公开(公告)号：AU2003233432A1

公开(公告)日：2003-10-20

申请号：AU2003233432

申请日：2003-03-25

Applicant: LAM RES CORP

Inventor： LEE STEVE ,  LEE CHRIS ,  YAMAGUCHI YOKO ,  VAHEDI VAHID ,  EPPLER AARON ,  KAMP TOM A ,  GOTTSCHO RICHARD

IPC: H01L21/3065 ,  H01L21/00 ,  H01L21/311 ,  H01L21/683 ,  H01L21/768 ,  H01L21/324 ,  H01L21/68

Abstract: An etch processor for etching a wafer includes a chuck for holding the wafer and a temperature sensor reporting a temperature of the wafer. The chuck includes a heater controlled by a temperature control system. The temperature sensor is operatively coupled to the temperature control system to maintain the temperature of the chuck at a selectable setpoint temperature. A first setpoint temperature and a second setpoint temperature are selected. The wafer is placed on the chuck and set to the first setpoint temperature. The wafer is then processed for a first period of time at the first setpoint temperature and for a second period of time at the second setpoint temperature.

公开(公告)号：AU2002356543A1

公开(公告)日：2003-04-28

申请号：AU2002356543

申请日：2002-10-09

Applicant: LAM RES CORP

Inventor： VAHEDI VAHID ,  BENJAMIN NEIL ,  SINGH HARMEET ,  COOPERBERG DAVID J ,  RATTO DOUGLAS

IPC: H05H1/46 ,  C23C16/44 ,  C23C16/455 ,  C23C16/507 ,  C23F4/00 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065 ,  C23C16/50

Abstract: A tunable multi-zone injection system for a plasma processing system for plasma processing of substrates such as semiconductor wafers. The injector can include an on-axis outlet supplying process gas at a first flow rate to a central zone and off-axis outlets supplying the same process gas at a second flow rate to an annular zone surrounding the central zone. The arrangement permits modification of gas delivery to meet the needs of a particular processing regime by allowing independent adjustment of the gas flow to multiple zones in the chamber. In addition, compared to consumable showerhead arrangements, a removably mounted gas injector can be replaced more easily and economically.