公开(公告)号：US20160029482A1

公开(公告)日：2016-01-28

申请号：US14873567

申请日：2015-10-02

Applicant: INNOVA DYNAMICS, INC.

Inventor： Michael Eugene Young ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Alexander Chow Mittal

IPC: H05K1/09 ,  H05K1/03

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。

公开(公告)号：US09185798B2

公开(公告)日：2015-11-10

申请号：US14299938

申请日：2014-06-09

Applicant: INNOVA DYNAMICS, INC.

Inventor： Michael Eugene Young ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Alexander Chow Mittal

IPC: H01L31/00 ,  H01L31/048 ,  H01L31/0216 ,  H05K1/02 ,  H01L31/055 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。

公开(公告)号：WO2014188918A1

公开(公告)日：2014-11-27

申请号：PCT/JP2014/062783

申请日：2014-05-14

Applicant: 富士フイルム株式会社

Inventor： 片桐健介 ,  田尻新 ,  長谷明彦

IPC: H01B5/14 ,  B32B15/08 ,  G06F3/041 ,  G06F3/044 ,  G09F9/00 ,  H01B13/00 ,  H01L51/50 ,  H05B33/14 ,  H05B33/28

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G09F9/00 ,  H01B1/02 ,  H01L51/0021 ,  H01L51/5212 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/10 ,  H05K2201/0364 ,  H05K2201/09209 ,  H05K2203/0502 ,  Y10T29/49155

Abstract: 　本発明は、透明導電膜及び透明導電膜の製造方法に関する。透明導電膜は、透明基体（１２）と、該透明基体（１２）上に形成された金属配線部（１４）とを有する透明導電膜（１０）において、金属配線部（１４）の電極部（１８）を構成する金属細線（２４）が、Ｒａ 2 ／Ｓｍ＞０．０１μｍを満たす表面形状を有し、且つ、金属体積率が３５％以上である。なお、Ｒａは算術平均粗さを示し、表面粗さ測定箇所の金属配線の厚み以下であって、単位がμｍである。Ｓｍは凹凸の平均間隔であって、０．０１μｍ以上である。

Abstract translation: 本发明涉及一种透明导电膜及其制造方法。 这种透明导电膜（10）包括透明基底（12）和形成在透明基底（12）上的金属布线部分（14）和构成电极部分（18）的金属细线（24） 金属配线部（14）具有满足Ra2 / Sm>0.01μm，金属体积比为35％以上的表面形状。 在这方面，Ra表示在表面粗糙度的测量点处的金属布线的厚度不大于其单位为μm的算术平均粗糙度; Sm表示轮廓不规则的平均间距，不小于0.01μm。

公开(公告)号：WO2012021460A9

公开(公告)日：2012-04-05

申请号：PCT/US2011046969

申请日：2011-08-08

Applicant: YOUNG MICHAEL EUGENE ,  SRINIVAS ARJUN DANIEL ,  ROBINSON MATTHEW R ,  MITTAL ALEXANDER CHOW

Inventor： YOUNG MICHAEL EUGENE ,  SRINIVAS ARJUN DANIEL ,  ROBINSON MATTHEW R ,  MITTAL ALEXANDER CHOW

IPC: H01L31/048

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 活性或功能性添加剂嵌入到主体材料的表面中，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。

公开(公告)号：US09820380B2

公开(公告)日：2017-11-14

申请号：US15444203

申请日：2017-02-27

Applicant: FUJIFILM Corporation

Inventor： Kensuke Katagiri ,  Shin Tajiri ,  Akihiko Hase

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/02 ,  G06F3/041

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G09F9/00 ,  H01B1/02 ,  H01L51/0021 ,  H01L51/5212 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/10 ,  H05K2201/0364 ,  H05K2201/09209 ,  H05K2203/0502 ,  Y10T29/49155

Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.

公开(公告)号：US09820377B2

公开(公告)日：2017-11-14

申请号：US14947831

申请日：2015-11-20

Applicant: FUJIFILM CORPORATION

Inventor： Kensuke Katagiri ,  Shin Tajiri ,  Akihiko Hase

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/02 ,  G06F3/041 ,  G06F3/044 ,  G09F9/00 ,  H01B1/02 ,  H01L51/00 ,  G06F3/045 ,  H01L51/52

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G09F9/00 ,  H01B1/02 ,  H01L51/0021 ,  H01L51/5212 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/10 ,  H05K2201/0364 ,  H05K2201/09209 ,  H05K2203/0502 ,  Y10T29/49155

Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.

