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公开(公告)号：US09609439B2
公开(公告)日：2017-03-28
申请号：US15202368
申请日：2016-07-05
Applicant: Apple Inc.
Inventor： Janhavi S. Agashe , Jae H. Lee
CPC classification number: H04R23/008 , B81C1/00158 , B81C1/00341 , B81C2201/0174 , B81C2203/0785 , G01N21/01 , G01N21/4788 , G01N21/55 , G01N2201/0612 , H04R1/04 , H04R2201/003 , Y10T29/413
Abstract: A micro-electro-mechanical system (MEMS) optical sensor, method of detecting sound using the MEMS optical sensor and method of manufacturing. The MEMS optical sensor including a substrate having a base portion and a vertically extending support portion. The sensor further including a top plate having a compliant membrane configured to vibrate in response to acoustic waves, the top plate connected to the support portion and having a reflective surface. The sensor also includes a back plate connected to the support portion, the back plate having a grating portion positioned below the reflective surface portion and a base plate connected to the support portion at a position below the back plate. A light emitter, a light detector and circuitry operable to tilt the top plate and the back plate with respect to the base plate so as to direct the reflected laser light toward the light detector are further provided.
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公开(公告)号：US20150323456A1
公开(公告)日：2015-11-12
申请号：US14330723
申请日：2014-07-14
Applicant: Apple Inc.
Inventor： Janhavi S. Agashe , Jae H. Lee
CPC classification number: H04R23/008 , B81C1/00158 , B81C1/00341 , B81C2201/0174 , B81C2203/0785 , G01N21/01 , G01N21/4788 , G01N21/55 , G01N2201/0612 , H04R1/04 , H04R2201/003 , Y10T29/413
Abstract: A micro-electro-mechanical system (MEMS) optical sensor, method of detecting sound using the MEMS optical sensor and method of manufacturing. The MEMS optical sensor including a substrate having a base portion and a vertically extending support portion. The sensor further including a top plate having a compliant membrane configured to vibrate in response to acoustic waves, the top plate connected to the support portion and having a reflective surface. The sensor also includes a back plate connected to the support portion, the back plate having a grating portion positioned below the reflective surface portion and a base plate connected to the support portion at a position below the back plate. A light emitter, a light detector and circuitry operable to tilt the top plate and the back plate with respect to the base plate so as to direct the reflected laser light toward the light detector are further provided.
Abstract translation: 微机电系统（MEMS）光学传感器，使用MEMS光学传感器检测声音的方法和制造方法。 MEMS光学传感器包括具有基部和垂直延伸的支撑部的基板。 所述传感器还包括顶板，所述顶板具有构造为响应于声波而振动的柔性膜，所述顶板连接到所述支撑部分并且具有反射表面。 传感器还包括连接到支撑部分的背板，背板具有位于反射表面部分下方的光栅部分和在背板下方的位置处连接到支撑部分的基板。 还提供了一种发光器，光检测器和可操作以相对于基板倾斜顶板和背板以便将反射的激光引向光检测器的电路。
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公开(公告)号：US08658452B2
公开(公告)日：2014-02-25
申请号：US13003328
申请日：2009-07-08
Applicant: Mourad El-Gamal , Frederic Nabki , Paul-Vahe Cicek
Inventor： Mourad El-Gamal , Frederic Nabki , Paul-Vahe Cicek
CPC classification number: B81C1/00666 , B81B3/0021 , B81B7/008 , B81B2201/01 , B81B2201/0235 , B81B2201/0271 , B81B2201/03 , B81B2207/015 , B81B2207/03 , B81C1/00063 , B81C1/00246 , B81C1/00396 , B81C1/00587 , B81C2201/014 , B81C2201/0169 , B81C2201/0174 , B81C2203/0721 , B81C2203/0735
Abstract: A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method providing for processes and manufacturing sequences limiting the maximum exposure of an integrated circuit upon which the MEMS is manufactured to below 350° C., and potentially to below 250° C., thereby allowing direct manufacturing of the MEMS devices onto electronics, such as Si CMOS circuits. The method further providing for the provisioning of MEMS devices with multiple non-conductive structural layers such as silicon carbide separated with small lateral gaps. Such silicon carbide structures offering enhanced material properties, increased environmental and chemical resilience whilst also allowing novel designs to be implemented taking advantage of the non-conductive material of the structural layer. The use of silicon carbide being beneficial within the formation of MEMS elements such as motors, gears, rotors, translation drives, etc where increased hardness reduces wear of such elements during operation.
