반도체 소자
    1.
    发明公开
    반도체 소자 审中-实审
    半导体器件

    公开(公告)号:KR1020170101729A

    公开(公告)日:2017-09-06

    申请号:KR1020160024710

    申请日:2016-02-29

    Abstract: 소자의성능을향상시킬수 있는구조를가지는반도체소자를제공한다. 본발명에따른반도체소자는기판으로부터돌출되는제1 방향으로연장되는핀형활성영역, 핀형활성영역의상면으로부터이격된위치에서핀형활성영역의상면과평행하게연장되고각각채널영역을가지는복수의나노시트, 핀형활성영역상에서제1 방향과교차하는제2 방향으로연장되고복수의나노시트각각의적어도일부를포위하는게이트, 복수의나노시트에연결된소스/드레인영역, 소스/드레인영역과의사이에에어스페이스를가지도록핀형활성영역및 복수의나노시트의사이의공간에개재되는절연스페이서를포함한다.

    Abstract translation: 提供了具有能够改善器件性能的结构的半导体器件。 根据本发明的半导体装置是销形的有效区,所述销状,在与平行于所述销形的有效区的顶面延伸的活性区域的上表面间隔开的位置上的多个具有在第一方向延伸的各自的沟道区纳米片从衬底突出 中,第一方向和之间的空气在第二方向交叉延伸并围绕所述多个纳米片,每个的至少一些栅极,源极/漏极连接到所述多个纳米片,源区/上的销形的有效区漏区 绝缘间隔物插入在鳍状有源区和多个纳米片之间的空间中,以在其间具有空间。

    영상처리장치 및 그 제어방법
    2.
    发明公开
    영상처리장치 및 그 제어방법 审中-实审
    图像处理装置及其控制方法

    公开(公告)号:KR1020170083415A

    公开(公告)日:2017-07-18

    申请号:KR1020160002840

    申请日:2016-01-08

    Abstract: 본발명은영상처리장치에관한것으로서, 영상의인물영역의경계에관한모델정보를저장하는저장부와; 처리되는영상에서대상영역의경계를결정하고, 상기저장부에저장된모델정보에기초하여상기결정된대상영역의경계가상기인물영역의경계에대응하는경우, 상기대상영역에대하여상기인물영역에관한영상처리가수행되도록제어하는제어부를포함한다. 이에의하여, 상기처리되는영상으로부터상기대상영역을용이하게추출할수 있다.

    Abstract translation: 图像处理设备技术领域本发明涉及一种图像处理设备,并且更具体地涉及一种图像处理设备,其包括用于存储与图像的字符区域的边界有关的模型信息的存储单元; 确定待处理图像中的对象区域的边界,并且当确定的对象区域的边界与基于存储在存储部分中的模型信息的人区域的边界相对应时, 并控制要执行的处理。 因此,可以容易地从处理后的图像中提取对象区域。

    반도체 기판 및 이를 포함하는 반도체 장치
    3.
    发明公开
    반도체 기판 및 이를 포함하는 반도체 장치 审中-实审
    半导体衬底和包括其的半导体器件

    公开(公告)号:KR1020160091173A

    公开(公告)日:2016-08-02

    申请号:KR1020150011490

    申请日:2015-01-23

    Abstract: 역으로경사진스트레인해방층을사용하여, 관통전위(threading dislocation)의밀도를감소시킨반도체기판을제공하는것이다. 상기반도체기판은일면은베이스기판, 상기베이스기판상의제1 실리콘게르마늄층, 및상기제1 실리콘게르마늄층상의제2 실리콘게르마늄층으로, 상기제2 실리콘게르마늄층의게르마늄분율은상기베이스기판으로부터멀어짐에따라감소하고, 상기제2 실리콘게르마늄층의최하부의게르마늄분율은상기제1 실리콘게르마늄층의최상부의게르마늄분율보다큰 제2 실리콘게르마늄층을포함한다.

