公开(公告)号：US3702953A

公开(公告)日：1972-11-14

申请号：US3702953D

申请日：1971-04-27

Applicant: AGFA GEVAERT AG

Inventor： FAUTH GUNTER ,  SPINNLER RAINER

IPC: G03B9/58 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0256 ,  G03B9/58 ,  H05K1/182 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2201/2036

Abstract: A printed circuit arrangement for use as a compact part of the exposure control in a photographic apparatus has an insulating plate provided with a recess for a portion of or an entire prefabricated electrical or electronic component with several coplanar terminals which contact discrete coplanar conductors applied (by printing or otherwise) to one surface of the plate. An insert of insulating material is interposed between overlapping portions of one or more conductors and one or more terminals to prevent the flow of current between those conductors and those terminals which must be insulated from each other when the plate is built into a photographic apparatus. The outline of the recess conforms to the outline of the component and the insert surrounds a portion of or the entire component and is bonded or clamped to the plate to remain in requisite position.

Abstract translation: 用作照相设备中的曝光控制的紧凑部分的印刷电路装置具有绝缘板，该绝缘板设置有用于部分或整个预制电气或电子部件的凹部，该预制电气或电子部件具有几个共面端子，该共面端子接触分立的共面导体（由 印刷或其他）到板的一个表面。 绝缘材料的插入物插入在一个或多个导体和一个或多个端子的重叠部分之间，以防止当板被内置到照相设备中时这些导体与那些必须彼此绝缘的端子之间的电流流动。 凹槽的轮廓符合部件的轮廓，并且刀片围绕部件或整个部件，并且被粘合或夹紧到板上以保持在必要位置。

公开(公告)号：US3019283A

公开(公告)日：1962-01-30

申请号：US80988859

申请日：1959-04-29

Applicant: THOMAS LITTLE

Inventor： THOMAS LITTLE

IPC: H01R12/00 ,  H05K1/00 ,  H05K1/03 ,  H05K3/30

CPC classification number: H05K3/306 ,  H05K1/0287 ,  H05K1/036 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10575 ,  H05K2203/1189

公开(公告)号：US20110062563A1

公开(公告)日：2011-03-17

申请号：US12560727

申请日：2009-09-16

Applicant: Xiaoyu Yang ,  Qing Li ,  Albert Meeks ,  Kim Le

Inventor： Xiaoyu Yang ,  Qing Li ,  Albert Meeks ,  Kim Le

IPC: H01L23/495 ,  H01L21/44 ,  H01L23/52

CPC classification number: H05K3/28 ,  G11C16/0483 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/80 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/83191 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/24 ,  H05K3/284 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/0769 ,  H05K2201/10159 ,  H05K2201/10575 ,  H05K2203/049 ,  H05K2203/1316 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Mobile ion diffusion causes a shift in the threshold voltage of non-volatile storage elements in a memory chip, such as during an assembly process of the memory chip. To reduce or avoid such shifts, a coating can be applied to a printed circuit board substrate or a leader frame to which the memory chip is surface mounted. An acrylic resin coating having a thickness of about 10 μm may be used. A memory chip is attached to the coating using an adhesive film. Stacked chips may be used as well. Another approach provides metal barrier traces over copper traces of the printed circuit board, within a solder mask layer. The metal barrier traces are fabricated in the same pattern as the copper traces but are wider so that they at least partially envelop and surround the copper traces. Corresponding apparatuses and fabrication processes are provided.

Abstract translation: 移动离子扩散导致存储芯片中的非易失性存储元件的阈值电压的偏移，例如在存储器芯片的组装过程中。 为了减少或避免这种偏移，可以将涂层施加到印刷电路板基板或表面安装存储芯片的引导框架。 可以使用厚度约为10μm的丙烯酸树脂涂层。 使用粘合膜将记忆芯片附着到涂层上。 也可以使用堆叠的芯片。 另一种方法在焊接掩模层内提供印刷电路板的铜迹线上的金属阻挡迹线。 金属阻挡迹线以与铜迹线相同的图案制造，但是更宽，使得它们至少部分地包围和包围铜迹线。 提供相应的装置和制造工艺。

公开(公告)号：US20080261353A1

公开(公告)日：2008-10-23

申请号：US12164085

申请日：2008-06-29

Applicant: Keiji Matsumoto

Inventor： Keiji Matsumoto

IPC: H01L21/00

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

Abstract translation: 用于电子设备的底部填充膜包括导热片。 电子设备可以包括印刷电路板，电气部件，底部填充物和导热片。 底部填料位于电路板和组件之间。 导热片位于底部填充物内，并与底部填充物一起构成底部填充膜。 该装置可以包括将组件固定到电路板的焊料凸块，底部填充膜具有其中焊料凸块对准的孔。 电路板底面可能有焊锡凸块，有助于散热。 电路板上可能有散热片，导热片固定到散热片上，有助于散热。 导热片可以固定到促进散热的底盘上。 因此，导热片促进了从部件到至少电路板的散热。

