Abstract:
PROBLEM TO BE SOLVED: To provide a field programmable gate array (FPGA) which can shorten a configuration time and a time for rewriting wiring information and logic arrangement information, and can reduce its occupation area. SOLUTION: For storing FPGA wiring information, magnetic memory elements MTJ1 to MTJn are provided as MRAM memory cells. A shift register 71 is used to input the wiring information to the magnetic memory elements MTJ1 to MTJn. The register 71 includes register elements SR1 to SRn corresponding to the magnetic memory elements MTJ1 to MTJn. The wiring information are serially input to the register elements SR1 to SRn and stored therein. When the power is turned on, the wiring information of the magnetic memory elements MTJ1 to MTJn are latched by latch elements LT1 to LTn and output to a switch circuit 6 for interconnecting logic blocks. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To retain a latch status in a logic circuit which is on stand by status without losing original features in the logic circuit which achieves low electric power consumption and high speed performance using a MTCMOS circuit. SOLUTION: Power source lines Vdd and Vss, and virtual power source lines v-Vdd and v-Vss are connected with MOSFETHvt-Tr1 and Hvt-Tr2 which have high threshold voltage. Power source is supplied from v-Vdd and v-Vss to the combinational logic circuit 1 and nonvolatile latch circuits NVL1 to n. NVL1 to n are connected to arbitrary nodes which require status report on the stand by status in the combinational logic circuit 1. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a nonvolatile latch circuit in which nonvolatile memory elements are individually arranged within a logic circuit. SOLUTION: Tunnel magneto resistive elements MTJ0 and MTJ1 are connected to the respective sources of inverters INV1 and INV2 having a C-MOS structure and output and input of the inverters INV1 and INV2 are mutually cross connected. Transistors Tr5 and Tr6 which are used for precharging are connected to the output of the inverters and a transistor Tr7 is arranged between the elements MTJ0 and MTJ1 and the ground. Data are written into the elements MTJ0 and MTJ1 by the current that is flowing in a data writing line DWL and the states recorded in the elements MTJ0 and MTJ1 are taken out to an output OUT and an output OUT bar by REFRESHN signals.
Abstract:
PROBLEM TO BE SOLVED: To reduce a test cost by omitting a shifting process in which a chip on a wafer is shifted from a test device to a cutting device once to cut a fuse of a fuse circuit block in a conventional fuse circuit block. SOLUTION: This device is provided with two non-volatile storage elements 16, 18 storing data of connection or cut off of a fuse circuit, a circuit changing the direction of magnetization of this non-volatile storage elements 16, 18, and a current mirror circuit reading data stored in the non-volatile storage elements 16, 18.
Abstract:
PROBLEM TO BE SOLVED: To provide a nonvolatile magnetic memory cell and a storage circuit block employing the same. SOLUTION: A nonvolatile memory cell 32 includes a bit line 14; a storage element 10, including a ferromagnetic layer in which its magnetizing direction varies, depending on the direction of the magnetic field generated by a current flowing through the bit line 14; a conductor 12 for connecting the bit line 14 to the element 10, a switching element 28; a first wiring structure 24 sandwiching the element 10 between the conductors 12 and itself, and connecting the element 10 to one end of the element 28; a write work line 16 intersecting with the bit line 14 in a no-contact manner therewith; and an insulation film 20 for insulating the work line 16 from the element 10.
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability of recording of a MRAM. SOLUTION: This device has read-out word lines WLR and write-in word lines WLW extending in the direction of (y), and write-in read-out bit lines BLW/R and write-in bit lines BLW extending in the direction of (x), and a memory cell MC is arranged at an intersection of a word line and a bit line. The memory cell MC comprises a sub-cell SC1 and a sub-cell SC2, the sub-cell SC1 comprises magnetic resistance elements MTJ1, MTJ2, and a selection transistor Tr1, and the sub-cell SC2 comprises magnetic resistance elements MTJ3, MTJ4, and a selection transistor Tr2, and the sub-cell SC2, The magnetic resistance elements MTJ1 and MTJ2 are connected in parallel, also, the magnetic resistance elements MTJ3 and MTJ2 are connected in parallel. The sub- cells SC1 and SC2 are connected in series between the write-in read-out bit lines BLW/R and ground.
