公开(公告)号：DE10236184A1

公开(公告)日：2004-02-19

申请号：DE10236184

申请日：2002-08-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  VASQUEZ BARBARA ,  IRSIGLER ROLAND ,  STRUTZ VOLKER

IPC: H01L23/04 ,  H01L23/32 ,  H01L23/50

Abstract: A semiconductor element (1) for mounting on a conductor plate comprises a chip (3) with a housing (4) and electrical contacts (5) directly to the plate. The housing is only glued to the chip and has a protective cover (8) and frame (9) which does not touch the chip but mechanically supports the housing on the plate.

公开(公告)号：DE10202881A1

公开(公告)日：2003-08-14

申请号：DE10202881

申请日：2002-01-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  VASQUEZ BARBARA

IPC: H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50 ,  H01L21/78 ,  H01L23/00

Abstract: The present invention provides a method of producing semiconductor chips (1a, 1b, 1c; 1a', 1b', 1c') with a protective chip-edge layer (21'', 22''), in particular for wafer level packaging chips, with the steps of: preparing a semiconductor wafer (1); providing trenches (21, 22) in the semiconductor wafer to establish chip edges on a first side of the semiconductor wafer (1); filling the trenches (21, 22) with a protective agent (21'; 22'); grinding back the semiconductor wafer (1) from a second side of the semiconductor wafer (1), which is opposite from the first side, to expose the trenches (21, 22) filled with the protective agent (21'; 22'); and cutting through the trenches (21, 22) filled with the protective agent (21'; 22'), so that the protective chip-edge layer (21'', 22'') comprising the protective agent (21', 22') remains on the chip edges.

公开(公告)号：DE10153609A1

公开(公告)日：2003-05-15

申请号：DE10153609

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/98 ,  H01L25/065

Abstract: Production of electronic component comprises: forming first planar chip arrangement by arranging functional chips at a distance from each other in a grid and filling the gaps with a filler; forming and/or arranging a further planar chip arrangement on the first chip arrangement; optionally applying interconnecting elements; and forming electronic components by removing frames of chip arrangements. Production of an electronic component comprises: forming a first planar chip arrangement by arranging functional chips at a distance from each other in a grid and filling the gaps with a filler to form a frame for isolating the chips and for forming an electrical contact to another chip of another chip arrangement; forming and/or arranging a further planar chip arrangement as in the first step on the first chip arrangement so that the chips and the frames of the arrangements lie over each other and the contact elements of both chip arrangements are connected together for a chip-chip contact; optionally repeating the previous step; optionally applying interconnecting elements according to use; and forming electronic components by removing the frames of the chip arrangements. An Independent claim is also included for the electronic component produced. Preferred Features: The first chip arrangement is produced using a support on which the chips are fixed using an adhesive. The support is a self-adhesive foil or strip or a passivated silicon support.

公开(公告)号：DE10145382A1

公开(公告)日：2003-01-09

申请号：DE10145382

申请日：2001-09-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRANKOWSKY GERD ,  MEYER THORSTEN ,  HEDLER HARRY ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/56 ,  H01L21/66 ,  H01L21/68 ,  H01L23/31 ,  H01L23/32 ,  H01L21/58 ,  H01L21/60 ,  H01L21/78

Abstract: The method involves producing a number of separate components, especially chips, from a wafer, separating the components, arranging at least some in a raster at larger separations than on the wafer, filling the spaces to form a mounting frame, carrying out wafer-level packaging by making individual component connections and contact elements and/or holding elements near the holding frame and separating the components by dividing the frame. AN Independent claim is also included for the following: an electronic chip manufactured in accordance with the inventive method.

公开(公告)号：DE10120928C1

公开(公告)日：2002-10-31

申请号：DE10120928

申请日：2001-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L21/58

Abstract: The production of a contact joint between a semiconductor chip (C1) and a substrate (MB) comprises preparing a substrate having a first contact surface (MK); preparing the chip having a second contact surface (L1); applying a hardenable conducting adhesive on the first contact surface and/or the second contact surface; joining the contact surfaces; and hardening the adhesive to form the contact joint. The adhesive comprises a matrix (K), a filler (F), a hardener and a decomposable component which decomposes either thermally or by irradiation. Preferred Features: The contact surfaces are mechanically separated, the chip removed and a further chip placed on its site through a corresponding contact joint. The filler is made from silver, nickel, gold, copper, aluminum, platinum, silicon or metal-coated particles.

公开(公告)号：DE10156386B4

公开(公告)日：2007-08-09

申请号：DE10156386

申请日：2001-11-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  VASQUEZ BARBARA

IPC: H01L21/56 ,  H01L23/04 ,  H01L21/68 ,  H01L23/31 ,  H01L23/485

Abstract: A process for producing a semiconductor chip having contact elements protruding on one chip side within the context of wafer level packaging, the chip side provided with the contact elements being coated with a covering compound forming a protective layer, from which the protruding contact element project.

公开(公告)号：DE102005035393B4

公开(公告)日：2007-05-24

申请号：DE102005035393

申请日：2005-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY

IPC: H01L21/60 ,  H01L23/50 ,  H01L25/065

Abstract: The present invention relates to a method and apparatus for producing a chip arrangement. In one embodiment, the method includes providing a first chip having an electrically operable structure, of providing at least one through-via through the first chip, and of arranging at least one bond wire through the through-via in the first chip.

公开(公告)号：DE102004030140B3

公开(公告)日：2006-01-19

申请号：DE102004030140

申请日：2004-06-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOLTER ANDREAS ,  HEDLER HARRY ,  IRSIGLER ROLAND ,  MEYER TORSTEN

IPC: G01R1/067 ,  G01R1/073 ,  H01L21/58 ,  H01L21/66 ,  H01L23/50 ,  H01R12/00 ,  H05K3/32 ,  H05K3/40

Abstract: The present invention relates to an elastic contact-connecting device. An elastic elevation 3 is applied to a carrier area 2 of a carrier 1 . The elastic elevation 3 has a first oblique area 4 , a second ramp 5 and a roof area 6 . The first oblique area 4 has a lesser inclination ( 30 ) with regard to the carrier area 2 than the second oblique area 5 . A contact region 20 is applied to the roof area 6 of the elastic elevation. The contact region 20 is connected to other structures 12 on the carrier 1 via a conductor track 10 . For this purpose, the conductor track 10 is guided over the first oblique area 4 . If a mating contact is pressed onto the contact region 20 , the elastic elevation yields, but presses against the mating contact on account of its elastic property and thus enables a reliable contact. In this case, essentially only the second oblique area 5 is deformed; the first oblique area 4 and the conductor track 10 applied thereto are not subjected to any mechanical stress.

公开(公告)号：DE10164800B4

公开(公告)日：2005-03-31

申请号：DE10164800

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BABARA

IPC: H01L21/98 ,  H01L25/065 ,  H01L21/58 ,  H01L23/50

公开(公告)号：DE10324450A1

公开(公告)日：2005-01-05

申请号：DE10324450

申请日：2003-05-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  WEITZ PETER ,  IRSIGLER ROLAND

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: A contact-connection device for electronic circuit units includes an adapter board, at least one elastic element arranged on the adapter board, conductor tracks arranged on the at least one elastic element and the adapter board, conductor track connecting elements deposited on the adapter board and electrically connected to the conductor tracks, and contact-connection elements deposited on the at least one elastic element and electrically connected to the conductor tracks, the contact-connection elements contact-connecting circuit unit connecting elements of the circuit units in an elastically pressing-on fashion.