Abstract:
A semiconductor memory, particularly of the electrically programmable and erasable type such as a flash memory, comprises at least one two-dimensional array (SCT) of memory cells (MC) with a plurality of rows (row0-row511) and a plurality of columns (COL) of memory cells. The columns of the two-dimensional array are grouped in a plurality of packets (CP0-CP1), and the memory cells belonging to the columns of each packet are formed in a respective semiconductor region (4) with a first type of conductivity, this region (4) being distinct from the semiconductor regions (4) with the first type of conductivity in which the memory cells belonging to the columns of the remaining packets are formed. The semiconductor regions with the first type of conductivity divide the set of memory cells belonging to each row into a plurality of subsets of memory cells that constitute elemental memory units which can be modified individually. It is thus possible to produce memory units of very small dimensions (for example, bytes, words, or long words) which can be erased individually, without excessive overhead in terms of area.
Abstract:
The sensing circuits (30, 31, 32) comparing the current flowing in the cell with a plurality of reference currents are not identical to each other but differently amplify the compared currents. In particular, the sensing circuit (32) associated with the lowest reference current (I R3 ) amplifies (33b) the cell current more than the other sensing circuits (30, 31) and to the respective reference current (33c). The current dynamics is thereby increased and it is possible to keep the reading voltage low, since the inherent characteristic of the lowest reference current (I R3 ) may be very close to or directly superimposed on that of the immediately preceding memory cell current distribution (I M3 ), retaining the possibility of discriminating between the different logic levels.
Abstract:
The reading method comprises the steps of: supplying simultaneously two memory cells (F1, F2), both storing a respective unknown charge condition; generating two electrical quantities (Va, Vb), each correlated to a respective charge condition; comparing the two electrical quantities (Va, Vb) with each other; and generating a two-bit signal (01, 02) on the basis of the result of the comparison. The reading circuit comprises a two-input comparator (58) comprising two branches in parallel, each branch being connected to a respective memory cell by a current/voltage converter (41). Both the two-input comparator (58) and the current/voltage converter (41) comprise low threshold transistors (49, 50, 65-68).
Abstract:
The invention relates to a row decoding circuit for an electronic memory cell device, particularly in low supply voltage applications, being of the type adapted to boost, through at least one boost capacitor (Cboost), a read voltage to be applied to a memory column containing a memory cell to be read. The circuit is powered between a first supply voltage reference (Vpcx) and a second ground potential reference (GND), and comprises a hierarchic structure (13) of cascade connected inverters (15,16) and a circuit means of progressively raising the read voltage level dynamically. First means (Cboost0,D1) are provided for raising the read voltage level to a value equal to the supply voltage (Vpcx) plus a threshold voltage (Vtp), and second means (Cboost1,D2) are provided for raising the read voltage level to a value equal to the supply voltage (Vpcx) plus twice said threshold voltage (Vtp).
Abstract:
The invention relates to a method and a circuit for regulating a pulse synchronization signal (ATD) for the memory cell read phase in semiconductor integrated electronic memory devices. The pulse signal (ATD) is generated upon detection of a change in logic state of at least one of a plurality of address input terminals of the memory cells, so as to also generate an equalization signal (SAEQ) to a sense amplifier. The SAEQ pulse is blocked (STOP) upon the row voltage reaching a predetermined sufficient value to provide reliable reading. Advantageously, the pulse blocking is produced by a logic signal (STOP) activated upon a predetermined voltage value being exceeded during the overboost phase of the addressed memory row.
Abstract:
A voltage regulator (150I) integrated in a chip of semiconductor material is proposed. The regulator has a first input terminal for receiving a first voltage (Vhv) and an output terminal for providing a regulated voltage (Vreg) being obtained from the first voltage, the regulator including: a differential amplifier (205I) for receiving a comparison voltage (Vref) and a feedback signal (Vfb) being a function of the regulated voltage, and for proving a regulation signal (Vr) according to a comparison between the comparison voltage and the feedback signal, the differential amplifier having a first supply terminal being coupled with a reference terminal for receiving a reference voltage and a second supply terminal, a regulation transistor (MS) having a control terminal for receiving the regulation signal, and a conduction first terminal and a conduction second terminal being coupled through loading means (Rpup) between the reference terminal and the first input terminal of the regulator, the second terminal of the regulation transistor being coupled with the output terminal of the regulator, wherein the second supply terminal of the differential amplifier is coupled with a second input terminal of the regulator for receiving a second voltage (Vdd) being lower than the first voltage in absolute value, and wherein the regulator further includes a set of auxiliary transistors (MS1-MS5) being connected in series between the second terminal of the regulation transistor and the output terminal of the regulator, and control means (155) for controlling the auxiliary transistors according to the regulated voltage.
Abstract:
A column decoding system (140,150) for selectively biasing bit lines (BLij) of a non-volatile memory device (100) is disclosed. The bit lines are logically grouped into at least one packet (PBL). For each packet, the column decoding system includes a plurality of selection paths each one for applying a biasing voltage to a corresponding bit line, each path including a plurality of series-connected selection transistors (Mi,Mij,Pij) each one having a threshold voltage, and selection means for selecting a path (M1,M11,P11) corresponding to a selected bit line (BL11), the selection means including means for biasing at least one transistor (P12) in each non-selected path (M1,M12,P12) to an open condition to have the corresponding non-selected bit line (BL12) floating; the selection means further includes means for biasing at least one other transistor (M12) in each non-selected path to a drop condition to introduce a voltage drop in the non-selected path higher than the threshold voltage of said one transistor (P12) in absolute value.