    Abstract translation: 本发明的目的是提供一种通过使用相反倾斜的应变释放层来降低穿透位错的密度的半导体衬底。 半导体衬底包括:一侧的基底衬底; 在基底基板上的第一硅锗层; 以及在所述第一硅锗层上的第二硅锗层。 第二硅锗层的锗部分随着越来越远离基底而减小。 第二硅锗层的最低单元的锗部分高于第一硅锗层的最高单位的锗部分。

    반도체 소자의 제조 방법
    4.
    发明公开
    반도체 소자의 제조 방법 有权
    制造半导体器件的方法

    公开(公告)号:KR1020160024058A

    公开(公告)日:2016-03-04

    申请号:KR1020140109653

    申请日:2014-08-22

    Abstract: 반도체소자의제조방법은기판상에채널막을형성하는것, 상기채널막상에희생막을형성하는것, 상기희생막상에하드마스크패턴을형성하는것, 및상기하드마스크패턴을식각마스크로사용하여상기하드마스크패턴에노출된상기희생막및 상기채널막을식각하여, 상기희생막이제거되어상부면이드러난채널부를형성하는것을포함하되, 상기채널막은 SiGe(0≤y

    Abstract translation: 一种制造半导体器件的方法包括以下步骤:在衬底上形成通道膜; 在沟道膜上形成牺牲膜; 在牺牲膜上形成硬掩模; 并且通过使用硬掩模图案作为蚀刻掩模蚀刻牺牲膜和暴露于硬掩模图案的沟道膜,形成具有暴露的上平面的通道部分作为牺牲膜。 沟道膜是Si_(1-y)Ge_y(0 <= y <1)膜,牺牲膜是Si_(1-z)Ge_z(0 <= z <1),其中锗(Ge_z )比通道膜的锗(Ge_y)的含量多。 本发明的目的是提供可以进一步提高可靠性的半导体器件的制造方法。

    비휘발성 메모리 셀 및 이를 포함하는 비휘발성 메모리 장치
    6.
    发明公开
    비휘발성 메모리 셀 및 이를 포함하는 비휘발성 메모리 장치 无效
    非易失性存储器单元和包含单元的非易失性存储器件

    公开(公告)号:KR1020120135858A

    公开(公告)日:2012-12-17

    申请号:KR1020110146159

    申请日:2011-12-29

    Abstract: PURPOSE: A nonvolatile memory cell and a non-volatile memory device including the same are provided to improve voltage and current characteristics by including a diffusion barrier film which prevents the diffusion of conducting material. CONSTITUTION: A first inter-layer insulating film(111) and a second inter-layer insulating film(112) are separated each other and are successively laminated. A first electrode(115) passes through the first inter-layer insulating film and the second inter-layer insulating film. A resistance alteration film(116) is formed side by side with the first electrode along the side of the first electrode. A second electrode is formed between the first inter-layer insulating film and the second inter-layer insulating film. A diffusion barrier film prevents the diffusion of conducting material including a conductive film.

    Abstract translation: 目的:提供一种非易失性存储单元和包括该非易失性存储单元的非易失性存储器件,以通过包括防止导电材料扩散的扩散阻挡膜来改善电压和电流特性。 构成:第一层间绝缘膜(111)和第二层间绝缘膜(112)彼此分离并依次层叠。 第一电极(115)穿过第一层间绝缘膜和第二层间绝缘膜。 电阻变化膜(116)与第一电极沿着第一电极的侧面并排形成。 在第一层间绝缘膜和第二层间绝缘膜之间形成第二电极。 扩散阻挡膜防止包括导电膜的导电材料的扩散。

    비휘발성 반도체 메모리 장치의 제조 방법
    7.
    发明公开
    비휘발성 반도체 메모리 장치의 제조 방법 无效
    制造非易失性半导体存储器件的方法

    公开(公告)号:KR1020090074902A

    公开(公告)日:2009-07-08

    申请号:KR1020080000603

    申请日:2008-01-03

    CPC classification number: H01L27/11521 H01L21/28273 H01L29/517 H01L29/66825

    Abstract: A method of manufacturing a non-volatile semiconductor memory device is provided to solve lifting of a dielectric film and a control gate by removing an impurity from a floating gate efficiently through a thermal process. In a method of manufacturing a non-volatile semiconductor memory device, a turner insulating layer(18) is formed on a substrate(10). A first floating gate film(20) including a poly-silicon is formed on the turner insulating layer, and a second preliminary floating gate film including the first metal is formed on the first floating gate film. The second preliminary floating gate film is thermal-treated and the second floating gate film(22a) is formed. A dielectric layer is formed on the second floating gate film, and the control gate layer is formed on the dielectric layer.