Abstract:
PROBLEM TO BE SOLVED: To shorten a pre-charging time by providing plural DRAM cells and sense amplifiers respectively in response to plural DRAM cells and activating only the sense amplifier answering to the cell to be accessed among plural DRAM cells. SOLUTION: A DRAM 10 contains a pre-fetch/latch circuit 14, an output buffer 18 connected to the pre-fetch/latch circuit 14 and a pre-load/latch circuit 16 connected to a sense amplifier part 26. Data of 32 pieces of memory cells 20 on a word line 22 are stored in the pre-fetch/latch circuit 14, and the data are read out from the output buffer 18 to four respective outputs. At a writing, the data inputted to plural respective inputs are stored temporarily in the pre- load/latch circuit 16, and when all the 32 pieces of data are inputted, they are written simultaneously in 32 pieces of memory cells 20. The data are pre-loaded to the pre-load/latch circuit 16, and are written back in batch to be automatically pre-charged.
Abstract:
PURPOSE: To provide a reliable high-density semiconductor integrated circuit device with high-speed operation by forming a DRAM macrocell and a logical cell in a common chip. CONSTITUTION: A DRAM macroscopic cell 14 is formed on the same cell as a logical cell. The DRAM macroscopic cell 14 includes a guard ring 26 of a conductive type opposite to that of a semiconductor substrate, a memory cell alley 42 formed in a well in the guard ring 26, a power line 34, a grounding line 36, and a bypass capacitor 70 joined between the power line 34 and the grounding line 36. The power line 36 and a logical-cell power line are connected to different power pads, while the grounding line 36 and a logic-cell grounding line are connected to a common grounding line or to grounding lines provided near to each other and connected with a low impedance line.
Abstract:
PURPOSE: To reduce the power dissipating amounts of a bit line by providing a DRAM structure using a variable precharge voltage detecting technique. CONSTITUTION: In the end of a row address storage(RAS) cycle, a bit line 10 and a complementary bit 12 are short-circuited, and short-circuited through a line 32 with VEQ by equalizing devices 18, 20, and 22, and balancing is operated by bit line precharge in the next RAS cycle. This voltage is higher than the precharge voltage in the previous cycle. When a capacitance 88 of a memory cell to which access is performed stores 0V, the bit line precharge voltage is made lower than that in the previous RAS cycle. When a high level is stored in the cell capacitance of the cell connected with a word line and accessed in each following cycle, the same sequence is repeated in the following RAS cycle, and the bit line precharge voltage is increased in each cycle. Then, a bit line power can not be drawn from a DRAM power source by the balancing with a bit line pair voltage.
Abstract:
PURPOSE: To obtain a read only memory wherein density is high, manufacturing cost is low, and row selection/sensing constitution is simple, by applying one out of four states of a diffusion region which has the same conductivity type as a substrate and impurity layer concentration higher than the substrate and a channel region part. CONSTITUTION: An FET of a memory cell is programed by applying one out of four kinds of P impurity diffusion patterns to a channel region. The four kinds of diffusion patterns are (A) a case wherein P impurity diffusion region is not contained in the channel region, (B) a case wherein a P impurity diffusion region 30 is contained only in a channel region part of the drain 20 side, (C) a case wherein a P impurity diffusion region 32 is contained only in a channel region part of the source 22 side, (D) a case wherein a P impurity diffusion region 34 is contained in both of the channel region parts of the drain side and the source side. When the above combination is properly set, one out of four saturation currents can be generated in one direction. The FET's have the same dimension, and the respective P impurity diffusion regions can have the same impurity density by using the minimum design rule. Manufacturing is enabled one time with a masking/P ion implantation process.