Abstract:
도파로 구조체가 제공된다. 이 도파로 구조체는 서로 이격되어 슬롯을 정의하는 제 1 및 제 2 패턴들을 구비하는 슬롯형 채널 도파로, 채널 도파로의 적어도 일부를 덮는 제 1 상부막 및 채널 도파로의 나머지를 덮는 제 2 상부막을 구비한다. 이때, 채널 도파로의 온도 계수와 제 2 상부막의 온도 계수의 곱은 음수이다.
Abstract:
A semiconductor optoelectronic integrated circuit and a forming method thereof are provided to increase a degree of integration by arranging an optical active element on an optical grating of an optical waveguide. A semiconductor optoelectronic integrated circuit includes an optical waveguide(105), an optical grating(107), and an optical active element. The optical waveguide is arranged on a substrate. The optical waveguide includes an input terminal and an output terminal. The optical grating is formed on the optical waveguide. The optical active element is formed on the optical grating. The optical active element receives an optical signal from the optical waveguide through the optical grating. The optical active element modulates the received optical signal.
Abstract:
A semiconductor device and a forming method thereof are provided to integrate various kinds of semiconductor devices on the same substrate by using a local SOI(Silicon On Insulator) structure. An ion implantation mask is formed on an upper surface of a substrate(110). A buried insulating layer(155) is locally formed within the substrate. An ion implantation layer is formed by performing an ion implantation process using the ion implantation mask. A buried insulating layer is locally formed within the substrate by performing a thermal process. An opening for exposing the buried insulating layer is formed by etching the substrate. A silicon pattern(145) separated from the substrate is formed in at least one direction on the buried insulating layer. A first insulating layer is formed to surround the silicon pattern.
Abstract:
A hybrid laser diode for a single mode operation and a manufacturing method thereof are provided to generate a single mode laser by having a coupling coefficient reducing a diffraction grating formed in a bonding layer with the thin thickness. A hybrid laser diode includes a silicon layer(114), an active pattern, and a bonding layer(500). The active pattern is arranged on the silicon layer. The bonding layer is arranged between the silicon layer and the active pattern. The bonding layer includes diffraction patterns comprising a bragg grating. The diffraction patterns of the bonding layer are formed to define the openings to expose the silicon layer. The openings are arranged with an interval to satisfy a bragg condition corresponding to the wavelength of the light generated in the hybrid laser diode.
Abstract:
A semiconductor laser diode using change of an energy band structure is provided to raise an electric barrier through a critical value changing from type 1 to type 2. A semiconductor laser diode using change of an energy band structure includes an active layer, a cladding layer, a second compound semiconductor layer, and a third compound semiconductor layer. The active layer has a structure of a quantum well. The cladding layer is contacted to one side of the active layer, and is composed of a first compound semiconductor layer. The second compound semiconductor layer is contacted to the other end of the active layer, and forms an energy step for the active layer. The third compound semiconductor layer is inserted into the second semiconductor layer, and separates the second compound semiconductor layer to have a critical point having a non-conductive band energy step of "0" with the second compound semiconductor layer.
Abstract:
A method for etching a multi-layer of group III-V semiconductor materials and a method for manufacturing a vertical cavity surface emitting laser device are provided to obtain clearness and smoothness of an etched surface by etching the multi-layer with plasma of a mixed gas including Cl2, Ar, CH4, and H2. A first semiconductor layer(22) is formed with group III-V semiconductors. A second semiconductor layer(24) is formed with group III-V semiconductors that are different from the group III-V semiconductors of the first semiconductor layer. A method for etching a lamination structure including the first and second semiconductor layers includes a process for etching the lamination structure by exposing the lamination structure to plasma of a mixed gas including Cl2, Ar, CH4, and H2.
Abstract:
A long-wavelength VCSEL is provided. The laser includes a first conductive semiconductor substrate, lower mirror layers that are formed on the semiconductor substrate and are proper to the Bregg-reflection, an active layer formed on the lower mirror layer, a current passage layer that is formed on the active layer as a path through which an electric current flows into the active layer, current blocking layers that are formed on the active layer to encompass the current passage layer and limit the path through which an electric current flows into the active layer, an intra-cavity contact layer formed on a portion of the current passage layer and the current blocking layer, upper mirror layers that are formed on a portion of the intra-cavity contact layer and are proper to the Bragg-reflection, a first electrode formed on the exposed surface of the intra-cavity contact layer and the upper mirror layers, and a second electrode formed on a predetermined surface of the semiconductor substrate
Abstract:
A folded cavity laser for generating a laser beam, includes a substrate provided with a distributed Bragg reflector (DBR); an active medium formed above the DBR for amplifying the laser beam; a first and a second mirrors formed on sides of the active medium, respectively, for making a horizontal cavity and for reflecting the amplified laser beam to the DBR; and a microlens, formed on the substrate opposite the DBR, for making the amplified laser beam astigmatic after passing therethrough.
Abstract:
PURPOSE: A multi-channel long wavelength VCSEL array and a fabricating method thereof are provided to form constantly an interval of a laser oscillation wavelength by controlling a resonant interval. CONSTITUTION: A multi-channel long wavelength VCSEL array includes a semiconductor substrate(10), a bottom mirror(20), an active region(30), a current limit layer(40), a superlattice control layer(50), and a top mirror(60). The bottom mirror is formed on the semiconductor substrate. The active region is formed on the bottom mirror. The current limit layer is formed on the active region in order to limit efficiently the current and enhance the efficiency of the heat transfer. The superlattice control layer is formed on the current limit layer in order to control an interval of laser oscillation wavelength. The top mirror is formed on the superlattice control layer.