    Abstract translation: 提供一种制造非挥发性半导体存储器件的方法,用于通过热处理有效地从漂浮栅去除杂质来解决电介质膜和控制栅极的提升。 在制造非易失性半导体存储器件的方法中,在衬底(10)上形成转子绝缘层(18)。 在所述转鼓绝缘层上形成包括多晶硅的第一浮栅(20),并且在所述第一浮栅上形成包括所述第一金属的第二初步浮栅。 第二初步浮栅膜进行热处理,形成第二浮栅膜(22a)。 在第二浮栅上形成电介质层,在电介质层上形成控制栅极层。

    플래시 메모리 소자 및 그 제조 방법
    8.
    发明公开
    플래시 메모리 소자 및 그 제조 방법 无效
    闪存存储器件及其制造方法

    公开(公告)号:KR1020090005648A

    公开(公告)日:2009-01-14

    申请号:KR1020070068844

    申请日:2007-07-09

    Abstract: The flash memory device and manufacturing method thereof are provided to prevent the electric charge tunneling between the gate electrodes and charge trapping layer and to improve data retention characteristic. The tunnel insulating layer(130) is formed on the substrate(110). The charge trapping layer(140) is formed on the tunnel insulating layer. The lower buffer layer(150) is formed on the charge trapping layer. The blocking film(160) is formed on the lower buffer layer. The first gate electrode(170) is formed on the blocking film. The second gate electrode(180) is formed on the first gate electrode. The lower buffer layer comprises the blocking film having no silicon. The blocking layer includes 3 element lanthanum compound.

    Abstract translation: 提供闪速存储器件及其制造方法,以防止栅电极和电荷捕获层之间的电荷隧穿,并提高数据保持特性。 隧道绝缘层(130)形成在基板(110)上。 电荷俘获层(140)形成在隧道绝缘层上。 下部缓冲层(150)形成在电荷俘获层上。 阻挡膜(160)形成在下缓冲层上。 第一栅电极(170)形成在阻挡膜上。 第二栅电极(180)形成在第一栅电极上。 下缓冲层包括没有硅的阻挡膜。 阻挡层包括3元素镧化合物。

    비휘발성 메모리 소자 및 그 제조방법
    9.
    发明公开
    비휘발성 메모리 소자 및 그 제조방법 失效
    非易失性存储器件及其制造方法

    公开(公告)号:KR1020080097006A

    公开(公告)日:2008-11-04

    申请号:KR1020070042057

    申请日:2007-04-30

    Abstract: A non-volatile memory device is provided to have the excellent electron storage capability by including the nano dots. The manufacturing method of the non-volatile memory device includes the step of forming the tunnel insulating layer(110) in the top of the substrate; the step of forming the charge storage layer(127) including the lanthanide nano dots(125) on the tunnel insulating layer; the step of forming the control gate layer on the charge storage layer; the step of forming a gate stack by patterning the control gate layer and the charge storage layer.

    Abstract translation: 提供非易失性存储器件以通过包括纳米点具有优异的电子存储能力。 非易失性存储器件的制造方法包括在衬底的顶部形成隧道绝缘层(110)的步骤; 在隧道绝缘层上形成包含镧系元素纳米点(125)的电荷存储层(127)的步骤; 在电荷存储层上形成控制栅极层的步骤; 通过图案化控制栅极层和电荷存储层来形成栅极堆叠的步骤。

    블로킹 산화막을 구비하는 플래쉬 메모리 소자의 제조 방법
    10.
    发明公开
    블로킹 산화막을 구비하는 플래쉬 메모리 소자의 제조 방법 失效
    制造具有阻塞氧化膜的闪存存储器件的方法

    公开(公告)号:KR1020080028699A

    公开(公告)日:2008-04-01

    申请号:KR1020060094332

    申请日:2006-09-27

    Abstract: A flash memory device having a blocking oxide layer and a method for manufacturing the same are provided to improve an interface characteristic and to suppress generation of leakage current by forming a first and second blocking oxide layers. A tunneling oxide layer(110) is formed on a semiconductor substrate(100). An electric charge storage layer(120) is formed on the tunneling oxide layer. A first blocking oxide layer(132) is formed on the electric charge storage layer under a first temperature condition. A second blocking oxide layer(134) is formed on the first blocking oxide layer under a second temperature condition higher than the first temperature condition. A gate electrode(140) is formed on the second blocking oxide layer. The first temperature is selected within a range of room temperature to 600 °C.

    Abstract translation: 提供具有阻挡氧化物层的闪存器件及其制造方法,以改善界面特性并通过形成第一和第二阻挡氧化物层来抑制漏电流的产生。 隧道氧化物层(110)形成在半导体衬底(100)上。 在隧道氧化物层上形成电荷存储层(120)。 在第一温度条件下,在电荷存储层上形成第一阻挡氧化物层(132)。 在高于第一温度条件的第二温度条件下,在第一阻挡氧化物层上形成第二阻挡氧化物层(134)。 在第二阻挡氧化物层上形成栅电极(140)。 第一温度在室温至600℃的范围内选择。

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