Abstract translation: 提供了一种提供与硅CMOS电子器件兼容的微机电结构（MEMS）的方法。 该方法提供了将MEMS制造的集成电路的最大曝光限制在低于350℃并可能低于250℃的工艺和制造顺序，从而允许将MEMS器件直接制造到电子器件上，例如 作为Si CMOS电路。 该方法进一步提供具有多个非导电结构层的MEMS器件，例如用小的侧向间隙分离的碳化硅。 这种碳化硅结构提供增强的材料性能，增加环境和化学弹性，同时还允许利用结构层的非导电材料来实现新颖的设计。 在形成MEMS元件（例如马达，齿轮，转子，平移驱动器等）中使用碳化硅是有益的，其中增加的硬度降低了操作期间这些元件的磨损。
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公开(公告)号：US20110111545A1
公开(公告)日：2011-05-12
申请号：US13003328
申请日：2009-07-08
Applicant: Mourad El-Gamal
Inventor： Mourad El-Gamal
IPC: H01L21/02
CPC classification number: B81C1/00666 , B81B3/0021 , B81B7/008 , B81B2201/01 , B81B2201/0235 , B81B2201/0271 , B81B2201/03 , B81B2207/015 , B81B2207/03 , B81C1/00063 , B81C1/00246 , B81C1/00396 , B81C1/00587 , B81C2201/014 , B81C2201/0169 , B81C2201/0174 , B81C2203/0721 , B81C2203/0735
Abstract: A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method providing for processes and manufacturing sequences limiting the maximum exposure of an integrated circuit upon which the MEMS is manufactured to below 350° C., and potentially to below 250° C., thereby allowing direct manufacturing of the MEMS devices onto electronics, such as Si CMOS circuits. The method further providing for the provisioning of MEMS devices with multiple non-conductive structural layers such as silicon carbide separated with small lateral gaps. Such silicon carbide structures offering enhanced material properties, increased environmental and chemical resilience whilst also allowing novel designs to be implemented taking advantage of the non-conductive material of the structural layer. The use of silicon carbide being beneficial within the formation of MEMS elements such as motors, gears, rotors, translation drives, etc where increased hardness reduces wear of such elements during operation.
Abstract translation: 提供了一种提供与硅CMOS电子器件兼容的微机电结构（MEMS）的方法。 该方法提供了将MEMS制造的集成电路的最大曝光限制在低于350℃并可能低于250℃的工艺和制造顺序，从而允许将MEMS器件直接制造到电子器件上，例如 作为Si CMOS电路。 该方法进一步提供具有多个非导电结构层的MEMS器件，例如用小的侧向间隙分离的碳化硅。 这种碳化硅结构提供增强的材料性能，增加环境和化学弹性，同时还允许利用结构层的非导电材料来实现新颖的设计。 在形成MEMS元件（例如马达，齿轮，转子，平移驱动器等）中使用碳化硅是有益的，其中增加的硬度降低了操作期间这些元件的磨损。
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公开(公告)号：US20240208800A1
公开(公告)日：2024-06-27
申请号：US18087602
申请日：2022-12-22
Applicant: Knowles Electronics, LLC
Inventor： Ken Deng , Bing Yu , Michael Pedersen , Nicholas Palcheck , Jeremy Johnson , Richard Li-Chen Chen
CPC classification number: B81B3/0013 , B81C1/00111 , B81B2201/02 , B81B2203/0361 , B81B2203/0376 , B81C2201/0174
Abstract: A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.
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Patent Agency Ranking
公开(公告)号：US20230303387A1
公开(公告)日：2023-09-28
申请号：US18122872
申请日：2023-03-17
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Siarhei Dmitrievich Barsukou
CPC classification number: B81B3/0021 , H04R17/02 , H10N30/308 , B81C1/00158 , H04R2201/003 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , B81C2201/0174 , B81C2201/0163
Abstract: There is provided a piezoelectric microelectromechanical systems microphone comprising a sensor including at least one piezoelectric layer, at least one constraint in contact with the sensor at a position, such that the sensor is supported by the at least one constraint, and such that the sensor that the sensor has a membrane region to one side of the at least one constraint and a cantilevered region to the other side of the at least one constraint and a cavity defined at least partially by the at least one constraint. There is also provided a method of manufacturing the microphone.
