frequency(RF) applying equipment for fabricating a semiconductor device is provided to reduce process defects caused by particles by eliminating the particles in a shower head of a process chamber and the particles generated in a portion adjacent to a process plasma formation space. CONSTITUTION: The process chamber(1) is isolated from the outer space by using a wall(11). A gas supply apparatus supplies gas to the inside of the process chamber. A wafer is placed on a susceptor(13) installed in the wall. An electrode is installed in a position over the susceptor so that gas plasma is formed between the susceptor and the electrode, connected to an outer RF power source. A remote plasma supplying apparatus is installed to supply cleaning gas plasma to a portion over the plasma formation space in the process chamber.
Abstract translation: 目的:提供用于制造半导体器件的射频(RF)施加设备,以通过消除处理室的淋浴头中的颗粒和在与处理等离子体形成空间相邻的部分中产生的颗粒来减少由颗粒引起的工艺缺陷。 构成:处理室(1)通过使用墙壁(11)与外部空间隔离。 气体供给装置向处理室的内部供给气体。 将晶片放置在安装在墙壁上的基座(13)上。 将电极安装在基座上方的位置,使得在基座和电极之间形成气体等离子体,连接到外部RF电源。 安装远程等离子体供给装置,以将处理室中的等离子体形成空间上的部分提供清洁气体等离子体。
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公开(公告)号:KR1020020043863A
公开(公告)日:2002-06-12
申请号:KR1020000073012
申请日:2000-12-04
Applicant: 삼성전자주식회사
IPC: H01L21/66
CPC classification number: G01R15/241
Abstract: PURPOSE: An apparatus for monitoring a parameter of a high voltage chamber of a semiconductor wafer process system is provided to prevent a measuring apparatus from being damaged by a high potential difference between the high voltage chamber and the measuring apparatus in measuring the parameter of the high voltage chamber, by monitoring the parameter in real time. CONSTITUTION: An electric-to-optic converting circuit(150) converts an electrical signal generated from the high voltage chamber(110) to an optic signal. An optic-to-electric converting circuit(250) converts the optic signal transmitted from the electric-to-optic converting circuit to an electric signal. The measuring apparatus(300) measures the signal converted by the optic-to-electric converting circuit.
Abstract translation: 目的:提供一种用于监测半导体晶片处理系统的高压室参数的装置,以防止测量装置在高电压室和测量装置之间的高电位差中被测量高参数 电压室,通过实时监控参数。 构成:电 - 光转换电路(150)将从高电压室(110)产生的电信号转换为光信号。 光电转换电路(250)将从电光转换电路发送的光信号转换为电信号。 测量装置(300)测量由光电转换电路转换的信号。
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公开(公告)号:KR1020010010201A
公开(公告)日:2001-02-05
申请号:KR1019990028944
申请日:1999-07-16
Applicant: 삼성전자주식회사
IPC: H01L21/304
Abstract: PURPOSE: A wafer polishing device and a wafer polishing method are provided to simultaneously correct D/F value applied on each carrier of a multi-head part in CMP process, and corrects D/F value applied on each carrier of a multi-hear part by in-situ method. CONSTITUTION: A wafer polishing device includes a pad, a multi-head, cylinders, load-cells, and a display part. The pad polishes a wafer. The multi-head includes many carriers corresponding to one waver, and holds the wafer. The cylinders are arranged on the multi-head, applies a pressure on each carrier. The load-cells are arranged between the cylinder and the multi-head, and measure a pressure applied on a carrier from each cylinder. The display part changes a pressure value measured in each load cell to a current value, and displays each current signal at the same time. The wafer polishing device regulates a pressure value applied on a carrier from each cylinder, makes the current signals to be identical, and thus a vertical pressure about each carrier of the multi-head can be corrected.
Abstract translation: 目的:提供晶片抛光装置和晶片抛光方法,以在CMP工艺中同时校正施加在多头部件的每个载体上的D / F值,并且校正施加在多听筒部件的每个载体上的D / F值 通过原位法。 构成:晶片抛光装置包括焊盘,多头,气缸,负载电池和显示部件。 垫抛光晶片。 多头包括对应于一个摇摆的许多载体,并且保持晶片。 气缸布置在多头上,对每个载体施加压力。 负载单元布置在气缸和多头之间,并且测量从每个气缸施加在载体上的压力。 显示部将各测力传感器中测定的压力值变更为当前值,同时显示各电流信号。 晶片抛光装置调节从每个气缸施加在载体上的压力值,使得电流信号相同,从而可以校正围绕多头的每个载体的垂直压力。
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公开(公告)号:KR1020010001958A
公开(公告)日:2001-01-05
申请号:KR1019990021501
申请日:1999-06-10
Applicant: 삼성전자주식회사
IPC: B24B29/00
Abstract: PURPOSE: A method of assembling a CMP(chemical mechanical polishing) carrier is provided to keep height difference of each component regular on assembling a CMP carrier. CONSTITUTION: To assemble a carrier with an apparatus for assembling a CMP carrier, the CMP carrier(300) is fixed to a cylindrical table(301). Then, a measuring unit(302) for measuring height difference is moved in an X or Y-axial direction by a moving unit(304). The measuring unit(302) is put on plural measuring positions on the upper portion of a retainer ring. Therefore, the height difference is measured exactly.
Abstract translation: 目的:提供一种组装CMP(化学机械抛光)载体的方法,以在组装CMP载体时保持每个部件的高度差异。 构成:为了组装具有用于组装CMP载体的装置的载体,CMP载体(300)固定到圆柱形台(301)。 然后,通过移动单元(304)在X或Y轴方向上移动用于测量高度差的测量单元(302)。 测量单元(302)位于保持环的上部的多个测量位置。 因此,精度测量高度差。
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公开(公告)号:KR1020000003260A
公开(公告)日:2000-01-15
申请号:KR1019980024464
申请日:1998-06-26
Applicant: 삼성전자주식회사
IPC: G11B33/02
Abstract: PURPOSE: A cassette box is provided to prevent not only generation of particle by preventing moving of cassette box, but also abrasion by uniting material of protuberance and cassette. CONSTITUTION: The cassette box comprises contact protuberance of semi-spherical type for making contact safe arrival face of the cassette, fit protuberance for inserting into groove. Thereby it is possible to prevent moving of cassette.
Abstract translation: 目的:提供盒式磁带盒,以防止盒式磁带盒的移动,而且通过将突起和磁带盒的材料结合在一起的磨损产生颗粒。 构成:盒式盒包括半球形接触突起,用于使盒的接触安全到达面,用于插入凹槽中的装配突起。 因此,可以防止盒的移动。
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