Abstract:
PURPOSE: A silicon interposer and manufacturing method thereof are provided to form a penetration silicon connector having low loss by forming a thick insulation layer using a lamination process. CONSTITUTION: A silicon wafer(100) is integrated to a thin film passive device like a thin film capacitor(C) and a thin film register. A penetration silicon connector(110) executes the electrode role with the upper surface of the silicon wafer. Insulation layers(120,130) are provided for insulting both surfaces of the penetration silicon connector. An upper connection electrode(140) and a lower connection electrode(150) are individually formed on the lower surface of the penetration silicon connector and the upper surface of the penetration silicon surface in order to electrically connect the upper connection electrode and the lower connection electrode to the penetration silicon connector. The silicon board of a silicon interposer(10) includes the penetration silicon connector and electric wirings for an upper connection electrode and a lower connection electrode.
Abstract:
송수신용 다이플렉서를 이용한 RF 프런트 엔드 모듈이 제공된다. 본 RF 프런트 엔드 모듈은, 포트들 중 일부를 송신신호 입력에 이용하고, 포트들 중 다른 일부를 수신신호 출력에 이용하는 송수신용 신호전달부 및 송수신용 신호전달부를 통해 전달받은 송신신호를 방사하고 수신된 수신신호를 상기 송수신용 신호전달부로 전달하는 안테나를 포함한다. 이에 의해, RF 프런트 엔드 모듈에서 개별로 설계 및 구현되고 있는 송신용 또는 수신용 다이플렉서를 하나의 송수신용 다이플렉서로 구현함에 따라 송신용과 수신용 모두 적용될 수 있어 부품의 활용도가 높아지게 된다.
Abstract:
PURPOSE: A diplexer is provided to reduce a parasitic component by forming the circuit structure of capacitors, in which high pass filters are connected in a delta shape, and an inner pattern structure. CONSTITUTION: A branch node(N1) is connected to an antenna. The branch node receives a signal. A low pass filter(310) receives a received signal through the branch node. A low pass filter passes through a low band signal which is included in the received signal. A high pass filter(320) passes through a high band signal which is included in the received signal and a first, a second, and a third capacitor which are connected in a delta shape.
Abstract:
PURPOSE: A device for testing a wireless module and a system thereof are provided to inspect standardization related to the performance of a wireless module by using the mounted measuring module. CONSTITUTION: A unit for operating a universal spectrum measurement module(121) can mount a universal spectrum measurement module. The universal spectrum measurement module obtains a measurement result by measuring the performance of a wireless module. A unit for operating a high precision spectrum measurement module can mount the high precision spectrum measurement module(122). The high precision spectrum measuring module obtains a measuring result by measuring the performance of the wireless module. A standardized inspection unit(140) inspects whether the performance of the wireless module satisfies the standards based on a measuring result of a measuring module which is mounted in at least one between the unit for operating a universal spectrum measurement module and the unit for operating a high precision spectrum measurement module.
Abstract:
PURPOSE: A semiconductor chip package method is provided to shorten the packaging time of a semiconductor chip by aligning and attaching a chip once through an exposure process using a dicing tape and a photomask. CONSTITUTION: A dicing tape(100) is attached to a wafer and the wafer is diced. The dicing tape is exposed through a photomask(300) including an exposure area to cover a diced chip area. A chip corresponding to the exposure area is attached to an attachment area by contacting the substrate with the dicing tape.
Abstract:
PURPOSE: A meander-folded dipole antenna for an RFID tag is provided to design an antenna by using exact impendence measurement method of a tag strap. CONSTITUTION: An antenna pattern(100) includes a T-matching unit which is formed in a center part and a first conductive trace unit and a second conductive trace unit which is expanded from a T-matching unit. The first conductive trace unit and the second conductive trace unit are formed into the meander-line of serpentine form. A part among a meander-line of the first conductive trace unit is folded into a meander-line which is formed by a meander-line and a space between meander-line. A part among the meander-line of the second conductive trace unit is folded into a space between a meander-line and a meander-line formed by the meander-line. The end part of an antenna pattern is opened.
Abstract:
An ultra wide band antenna including a filter is provided to improve a characteristic through reduction of a length of a wiring for connection between components by integrating the antennal and the filter. An ultra wide band antenna including a filter includes a first dielectric sheet, a second dielectric sheet, and a third dielectric sheet. The first dielectric sheet has a ground pattern(202) on a top surface. The second dielectric sheet is positioned at a lower part of the first dielectric sheet and has patterns(212,214) of a filter(102) and an antenna(100). The third dielectric sheet is positioned at a lower part of the second dielectric sheet and has a ground pattern(222) on a bottom surface.