Abstract:
A package component includes a first substrate and a first conductive layer. The first substrate has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed over the first surface of the first substrate. The first conductive layer includes a first conductive feature and a second conductive feature over the first conductive feature. The second conductive features covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the second conductive feature. The first substrate includes a single-sided or a double-sided copper-clad laminate.
Abstract:
A substrate in accordance with an embodiment of the disclosure includes a signal transmission layer including a signal transmission pad and a signal transmission interconnection; a first dielectric layer stacked on the signal transmission layer; and a first reference voltage layer stacked on the first dielectric layer. The first reference voltage layer includes a first space hole and an impedance calibrator. The impedance calibrator includes an impedance calibration part disposed in the first space hole; and a first bridge connecting a first portion of the impedance calibration part to a first portion of the first reference voltage layer.
Abstract:
A substrate for a medical device, a portion of which is brought into contact with or inserted into a subject. The substrate includes a patient circuit conductively connected to the portion that is configured to be brought into contact with or inserted into the subject, and a ground-side circuit configured to perform at least one of transmission of a signal, reception of a signal, and supply of electric power on the patient circuit. The ground-side circuit is grounded by a protective ground to ensure safety of a manipulator of the medical device. The substrate also includes an insulating layer between the patient circuit and the ground-side circuit providing insulation between the patient circuit and the ground-side circuit, and an isolated circuit provided apart from the patient circuit and the ground-side circuit on the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit.
Abstract:
A multi-layer wiring board includes wiring layers stacked on a substrate with an insulating layer between each layer. A wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure. The first layer is made of a first conductive material and the second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material. The characteristic impedance of the wire is adjusted to a value closer to 50 ohms than that of a wire which has the same thickness as of the wire with the double layered structure, and is made only of the first conductive material.
Abstract:
A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.
Abstract:
A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.
Abstract:
An electrical contact pad (300) for electrically contacting a connector includes first (302), second (305) and third regions (310). The first region (302) is connected to a trace (325). The second region (305) is adjacent to the first region (302) and has a width (W2) less than the first region (W1). The third region (310) is adjacent to the second region (305) and has a width (W3) that is greater than the second region (W2). The third region (310) is sized to make contact with a connector. Having the width of the second region (W2) be smaller than the width of the first (W1) and third regions (W3) increases an impedance of the electrical contact pad (300).
Abstract:
Discussed generally herein are methods and devices for altering an effective series resistance (ESR) of a component. A device can include a substrate including electrical connection circuitry therein, a first via hole through a first surface of the substrate and contiguous with the electrical connection circuitry, a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole, and a component electrically coupled to the first conductive polymer.
Abstract:
본 발명은 전도성 투명기판 제조방법에 관한 것이며, 본 발명의 전도성 투명기판 제조방법은 기판 상에 상호 이격되도록 배열되는 복수개의 주전극을 형성하는 주전극 형성단계; 복수개의 주전극이 서로 전기적으로 단절되는 복수개의 그룹전극으로 그룹화되도록 둘 이상의 주전극을 전기적으로 연결하는 연결전극을 형성하는 연결전극 형성단계;를 포함하는 것을 특징으로 한다. 따라서, 본 발명에 의하면, 투과성이 우수한 전도성 투명기판을 높은 수율의 공정을 통하여 제작할 수 있는 전도성 투명기판 제조방법 및 전도성 투명기판이 제공된다.