Abstract:
PROBLEM TO BE SOLVED: To provide an antireflection film forming composition capable of giving a resist pattern excellent in resolution, accuracy, etc., and to provide a method for producing an antireflection film. SOLUTION: The antireflection film forming composition is prepared such that it contains a polymer (a) which is a ring-opened polymer of at least one derivative shown by formula (1) [where A and D each denote H or a hydrocarbon group; and B and C each denote H, a hydrocarbon group, halogen, a halogen substituted hydrocarbon group, -(CH 2 ) n COOR 1 , -(CH 2 ) n COR 2 , -(CH 2 ) n OCOR 3 , -(CH 2 )CN, -(CH 2 ) n CONR 4 R 5 , -(CH 2 ) n OR 6 , -(CH 2 )R 7 or -(CH 2 ) n M, or B and C together form -CO-O-CO- or -CO-NR 8 -CO-] or a polymer which is copolymer of the derivative and another copolymerizable monomer and a polymer (b) having at least one aromatic ring structure. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an acid-dissociable group-containing compound applicable to radiation having ≤193 nm wavelength, excellent in dry etching, suitable as a chemical amplification type resist having high contrast and useful as additive component, etc., of a radiation-sensitive resin composition and to provide the radiation-sensitive resin composition. SOLUTION: The acid-dissociable group-containing compound has a group represented by general formula (α) (wherein R 1 is a 2-20C monovalent acid-dissociable group; R 2 and R 3 are mutually independently a hydrogen atom or fluorine atom; R 4 is an oxygen atom or a sulfur atom) and a cyclic hydrocarbon group. The radiation-sensitive resin composition comprises (A) a resin becoming readily alkali-soluble by action of an acid or an alkali-soluble resin, (B) a radio-sensitive acid generating agent and (C) the acid-dissociable group-containing compound. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a new polysiloxane which exhibits a high transparency at a wavelength of 193 nm or less and is excellent in dry etching resistance, especially in environmental resistance; a new silicon-containing compound useful e.g. as a raw material for synthesizing the polysiloxane; and a radiation-sensitive resin composition containing the polysiloxane. SOLUTION: The silicon-containing compound is represented by formula (1) (wherein X 1 is an optionally substituted 2-20C divalent hydrocarbon group; R 1 and R 2 are each H, a halogen, an alkoxy group or an optionally halogenated hydrocarbon group, provided each of two or three R 1 's are a halogen or an alkoxy group; and m and n are each 0, 1, 2 or 3, provided (m+n) COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency at ≤193 nm wavelength and excellent basic physical properties as a resist such as resolution or the like and suitable as a chemically amplifying resist. SOLUTION: The radiation-sensitive resin composition contains (A) an acid dissociable group-containing resin such as a resin having a repeating unit expressed by formula (a-1) and/or a repeating unit expressed by formula (a-2) and a repeating unit expressed by formula (b-1) and/or a repeating unit expressed by formula (b-2) and (B) a radiation-sensitive acid generating agent which generates an acid, typified as trifluoromethanesulfonic acid, nonafluoro-n- butanesulfonic acid, 2-(2-norbornyl)-1,1,2,2-tetrafluoroethanesulfonic acid, or the like. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To obtain a new silicon-containing alicyclic compound useful as a raw material, etc., for a polysiloxane-based resin used for a chemical amplifying type resist excellent in dry etching resistance, transparency, resolution, developability, etc., for radiations. SOLUTION: This silicon-organic alicyclic compound has a structure in which t-butoxycarbonyl group and a (substituted) silyl group are bound to bicyclo[2.2.1]heptane ring or a ring in which the 2-4 bicyclo[2.2.1]heptane rings are condensed and is represented by 2-trimethoxysilyl-5-t- butoxycarbonylbicyclo[2.2.1]heptane, 2-methyldiethoxysilyl-5-t- butoxycarbonylbicyclo[2.2.1]heptane, 3-trimethoxysilyl-8-t- butoxycarbonyltetracyclo[4.4.0.12,517,10]dodecane or a cyclic polysiloxane derivative thereof, etc.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist, e.g. sensitivity, resolution and pattern shape, excellent also in shelf stability as a composition and retaining satisfactory adhesiveness to a substrate. SOLUTION: The radiation sensitive resin composition contains (A) a low molecular compound obtained by preparing a compound having one or more amino groups with at least one hydrogen atom bonding to a nitrogen atom and substituting a t-butoxycarbonyl group for one or more of such hydrogen atoms bonding to a nitrogen atom, (B) a radiation sensitive acid generating agent and (C) an alkali-insoluble or slightly alkali-soluble acid dissociable group- containing resin having an alicyclic structure in the principal chain and/or a side chain and a carboxylic acid anhydride structure in a side chain and convertible to an alkali-soluble resin when the acid dissociable group is dissociated.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including dry etching resistance, sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) an abietic acid derivative of formula 1 [where R1-R4 are each H, hydroxyl, a 1-4C linear or branched alkyl or a 1-4C linear or branched alkoxyl and R5 is H, an optionally substituted 1-20C alkyl or -CH2COO6 (R6 is a 1-18C alkyl)].
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) a compound of formula 1 [where Z is an n-valent hydrocarbon group having an alicyclic carbon ring in which the total number of ring forming carbon atoms is 4-20 or its derivative and (n) is an integer of 1-4].
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in basic physical resist properties such as sensitivity and resolution and showing only a small sensitivity change due to long-term storage. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin having a 3-30C alicyclic skeleton substituted by a group of formula 1 [where R1 is a group of formula 2 (where R2 and R3 are each a 1-4C alkyl or combine to each other to form a 3- to 8-membered cyclic structure) or formula 3 (where R4 is a 1-4C alkyl)] and convertible to an alkali-soluble resin when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide an N-sulfonyloxyimide compound which can highly sensitively and efficiently generate an acid, is free from the problems of evaporation and side-reactions, can inhibit a dark reaction on the storage of resists, and is useful as the radiation-sensitive acid-generating agent component of a radiation-sensitive chemical amplification type resist, and to provide a positive type and negative type radiation-sensitive resin composition using the same. SOLUTION: The N-sulfonyloxyimide compound represented by formula (1) X is a single bond or a double bond; Y and Z are each independently H, or together form a cyclic structure; R is a group represented by the general formula (2) [X1 is an organic group having an ester bond; R1 is an alkyl or alkoxy; (m) is an integer of 1 to 11; (n) is an integer of 0 to 10; (m)+(n)