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公开(公告)号：US11766696B2
公开(公告)日：2023-09-26
申请号：US16784186
申请日：2020-02-06
Applicant: BFLY Operations, Inc.
Inventor： Lingyun Miao , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , H10N30/06 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81C2201/0101 , B81C2201/013 , B81C2201/0147 , B81C2201/0174 , B81C2203/0714
Abstract: A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.
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公开(公告)号：US11650411B2
公开(公告)日：2023-05-16
申请号：US16762174
申请日：2018-09-04
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor： Tatsuya Sugimoto , Tomofumi Suzuki , Kyosuke Kotani
CPC classification number: G02B26/0841 , B81C1/00555 , G02B7/1821 , G02B26/105 , H02N1/008 , B81B2201/042 , B81C2201/013 , B81C2201/0174 , B81C2201/0198
Abstract: In an optical device, when viewed from a first direction, first, second, third, and fourth movable comb electrodes are respectively disposed between a first support portion and a first end of a movable unit, between a second support portion and a second end of the movable unit, between a third support portion and the first end, and between a fourth support portion and the second end of the movable unit. The first and second support portions respectively include first and second rib portions formed so that the thickness of each of the first and second support portions becomes greater than the thickness of the first torsion bar. The third and fourth support portions respectively include third and fourth rib portions formed so that the thickness of each of the third and fourth support portions becomes greater than the thickness of the second torsion bar.
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公开(公告)号：US09404860B2
公开(公告)日：2016-08-02
申请号：US14330723
申请日：2014-07-14
Applicant: Apple Inc.
Inventor： Janhavi S. Agashe , Jae H. Lee
CPC classification number: H04R23/008 , B81C1/00158 , B81C1/00341 , B81C2201/0174 , B81C2203/0785 , G01N21/01 , G01N21/4788 , G01N21/55 , G01N2201/0612 , H04R1/04 , H04R2201/003 , Y10T29/413
Abstract: A micro-electro-mechanical system (MEMS) optical sensor, method of detecting sound using the MEMS optical sensor and method of manufacturing. The MEMS optical sensor including a substrate having a base portion and a vertically extending support portion. The sensor further including a top plate having a compliant membrane configured to vibrate in response to acoustic waves, the top plate connected to the support portion and having a reflective surface. The sensor also includes a back plate connected to the support portion, the back plate having a grating portion positioned below the reflective surface portion and a base plate connected to the support portion at a position below the back plate. A light emitter, a light detector and circuitry operable to tilt the top plate and the back plate with respect to the base plate so as to direct the reflected laser light toward the light detector are further provided.
Abstract translation: 微机电系统（MEMS）光学传感器，使用MEMS光学传感器检测声音的方法和制造方法。 MEMS光学传感器包括具有基部和垂直延伸的支撑部的基板。 所述传感器还包括顶板，所述顶板具有构造为响应于声波而振动的柔性膜，所述顶板连接到所述支撑部分并且具有反射表面。 传感器还包括连接到支撑部分的背板，背板具有位于反射表面部分下方的光栅部分和在背板下方的位置处连接到支撑部分的基板。 还提供了一种发光器，光检测器和可操作以相对于基板倾斜顶板和背板以便将反射的激光引向光检测器的电路。
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公开(公告)号：US20150378127A1
公开(公告)日：2015-12-31
申请号：US14533947
申请日：2014-11-05
Applicant: Texas Instruments Incorporated
Inventor： YungShan Chang , Ricky A. Jackson , Jeff W. Ritchison , Neng Jiang
CPC classification number: B81C1/00523 , B81B3/0021 , B81B3/0072 , B81B7/02 , B81C1/00349 , B81C2201/0174 , G02B13/14 , G02B26/06
Abstract: An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens. The apparatus further includes at least one stress compensation ring over a portion of the lens material and over at least a portion of the piezoelectric capacitor. The at least one stress compensation ring is configured to at least partially reduce bending of the lens material caused by stress on or in the lens material.
Abstract translation: 一种装置包括形成透镜的透镜材料。 该装置还包括在透镜材料上的压电电容器，其中压电电容器被配置为响应于压电电容器两端的电压而改变透镜材料的形状，从而改变透镜的焦点。 该装置还包括在透镜材料的一部分上方以及压电电容器的至少一部分上的至少一个应力补偿环。 所述至少一个应力补偿环被配置为至少部分地减少由于在所述透镜材料上或所述透镜材料中的应力引起的所述透镜材料的弯曲。
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