中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

57 records (took 0.023 seconds)

    METHOD FOR FABRICATING PRINTED CIRCUITS
    34.
    发明专利
    METHOD FOR FABRICATING PRINTED CIRCUITS 未知

    公开(公告)号：CA2046202C

    公开(公告)日：1997-06-10

    申请号：CA2046202

    申请日：1991-07-04

    Applicant: MACDERMID INC

    Inventor： BENGSTON JON E ,  LARSON GARY B

    IPC: H05K1/09 ,  H05K3/24 ,  H05K3/34 ,  H05K3/22

    Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.

    36.
    发明专利
    未知

    公开(公告)号：NO952739D0

    公开(公告)日：1995-07-10

    申请号：NO952739

    申请日：1995-07-10

    Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: C23C22/07 ,  G03F7/09 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23C

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

    METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS HAVING SOLDER-MASKED TRACES
    37.
    发明专利
    METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS HAVING SOLDER-MASKED TRACES 未知

    公开(公告)号：CA1258138A

    公开(公告)日：1989-08-01

    申请号：CA515260

    申请日：1986-08-01

    Applicant: MACDERMID INC

    Inventor： LARSON GARY B ,  RUSZCZYK STANLEY J ,  CASTALDI STEVEN A

    IPC: H05K3/06 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42 ,  G03C5/00

    Abstract: Printed circuit boards having solder coated pads and through-holes and bare copper traces protected by a directly applied solder mask or by a coating of nonreflowable metal and a solder mask thereover, are manufactured by a process which avoids the need for tin-lead stripping and the need for separate application and leveling of molten solder. In the preferred process, liquid resists are applied to circuit boards having tin-lead over copper plated holes and pads so as to define and etch protect bare copper traces of desired pattern circuitry (as well as other desired configurations). Copper areas other than those protected by the etch-resist and tin-lead plating are etched away, the etch-resist removed and solder mask applied over the bare copper traces or other desired bare copper areas or, alternatively, to bare copper first coated with a non-reflowable metal. The tin-lead plating is then preferably reflowed and solidified to provide the pads and through-holes with solder coating.

    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS
    38.
    发明专利
    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS 未知

    公开(公告)号：AU8102887A

    公开(公告)日：1988-06-01

    申请号：AU8102887

    申请日：1987-09-10

    Applicant: MACDERMID INC

    Inventor： RUSZCZYK STANLEY J ,  CASTALDI STEVEN A ,  GALLEGOS DANIEL ,  LARSON GARY B ,  FERRIER DONALD R

    IPC: B05D3/04 ,  B05D3/10 ,  B05D5/12 ,  H05K1/00 ,  H05K3/18 ,  H05K3/46

    Abstract: Multilayer printed circuit boards are fabricated by preparing a first layer in conventional manner by forming a resist image on a copper clad substrate, etching away unwanted copper, removing the resist from the circuit pattern and optionally applying a dielectric mask such as conventional solder mask to selected portions of the circuit pattern. A second layer, and optionally one or more subsequent layers, are fabricated by providing an image of a second circuit pattern in a predetermined location on said first layer, the image being formed using a suspension of cuprous oxide in a curable resin material. The image is cured at least partially and subjected to chemical reduction to convert at least a portion of the cuprous oxide to metallic copper such that the unreduced cuprous oxide in resin serves as a dielectric layer. The image is then electrolessly plated with copper to build up the circuit pattern and the latter is selectively coated with a dielectric mask before repeating the cycle to build up one or more additional layers. Solder can be applied to selected areas of any of said printed circuit layers at any appropriate time during fabrication. The above method of fabrication has advantages of economy of time, materials and labor as compared with methods hitherto employed to prepare multilayer boards in which a plurality of single boards are fabricated individually and then assembled as a sandwich or laminate by application of heat and pressure.

    40.
    发明专利
    未知

    公开(公告)号：DE69329249T2

    公开(公告)日：2001-02-01

    申请号：DE69329249

    申请日：1993-11-15

    Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: G03F7/09 ,  C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23F1/18

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

Patent Agency Ranking