公开(公告)号：JPH08245741A

公开(公告)日：1996-09-24

申请号：JP5003995

申请日：1995-03-09

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KOGA NOBUSHI ,  INOUE HIROSHI ,  YOKODE SEIJI ,  SAKAI MASAMI

IPC: C08J9/02 ,  C08G18/00 ,  C08G18/08 ,  C08G18/30 ,  C08G18/34 ,  C08G18/48

Abstract: PURPOSE: To obtain an integrally skinned polyurethane foam which is useful in car parts and furniture having no bulge or blister by casting a reaction mixture containing an aromatic polyisocyanate, a high-molecular isocyanate- reactive compound and a specific expanding agent into a mold. CONSTITUTION: A reaction mixture containing (A) an aromatic polyisocyanate, (B) a high-molecular isocyanate-reactive compound, (C) an expanding agent comprising an organic dicarboxylic acid or its compound (for example, an organic dicarboxylate ester or its salt) and, when needed, a crosslinking agent, a catalyst, a foaming agent, a foam stabilizer and other aids or auxiliary agents is cast into a mold to effect the reactive injection molding to give the objective foam having a molded product density of 0.3-0.8g/cm .

公开(公告)号：JP2535527B2

公开(公告)日：1996-09-18

申请号：JP7609587

申请日：1987-03-31

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OIKAWA HIDEAKI ,  IIYAMA KATSUAKI ,  KOGA NOBUSHI ,  KAWASHIMA SABURO ,  TAMAI MASAJI ,  OOTA MASAHIRO ,  YAMAGUCHI TERUHIRO

IPC: C08G73/10

公开(公告)号：JPH07292247A

公开(公告)日：1995-11-07

申请号：JP6137395

申请日：1995-03-20

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YAMATANI NORIMASA ,  KOGA NOBUSHI ,  BABA KENICHI

IPC: C08K7/08 ,  C08L79/08

Abstract: PURPOSE:To obtain a resin composition excellent in heat resistance, dimensional stability, high-temperature mechanical strengths, etc., by mixing a polyimide resin comprising repeating units represented by a specified formula with potassium titanate fibers. CONSTITUTION:This composition is a polyimide resin composition comprising 100 pts.wt. polyimide resin comprising repeating units represented by the formula (wherein Y is a 1-10C bivalent hydrocarbon group, hexafluoroisoprolylidene, carbonyl, thio, sulfinyl or oxide; and R is a tetravalent group selected from the group consisting a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a fused polycyclic aromatic group and a nonfused cyclic aromatic group composed of aromatic groups bonded to each other directly or through brindging members) and 5-200 pts.wt. potassium titanate fibers. This composition has extremely small mold shrinkage and is excellent in dimentional stability, mechanical strengths, and heat resistance. This composition is useful for electrical and electronic components, automotive components precision machinery components, etc.

公开(公告)号：JPH07118526A

公开(公告)日：1995-05-09

申请号：JP26203693

申请日：1993-10-20

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TAMAI MASAJI ,  YAMASHITA WATARU ,  IIYAMA KATSUAKI ,  KOGA NOBUSHI ,  YAMAGUCHI TERUHIRO

IPC: C08K7/02 ,  C08L79/08

Abstract: PURPOSE:To obtain a polyimide resin compsn. which is melt moldable, e.g. injection moldable, and excellent in fatigue properties by compounding a polyimide resin with another polyimide resin and a fibrous filler such as a carbon fiber, and to obtain an injection molded article from the compsn. CONSTITUTION:A polyimide resin compsn. comprises 100 pts.wt. polyimide resin having repeating structural units of formula I (X is a direct bond, isopropylidene, hexafluoroisopropylidene, carbonyl, thio, or sulfonyl; and R is a tetravalent group of formula II), 3-45 pts.wt. polyimide resin having repeating structural units of formula III and a logarithmic viscosity of 0.7dl/g or higher, and 5-65 pts.wt. at least one fibrous filler selected from the group consisting of a carbon fiber, a glass fiber, an aramid fiber, and a potassium titanate fiber. The former polyimide resin is obtd. by reacting a specific diamine [e.g. 4,4'-bis(3-aminophenoxy)biphenyl] with at least one tetracarboxylic dianhydride.

公开(公告)号：JPH06322110A

公开(公告)日：1994-11-22

申请号：JP11132093

申请日：1993-05-13

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KATAOKA TOSHIYUKI ,  KOGA NOBUSHI ,  OIKAWA HIDEAKI ,  ASANUMA TADASHI ,  YAMAGUCHI TERUHIRO

IPC: C08G69/32 ,  C08G69/48 ,  C08K7/02 ,  C08L77/00 ,  C08L77/06

Abstract: PURPOSE:To provide a polyamide resin having a combination of inherent heat resistance with excellent processability and low water absorptivity and good in mechanical properties and dimensional stability, containing a specific bis[(amino dimethylbenzyl)phenoxy]benzophenone. CONSTITUTION:The objective aromatic polyamide of formula I (X is

