公开(公告)号：BR9911059A

公开(公告)日：2001-02-06

申请号：BR9911059

申请日：1999-05-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  FISCHBACH REINHARD ,  HOUDEAU DETLEF

IPC: A61B5/117 ,  A61B5/1172 ,  G06F3/041 ,  G06K9/00 ,  G06K9/20 ,  G06K9/62 ,  G06K11/06 ,  G06T1/00 ,  G06K11/16

Abstract: The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

公开(公告)号：ES2312310T3

公开(公告)日：2009-03-01

申请号：ES00102073

申请日：2000-02-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PUSCHNER FRANK ,  FRIES MANFRED ,  SEIDL ANNEMARIE ,  FISCHER JURGEN

IPC: G06K19/077

Abstract: Soporte de datos portátil con un cuerpo en forma de tarjeta (1), que presenta una muesca (2) para el alojamiento de un módulo chip (3), asimismo, el módulo chip (3) presenta, al menos, un chip semiconductor (4), asimismo, el módulo chip (3) comprende un soporte de chip (18) unido al cuerpo en forma de tarjeta (1) con el chip semiconductor (4) en una primera cara principal (5) y con una metalización (7) que presenta laminillas de contacto (8) sobre una segunda cara principal (6) del soporte de chip (18), caracterizado porque el soporte de chip (18) presenta muescas (19) a través de las cuales las laminillas de contacto (3) se ponen en contacto y porque el soporte de chip (16) presenta puntos de flexión predefinidos (9) en forma de una metalización calada dispuestos en un área dentro de las aristas laterales (12) de las muescas (2) para el alojamiento del módulo chip (3).

公开(公告)号：DE50015305D1

公开(公告)日：2008-09-25

申请号：DE50015305

申请日：2000-02-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PUESCHNER FRANK ,  FRIES MANFRED ,  SEIDL ANNEMARIE ,  FISCHER JUERGEN

IPC: G06K19/077

Abstract: A portable data support is disclosed comprising a card-shaped body (1), with a recess (2) for mounting a chip module (3). Said chip module contains at least one semiconductor chip (4) on a first main side (5), a chip support (18) connected to the card-shaped body and a metallisation on a second main side (6) with a tab. The chip support comprises pre-determined bending points (9), which, when bending strains occur, reduce the forces on the semiconductor chip and the wire connections.

公开(公告)号：DE59712063D1

公开(公告)日：2004-12-09

申请号：DE59712063

申请日：1997-03-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  JANCZEK THIES

IPC: B42D15/10 ,  G06K19/077

Abstract: A chip card for the contactless transmission of electric signals to a terminal includes a card body in which a coupling element having conductor tracks and contact connections, and a semiconductor chip having an electronic circuit associated with the coupling element, are constructed in an integrated manner. The semiconductor chip is provided on its surface with contact elements for electrical connection of the electronic circuit and the contact connections of the coupling element. A carrier made of an electrically insulating material supports at least part of the conductor tracks and the contact connections of the coupling element. The carrier is provided with an aperture in the vicinity of the contact connections of the coupling element, for receiving the semiconductor chip.

公开(公告)号：ES2196776T3

公开(公告)日：2003-12-16

申请号：ES99907262

申请日：1999-01-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  FISCHER JURGEN ,  HOUDEAU DETLEF

IPC: A61B5/117 ,  G06K9/00 ,  G06K19/077 ,  G06T1/00 ,  G07C9/00

Abstract: In a smart card module for biometric sensors for installation in smart cards, a support has at least one through opening or window in the region of a sensor chip. The sensor chip is mounted on the support such that an active surface of the sensor chip is directed toward the support and is situated in the region of the window, so that it can be accessed through the window in the support.

公开(公告)号：DE10191188D2

公开(公告)日：2003-02-20

申请号：DE10191188

申请日：2001-03-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED

IPC: G06K9/00

Abstract: The housing (30) for biometric sensor chips (1) with a freely accessible fingerprint check surface (2) further includes a carrier substrate (3) in the form of a belt with perforated edges (6) carrying contact elements (4) located partly outside the housing frame (7). The contact area (8) of the sensor chip is joined to the housing frame to form a three-dimensional frame. Also claimed is a method for producing such a housing. It involves structurization of a metal layer on the carrier substrate and positioning of the sensor chip on the resulting structured metal layer.

公开(公告)号：AT232322T

公开(公告)日：2003-02-15

申请号：AT99961981

申请日：1999-07-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  MUENCH THOMAS ,  FISCHBACH REINHARD

IPC: G01B7/34 ,  A61B5/1172 ,  G01B7/28 ,  G01B21/00 ,  G06K9/00 ,  G06T1/00 ,  G07C9/00 ,  H01L23/12

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

公开(公告)号：DE10016135A1

公开(公告)日：2001-10-18

申请号：DE10016135

申请日：2000-03-31

Applicant: INFINEON TECHNOLOGIES AG ,  SIEMENS AG

Inventor： FRIES MANFRED ,  FISCHBACH REINHARD ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/057 ,  H01L23/16 ,  H01L21/52 ,  H05K13/04

Abstract: The invention relates to a housing assembly for an electronic component (1) and to a method for packaging an electronic component, said housing assembly being provided with at least one electronic component (2) to the packaged, an outer support (3) and a housing frame (4). An epoxide resin that has a capillary effect is filled into the assembled housing assembly via a feed opening (7) and closes the cavities between the semiconductor chip and the housing frame by virtue of said capillary effect.

公开(公告)号：AT206835T

公开(公告)日：2001-10-15

申请号：AT98904010

申请日：1998-01-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  PUESCHNER FRANK ,  MUNDIGL JOSEF ,  FISCHER JUERGEN ,  HOUDEAU DETLEF

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

公开(公告)号：DE102018220762A1

公开(公告)日：2019-06-06

申请号：DE102018220762

申请日：2018-11-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRANDL FLORIAN ,  FRIES MANFRED ,  KALZ FRANZ-PETER

IPC: B81C1/00 ,  B81B7/02 ,  G01L9/00

Abstract: Ein Halbleiterbauelement und ein Verfahren zur Herstellung desselben werden derart bereitgestellt, dass ein Element mit mikroelektromechanischen Systemen (MEMS-Element) in einer frühen Herstellungsphase geschützt wird. Ein Verfahren zum Schützen eines MEMS-Elements beinhaltet folgende Schritte: Bereitstellen zumindest eines MEMS-Elements mit einem empfindlichen Bereich auf einem Substrat; und Aufbringen, vor einem Package-Zusammenbau-Prozess, eines Schutzmaterials über dem empfindlichen Bereich des zumindest einen MEMS-Elements, so dass der empfindliche Bereich zumindest eines MEMS-Elements vor einer äußeren Umgebung abgedichtet ist, wobei das Schutzmaterial eine Sensorfunktionalität des zumindest einen MEMS-Elements erlaubt.