公开(公告)号：EP1474724A4

公开(公告)日：2008-06-18

申请号：EP02713620

申请日：2002-02-11

Applicant: BREWER SCIENCE INC

Inventor： ENOMOTO TOMOYUKI ,  MIZUSAWA KEN-ICHI ,  ARASE SHIN-YA ,  PULIGADDA RAMA

IPC: G03F7/11 ,  C08F220/22 ,  C08F220/28 ,  C09D133/16 ,  G03F7/038 ,  G03F7/09 ,  G03F7/40 ,  H01L21/027 ,  G03F7/004 ,  C08F18/00 ,  C08F18/16 ,  C08F220/12 ,  G03F7/26

CPC classification number: C09D5/00 ,  C08F220/22 ,  C09D133/16 ,  G03F7/038 ,  G03F7/091

Abstract: Anti-reflective coatings formed from new polymers and having high etch rates are provided. Broadly, the coatings are formed from a polymer binder and a light attenuating compound. The polymer binder has halogen atoms bonded thereto, preferably to functional groups on the polymer binder rather that to the polymer backbone. Preferred polymer binders comprise acrylic polymers while it is preferred that the halogenated functional groups of the polymer binders be dihalogenated, and more preferably trihalogenated, with chlorine, fluorine, or bromine atoms.

公开(公告)号：EP2601676A4

公开(公告)日：2014-08-06

申请号：EP11836791

申请日：2011-08-05

Applicant: BREWER SCIENCE INC

Inventor： PULIGADDA RAMA ,  ZHONG XING-FU ,  FLAIM TONY D ,  MCCUTCHEON JEREMY

IPC: H01L21/20 ,  H01L21/683

CPC classification number: H01L21/6835 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  H01L21/2007 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31935 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

公开(公告)号：EP2362970A4

公开(公告)日：2013-05-29

申请号：EP09824030

申请日：2009-10-22

Applicant: BREWER SCIENCE INC

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: H01L21/302 ,  C08L65/00 ,  C09J123/08 ,  H01L21/304 ,  H01L21/683

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

公开(公告)号：EP1556896A4

公开(公告)日：2007-05-09

申请号：EP03770384

申请日：2003-09-19

Applicant: BREWER SCIENCE INC

Inventor： ENOMOTO TOMOYUKI ,  NAKAYAMA KEISUKE ,  PULIGADDA RAMA

IPC: B32B27/32 ,  G03F20060101 ,  G03F7/004 ,  G03F7/09 ,  H01L21/44 ,  H01L23/29

CPC classification number: G03F7/091 ,  Y10T428/31938

Abstract: The present invention relates to an anti-reflective coating composition characterized by comprising a resin made from triazine compounds having at least two nitrogen atoms substituted a hydroxymethyl group and/or alkoxymehyl group, and a light absorbing compound and/or a light absorbing resin. The present invention offers an anti-reflective coating composition for the anti-reflective coating having high light absorption property of the light used for the lithography process in the preparation of semiconductor device, showing high reflective light preventing effect, being used at thinner film thickness more than before, and having greater dry etching rate in comparison to photoresist layer.

公开(公告)号：EP1284829A4

公开(公告)日：2003-07-02

申请号：EP00961646

申请日：2000-09-06

Applicant: BREWER SCIENCE INC

Inventor： PULIGADDA RAMA ,  HUANG RUNHUI

IPC: B05D1/40 ,  B05D7/24 ,  C08L61/28 ,  C09D5/32 ,  C09D101/00 ,  C09D133/02 ,  C09D167/00 ,  C09D179/06 ,  G02B1/11

CPC classification number: G02B1/111 ,  C08L61/28 ,  Y10T428/31504 ,  Y10T428/31667 ,  Y10T428/31862 ,  Y10T428/31942

Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., -CH2-, -CH2-O-CH2-) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.

公开(公告)号：EP2374145A4

公开(公告)日：2012-11-07

申请号：EP10729436

申请日：2010-01-06

Applicant: BREWER SCIENCE INC

Inventor： LIN QIN ,  PULIGADDA RAMA ,  CLAYPOOL JAMES ,  GUERRERO DOUGLAS J ,  SMITH BRIAN

IPC: H01L21/027 ,  G03F7/20 ,  G03F7/40

CPC classification number: H01L21/0337 ,  C08G77/20 ,  G03F7/40 ,  H01L21/0338 ,  H01L21/3121

Abstract: Novel double- and triple-patterning methods are provided. The methods involve applying a shrinkable composition to a patterned template structure (e.g., a structure having lines) and heating the composition. The shrinkable composition is selected to possess properties that will cause it to shrink during heating, thus forming a conformal layer over the patterned template structure. The layer is then etched to leave behind pre-spacer structures, which comprise the features from the pattern with remnants of the shrinkable composition adjacent the feature sidewalls. The features are removed, leaving behind a doubled pattern. In an alternative embodiment, an extra etch step can be carried out prior to formation of the features on the template structure, thus allowing the pattern to be tripled rather than doubled.

公开(公告)号：EP1567288A4

公开(公告)日：2006-06-07

申请号：EP03787250

申请日：2003-12-02

Applicant: BREWER SCIENCE INC

Inventor： PULIGADDA RAMA ,  LAMB JAMES E ,  FLAIM TONY D

IPC: H01L21/312 ,  B05D3/02 ,  B32B17/10 ,  C08F20/26 ,  C08F20/32 ,  C08F220/28 ,  C08G59/32 ,  C08J7/04 ,  C09D163/00 ,  G03F7/09 ,  G03F7/11 ,  H01L20060101 ,  H01L21/027 ,  H01L21/311 ,  B05D1/00

CPC classification number: G03F7/091 ,  C08F220/28 ,  C08G59/3218 ,  C08J7/047 ,  C08J2425/00 ,  C08J2433/00 ,  C08J2471/00 ,  C09D163/00 ,  H01L21/0276 ,  H01L21/31144 ,  C08L2666/16

Abstract: Anti-reflective or fill composition which inhibits or blocks via or photoresist poisoning, a method of coating a substrate and curing it, and a cured protective layer derived therefrom comprises a polymer prepared from a first set of recurring monomers containing a ring member reacted with a light attenuating compound, and a second set of recurring monomers having an unreacted ring member.