公开(公告)号：US07416923B2

公开(公告)日：2008-08-26

申请号：US11299155

申请日：2005-12-09

Applicant: Keiji Matsumoto

Inventor： Keiji Matsumoto

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

公开(公告)号：US07273988B2

公开(公告)日：2007-09-25

申请号：US11150210

申请日：2005-06-13

Applicant: Yuki Momokawa

Inventor： Yuki Momokawa

IPC: H05K1/16

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

Abstract translation: 电子装置安装在布线板上，其包括：具有通孔的基板和在基板的表面上延伸并与通孔的开口相邻的台阶。 此外，提供至少一个涂层，其涂覆至少一个焊盘的外周区域的至少一部分，以便使至少一个部件与无铅焊料分离，从而防止任何 从基材表面剥离土地。

公开(公告)号：US20070212901A1

公开(公告)日：2007-09-13

申请号：US10572953

申请日：2004-09-20

Applicant: Dietmar Birgel ,  Karl-Peter Hauptvogel ,  Paul Burger

Inventor： Dietmar Birgel ,  Karl-Peter Hauptvogel ,  Paul Burger

IPC: H05K1/00

CPC classification number: H05K13/0465 ,  H05K1/036 ,  H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10575 ,  H05K2201/1059 ,  H05K2203/1476 ,  Y10T29/49165

Abstract: In order to secure wired components of large mass or non-uniform mass distribution safely on a circuit board, without the components needing, as currently usual, to be glued onto the circuit board or held on the circuit board with snap-in holders, integrated into a connection bore for receiving a connection wire, or pin, of an electronic component a holding mechanism for secured holding of the connection wire, or pin. The holding mechanism represents a narrowing in the connection bore to a diameter smaller than that of the connection wire, or pin. The holding mechanism can be implemented, for example, by a connection bore embodied in the form of a bore drilled from one side of the circuit board, not completely through the circuit board. In such case, a edge remains as a narrowing, which securely seizes the connection pin of the relevant component and holds the component fixed to the circuit board.

Abstract translation: 为了在电路板上安全地将大质量或不均匀质量分布的有线部件安全地固定在电路板上，而不需要像现在常用的组件一样被胶合到电路板上或者用卡入式保持器固定在电路板上，集成 进入用于接收电子部件的连接线或销的连接孔，用于固定地保持连接线或销的保持机构。 保持机构表示连接孔的直径小于连接线或销的直径。 保持机构可以例如通过以电路板的一侧钻出的孔的形式而不是完全通过电路板实现的连接孔来实现。 在这种情况下，边缘保持为变窄，其可靠地抓住相关部件的连接销并将固定在电路板上的部件保持在一起。

公开(公告)号：US20070132078A1

公开(公告)日：2007-06-14

申请号：US11299155

申请日：2005-12-09

Applicant: Keiji Matsumoto

Inventor： Keiji Matsumoto

IPC: H01L23/02

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

Abstract translation: 用于电子设备的底部填充膜包括导热片。 电子设备可以包括印刷电路板，电气部件，底部填充物和导热片。 底部填料位于电路板和组件之间。 导热片位于底部填充物内，并与底部填充物一起构成底部填充膜。 该装置可以包括将组件固定到电路板的焊料凸块，底部填充膜具有其中焊料凸块对准的孔。 电路板底面可能有焊锡凸块，有助于散热。 电路板上可能有散热片，导热片固定到散热片上，有助于散热。 导热片可以固定到促进散热的底盘上。 因此，导热片促进了从部件到至少电路板的散热。

公开(公告)号：US20050146019A1

公开(公告)日：2005-07-07

申请号：US11048861

申请日：2005-02-03

Applicant: Yuki Momokawa

Inventor： Yuki Momokawa

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K1/09

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

公开(公告)号：US20030196831A1

公开(公告)日：2003-10-23

申请号：US10419197

申请日：2003-04-21

Applicant: NEC Corporation

Inventor： Yuki Momokawa

IPC: H05K001/09

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

Abstract translation: 电子装置安装在布线板上，其包括：具有通孔的基板和在基板的表面上延伸并与通孔的开口相邻的台阶。 此外，提供至少一个涂层，其涂覆至少一个焊盘的外周区域的至少一部分，以便使至少一个部件与无铅焊料分离，从而防止任何 从基材表面剥离土地。