Abstract:
PURPOSE: A semiconductor device and a method of manufacturing method are provided to implement a semiconductor device having high reliable metal oxide nitride film. CONSTITUTION: A metal nitride layer and a metal oxide layer are formed in on a semiconductor substrate. A metal oxide nitride film(128) is formed on a substrate having a metal nitride layer and a metal oxide layer through a heat treatment process. The metal oxide nitride film is reacted with the metal nitride layer, the metal oxide layer, and a second metal nitride layer.
Abstract:
PURPOSE: A nonvolatile memory device and method of forming the same are provided to improve the interfacial property between the silicon oxide film and the aluminum oxide film. CONSTITUTION: The tunnel insulating layer(20) is formed on the semiconductor substrate(11). The charge trapping layer(30) is formed on the tunnel insulating layer. The first aluminum oxide film(42) successively laminated on the charge trapping layer, and the silicon oxide film(44) and the dielectric layer(40) including the second aluminum oxide layer(46) are formed. The gate electrode which contacts with the second aluminum oxide layer is formed on the dielectric layer.
Abstract:
A method for formation of dysco3 film by ALD, semiconductor film stack containing DysScO3 film and method for formation of the same are provided to transfer and supply easily the source materials of low vapor pressure by transporting the source materials of the liquid state of the room temperature by the vaporizer. The Dy source material and Sc source material are carried in the liquid state to the vaporizer(110) positioned in one end of the chamber(100) through liquid conveying lines(120a,120b). The source materials in the liquid state are vaporized in the vaporizer. The vaporized source materials are successively supplied into the chamber to form the DyScO3 film on the substrate by ALD. The Dy source material inlcudes the Dy(EDMDD)3. The Sc source material includes the Sc(EDMDD)3.
Abstract:
프로그램과 소거 동작에서 문턱전압의 극대화와 속도의 향상을 가져오는 전하트랩층을 포함하는 메모리소자를 제공한다. 그 소자는 반도체 기판 상에 배치된 터널절연막 상에 배치되고, 정공(hole) 트랩 밀도가 높은 제1 질화막과 전자(electron) 트랩 밀도가 높은 제2 질화막의 적어도 하나 쌍으로 이루어진 전하트랩층을 포함한다. 전하트랩층, 정공 트랩밀도, 전자 트랩밀도, 질화막
Abstract:
A nonvolatile memory device is provided to improve program/erase operations in case of a low operational voltage is applied to a gate electrode by employing a blocking layer including an LaAlO3 layer. A tunnel layer(110) is formed on a semiconductor substrate(100). A charge trap layer(120) is formed on the tunnel layer. A blocking layer(130) is formed on the charge trap layer. The blocking layer includes an LaAlO3 layer(134). A gate electrode(140) is formed on the blocking layer. Source/drain regions(160) are formed to be aligned to the gate electrode. The blocking layer is a laminated structure of a first Al2O3 layer(136), the LaAlO3 layer, and a second Al2O3 layer. A width of the gate electrode is smaller than that of the blocking layer. A dielectric is formed on an upper surface of the blocking layer on which the gate electrode is not formed.
Abstract translation:提供一种非易失性存储器件,用于通过采用包括LaAlO 3层的阻挡层将低工作电压施加到栅电极的情况下改善编程/擦除操作。 隧道层(110)形成在半导体衬底(100)上。 在隧道层上形成电荷捕获层(120)。 在电荷陷阱层上形成阻挡层(130)。 阻挡层包括LaAlO 3层(134)。 在阻挡层上形成栅电极(140)。 源极/漏极区域(160)形成为与栅电极对准。 阻挡层是第一Al 2 O 3层(136),LaAlO 3层和第二Al 2 O 3层的层叠结构。 栅电极的宽度小于阻挡层的宽度。 在没有形成栅电极的阻挡层的上表面上形成电介质。
Abstract:
A non-volatile memory device and a manufacturing method thereof are provided to electrons trapped in a charge trapping layer pattern by removing side portions of the charge trapping layer pattern through isotropic etching. A tunnel insulating layer pattern(140) is formed on a channel region of a substrate(100). A charge trapping layer pattern(144) is formed on the tunnel insulating layer pattern to trap electrons from the channel region. A dielectric layer pattern(136) is formed on the charge trapping layer pattern, and a gate electrode is formed on the dielectric layer pattern. Spacers(132) are formed on sidewalls of the gate electrode. The charge trapping layer pattern has a width smaller than a distance between outer surfaces of the spacers. The width of the charge trapping layer pattern is smaller than that of the tunnel insulating layer pattern.
Abstract:
A method for fabricating a non-volatile memory device is provided to improve the threshold voltage and leakage current characteristic of the device by forming a gate structure on a channel region. A tunnel insulation layer(102) having a first thickness is formed on a substrate(100) having a channel region through a thermal oxidization process. A second tunnel insulation layer(104) having a second thickness shallower than the first thickness is formed on the first tunnel insulation layer. A charge trapping layer(106) is formed on the tunnel insulation layer to trap electrons in the channel region, and then a blocking layer(108) is formed on the charge trapping layer. A conductive layer(110) is formed on the blocking layer. The conductive layer, the blocking layer, the charge trapping layer, the second tunnel insulation layer and the first tunnel insulation layer are patterned to form a gate structure on the channel region.
Abstract:
웨이퍼 에지 부분의 손상을 방지하고 웨이퍼 전체에 균일한 세정력을 제공할 수 있는 세정 프로브 및 이를 구비하는 메가소닉 세정 장비를 제공한다. 상기 세정 프로브는 웨이퍼 중심 부근에 위치하는 전방부; 압전 변환기에 연결되는 후방부; 및 상기 후방부와 상기 전방부 사이에 위치하며 상기 웨이퍼의 가장자리 부분 상에 위치하되 상기 전방부에 비해 넓은 단면적을 갖는 돌출부를 구비한다. 메가소닉 세정 장비, 세정 프로브
Abstract:
웨이퍼 에지 부분의 손상을 방지하고 웨이퍼 전체에 균일한 세정력을 제공할 수 있는 세정 프로브 및 이를 구비하는 메가소닉 세정 장비를 제공한다. 상기 세정 프로브는 웨이퍼 중심 부근에 위치하는 전방부; 압전 변환기에 연결되는 후방부; 및 상기 후방부와 상기 전방부 사이에 위치하며 상기 웨이퍼의 가장자리 부분 상에 위치하되 상기 전방부에 비해 넓은 단면적을 갖는 돌출부를 구비한다. 메가소닉 세정 장비, 세정 프로브
Abstract:
PURPOSE: A portable terminal and a security service method using the same are provided to sense an external circumstance, and automatically dial, and generate an alarm sound by a sensor when an emergency situation occurs. CONSTITUTION: A sensor(210) senses an external circumstance of a terminal and converts it into an electric signal. An automatic dial processor(220) generates an automatic dialing signal when the electric signal from the sensor(210) is greater than a predetermined voltage. A transmitter(240) transmits a corresponding signal to a stored telephone number according to the automatic dialing signal from the automatic dial processor(220). An alarm signal section(230) receives an electric signal from a shock sensor(217) and generates an alarm sound. An output section(250) outputs the alarm sound from the alarm signal section(230).