公开(公告)号：JPH05310919A

公开(公告)日：1993-11-22

申请号：JP12053692

申请日：1992-05-13

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KATAOKA TOSHIYUKI ,  KOGA NOBUSHI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

IPC: C08G69/32 ,  C08K7/02 ,  C08L77/00 ,  C08L77/10

Abstract: PURPOSE:To obtain a composition useful as parts of medical equipments electrical and electronic parts, etc., having excellent heat resistance, dimensional stability and mechanical characteristics and improved processability and low water absorption by subjecting a specific diamine and an aromatic dicarboxylic acid to polycondensation in an organic solvent. CONSTITUTION:An aromatic polyamide of formula I (X is

公开(公告)号：JPH05310916A

公开(公告)日：1993-11-22

申请号：JP11346292

申请日：1992-05-06

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KATAOKA TOSHIYUKI ,  KOGA NOBUSHI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

IPC: C08G69/32 ,  C08K7/02 ,  C08L77/00 ,  C08L77/10

Abstract: PURPOSE:To obtain a composition useful as a member for precision machine, etc., having excellent heat resistance, dimensional stability and mechanical characteristics and improved processability and low water absorption by subjecting a specific diamine and an aromatic dicarboxylic acid to polycondensation in an organic solvent. CONSTITUTION:An aromatic polyamide of formula I (X is

公开(公告)号：JPH04331228A

公开(公告)日：1992-11-19

申请号：JP41556190

申请日：1990-12-28

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KATAOKA TOSHIYUKI ,  OIKAWA HIDEAKI ,  KOGA NOBUSHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

IPC: C08G69/28 ,  C08G69/32 ,  C08K7/02 ,  C08L77/00 ,  C08L77/10

Abstract: PURPOSE:To obtain an aromatic polyamide excellent in heat resistance, processability and low water absorptivity by polycondensing a specified aromatic diamine with an aromatic dicarboxylic acid in an organic solvent, and to obtain a resin composition improved in mechanical strengths and dimensional stability by mixing the aromatic polyamide with a fibrous reinforcement. CONSTITUTION:2,2-Bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluorop ropane of formula II and/or 2,2-bis[4-(3aminophenoxy)phenyl]-1,1,1,3,3,3- hexafluoropropane of formula II are polycondensed with an aromatic dicarboxylic acid dihalide at 60 deg.C or below in an organic solvent in the presence of a dehydrohalogenating agent to give an aromatic polyamide represented by formula I (wherein X is a condensed polycyclic aromatic group or the like; and (n) is an integer of 1-1000).

公开(公告)号：JPH037763A

公开(公告)日：1991-01-14

申请号：JP3240990

申请日：1990-02-15

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TSUTSUMI TOSHIHIKO ,  NAKAKURA TOSHIYUKI ,  MORIKAWA SHUICHI ,  KOGA NOBUSHI

IPC: C08K9/04 ,  C08K7/06 ,  C08L79/08

Abstract: PURPOSE:To obtain a carbon-fiber reinforced polyimide resin composition, containing carbon fiber coated and covered with an aromatic polysulfone resin and a polyimide resin, excellent in mechanical strength, especially mechanical strength at high temperatures and suitable as mechanical parts, etc. CONSTITUTION:A carbon-fiber reinforced polyimide resin composition composed of (A) 5-50 pts.wt., preferably 10-50 pts.wt. carbon fiber obtained by coating the surface thereof with an aromatic polysulfone resin as a bundling agent and then heating the coated fiber at 300-400 deg.C and containing 0.1-10wt.% aforementioned resin and (B) 95-50 pts.wt., preferably 90-50 pts.wt. resin selected from (B1) polyimide resins, composed of recurring units expressed by formula I (X is direct bond, 1-10C bifunctional hydrocarbon group, etc.; R is tetrafunctional group selected from >=2C aliphatic groups, monocyclic aliphatic groups, etc.) and having 0.2-0.7dl/g inherent viscosity and (B2) polyimide resins, composed of recurring units expressed by formula II and having 0.25-0.75dl/g inherent viscosity.

公开(公告)号：JPH02255861A

公开(公告)日：1990-10-16

申请号：JP30939589

申请日：1989-11-30

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TSUTSUMI TOSHIHIKO ,  NAKAKURA TOSHIYUKI ,  NAGAHIRO TAIZO ,  MORIKAWA SHUICHI ,  KOGA NOBUSHI

IPC: C08L79/08 ,  C08G73/10 ,  H01R33/76

Abstract: PURPOSE:To obtain an IC socket excellent in heat resistance, chemical resistance, water vapor resistance, flame retardancy, etc., by using a specified polyimide as a starting material. CONSTITUTION:This IC socket is made from a polyimide having repeating units of formula I wherein X is a direct bond, a 1-10C bivalent hydrocarbon group, a hexafluorinated isopropylydene, a carbonyl, a thio or a sulfonyl; and R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a fused polycyclic aromatic group, and a nonfused polycyclic aromatic group composed of aromatic groups bonded directly or through bridging members. It is desirable that the polyimide has an inherent viscosity in the range of 0.40-0.60dl/g.