公开(公告)号：US09736945B2

公开(公告)日：2017-08-15

申请号：US14813218

申请日：2015-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Nobuya Takahashi

IPC: H05K1/09 ,  H05K3/18 ,  H05K3/16 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/48 ,  H01L23/538

CPC classification number: H05K3/18 ,  H01L21/4857 ,  H01L23/49866 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/111 ,  H05K1/141 ,  H05K3/16 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0391 ,  H05K2201/0769 ,  H05K2201/09236 ,  H05K2201/0929 ,  H05K2201/094 ,  H05K2201/09654 ,  H05K2201/097 ,  H05K2201/09736 ,  H05K2201/098 ,  H01L2924/014

Abstract: A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.

公开(公告)号：US20160345434A1

公开(公告)日：2016-11-24

申请号：US14967348

申请日：2015-12-13

Applicant: HON HAI PRECISION INDUSTRY CO., LTD. ,  Tsinghua University

Inventor： YUAN-HAO JIN ,  QUN-QING LI ,  SHOU-SHAN FAN

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/02

CPC classification number: B32B15/08 ,  B32B5/028 ,  B32B2307/202 ,  C03C17/09 ,  C03C2217/252 ,  C03C2217/253 ,  C03C2217/255 ,  C03C2218/15 ,  C03C2218/33 ,  C03C2218/34 ,  C23C14/20 ,  C23C14/5826 ,  C23C14/5873 ,  C23C16/06 ,  C23C16/56 ,  C23C30/00 ,  C23F4/00 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/026 ,  H01B1/16 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0364 ,  H05K2201/09681

Abstract: The disclosure relates to a metal nanowire film. The metal nanowire film includes a substrate and a number of first metal nanowire bundles located on the substrate. The number of first metal nanowire bundles are parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.

Abstract translation: 本公开涉及金属纳米线膜。 金属纳米线膜包括基板和位于基板上的多个第一金属纳米线束。 第一金属纳米线束的数量彼此平行并间隔开。 多个第一金属纳米线束中的每一个包括彼此平行的多个第一金属纳米线。 第一金属纳米线的相邻两个之间的第一距离小于相邻的第二金属纳米线束之间的第二距离。

公开(公告)号：US20160081184A1

公开(公告)日：2016-03-17

申请号：US14947831

申请日：2015-11-20

Applicant: FUJIFILM CORPORATION

Inventor： Kensuke KATAGIRI ,  Shin TAJIRI ,  Akihiko HASE

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G09F9/00 ,  H01B1/02 ,  H01L51/0021 ,  H01L51/5212 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/10 ,  H05K2201/0364 ,  H05K2201/09209 ,  H05K2203/0502 ,  Y10T29/49155

Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.

Abstract translation: 透明导电膜包括透明基板和形成在其上的金属布线部分。 包含在金属配线部的电极部的细金属丝具有满足Ra2 / Sm>0.01μm的条件的表面形状，金属体积含量为35％以上。 Ra表示以微米为单位的算术平均粗糙度，并且等于或小于位于测量表面粗糙度的位置的金属布线的厚度。 Sm表示凸部之间的平均距离，为0.01μm以上。

公开(公告)号：US20160014898A1

公开(公告)日：2016-01-14

申请号：US14798550

申请日：2015-07-14

Applicant: IBIDEN CO., LTD.

Inventor： Takema Adachi ,  Wataru Nakamura ,  Tomoyoshi Hirabayashi

IPC: H05K1/14 ,  H05K1/09 ,  H01L23/498 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H05K1/09 ,  H05K1/185 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/09372 ,  H05K2201/10674 ,  H05K2203/054 ,  H05K2203/0723

Abstract: A printed wiring board includes a first circuit substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first circuit substrate and that the second pads are positioned to electrically connect the first circuit substrate to a second circuit substrate, and metal posts including plating material and formed on the second pads respectively such that the metal posts are positioned to mount the second circuit substrate on the first circuit substrate. Each of the metal posts has a height h1 and a thickness b such that the metal posts have a value h1/b which is greater than 0.1 and smaller than 1.0 where the value h1/b is obtained by dividing the height h1 by the thickness b.

Abstract translation: 印刷布线板包括具有第一焊盘和第二焊盘的第一电路基板，使得第一焊盘被定位成将电子部件安装在第一电路基板上，并且第二焊盘被定位成将第一电路基板电连接到第二电路 基板和包括电镀材料的金属柱并分别形成在第二焊盘上，使得金属柱被定位成将第二电路基板安装在第一电路基板上。 每个金属柱具有高度h1和厚度b，使得金属柱具有大于0.1且小于1.0的值h1 / b，其中通过将高度h1除以厚度b获得值h1 / b 。