中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

240 records (took 0.02 seconds)

    Circuit board with identifiable information and method for fabricating the same
    43.
    发明公开
    Circuit board with identifiable information and method for fabricating the same 有权
    Leiterplatte mit identifizierbaren Informationen und Herstellungsverfahren

    公开(公告)号：EP1622431A1

    公开(公告)日：2006-02-01

    申请号：EP04018155.4

    申请日：2004-07-30

    Applicant: Phoenix Precision Technology Corporation

    Inventor： Hsu, Shih-Ping ,  Chen, Shang-Wei ,  Tang, Suo-Hsia ,  Shih, Chao-Wen

    IPC: H05K1/02 ,  H05K3/46

    CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936

    Abstract: A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer (12) within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information (140) is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.

    Abstract translation: 提出了具有可识别信息的电路板及其制造方法。 电路板内的至少一个绝缘层（12）具有不具有电路布局的非电路区域。 在绝缘层的非电路区域中形成多个开口。 在绝缘层上形成图案化电路层。 金属识别信息（140）设置在非电路区域的开口中。 通过这种布置，可以通过金属图案化信息来跟踪和识别电路板的产品状态。

    불량품의 표시가 용이한 반도체 패키지용 회로기판과, 이를이용한 불량품 표시방법 및 불량품 표시물
    45.
    发明公开
    불량품의 표시가 용이한 반도체 패키지용 회로기판과, 이를이용한 불량품 표시방법 및 불량품 표시물 无效
    电路板简易标记半导体封装产品，其标识方法及其标记

    公开(公告)号：KR1020090052681A

    公开(公告)日：2009-05-26

    申请号：KR1020070119300

    申请日：2007-11-21

    Applicant: 삼성전자주식회사

    Inventor： 채가은 ,  이왕재 ,  정용진 ,  송근호

    IPC: H01L21/66 ,  H05K13/08 ,  H01L23/544

    CPC classification number: H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10204 ,  Y10T29/49124

    Abstract: 본 발명은 불량품의 표시가 용이한 반도체 패키지용 회로기판과, 이를 이용한 불량품 표시방법 및 불량품 표시물에 관한 것으로서, 본 발명의 불량품의 표시가 용이한 반도체 패키지용 회로기판은, 반도체 패키지용 회로기판을 구성함에 있어서, n행 m열로 매트릭스 배치되는 복수개의 회로기판 유닛들; 및 상기 회로기판 유닛들 중에서 확인된 불량 유닛의 위치를 1:1로 대응하여 표시할 수 있도록 n행 m열로 매트릭스 배열된 마킹 영역을 갖는 표시부;를 포함하여 이루어지는 것을 특징으로 하기 때문에 작업자의 직관적인 불량 마크 표시가 가능하여 표시 혼동을 방지하고, 작업자 또는 센서의 불량 마크의 인식이 매우 용이하며, 회로기판 내부에 위치하는 표시부로 인해 회로기판의 집적도를 높여 생산성을 크게 향상시킬 수 있으며, 센서의 이동 거리를 단축시켜서 센서 이동 중에 발생할 수 있는 간섭 형상을 방지하고, 이동 시간을 단축할 수 있는 효과를 갖는다.
    더미 유닛, 불량 유닛, 표시부, 공백영역, 더미 마크, 불량 마크

    ELECTRONIC MODULE AND PROCEDURE FOR AT LEAST THE PARTIAL SCRAPPING OF THE ELECTRONIC MODULE
    46.
    发明申请
    ELECTRONIC MODULE AND PROCEDURE FOR AT LEAST THE PARTIAL SCRAPPING OF THE ELECTRONIC MODULE 审中-公开
    用于电子模块部分切割的电子模块和程序

    公开(公告)号：US20100170953A1

    公开(公告)日：2010-07-08

    申请号：US12294658

    申请日：2006-04-03

    Applicant: Stephan Schaade

    Inventor： Stephan Schaade

    IPC: G06K19/077 ,  H05K7/00 ,  B23P19/00

    CPC classification number: H05K1/0266 ,  H05K1/0293 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10098 ,  H05K2201/10159 ,  H05K2201/10212 ,  H05K2203/175 ,  Y10T29/49815

    Abstract: The electronic module (BG) incorporates a specified separation edge (SAK, SAK1, SAK2, SAK3) for the mechanical, irreversible separation of a separable part (AT, AT1, AT2, AT3) of the module (BG) from the remainder of the module (BGR), both the separable part (AT, AT1, AT2, AT3) and the module remainder (BGR) incorporating essentially interacting circuit components (ST1, ST2) for an intended electrotechnical operation of the module (BG). By separating the separable part (AT, AT1, AT2, AT3) the electrotechnical operation of the module (BG) can be permanently deactivated.

    Abstract translation: 电子模块（BG）包含用于将模块（BG）的可分离部分（AT，AT1，AT2，AT3）与其余部分（AT，AT1，AT2，AT3）的机械不可逆分离的指定分离边缘（SAK，SAK1，SAK2，SAK3） 模块（BGR），可分离部分（AT，AT1，AT2，AT3）和包含基本上相互作用的电路部件（ST1，ST2）的模块余量（BGR），用于模块（BG）的预期电工操作。 通过分离可分离部分（AT，AT1，AT2，AT3），模块（BG）的电工操作可以永久停用。

    Circuit board having barcode and fabrication method thereof
    47.
    发明申请
    Circuit board having barcode and fabrication method thereof 审中-公开
    具有条形码及其制作方法的电路板

    公开(公告)号：US20090101391A1

    公开(公告)日：2009-04-23

    申请号：US11999819

    申请日：2007-12-06

    Applicant: Christina Shu-Ming Yang ,  Feng Hu

    Inventor： Christina Shu-Ming Yang ,  Feng Hu

    IPC: H05K1/00 ,  H05K3/02

    CPC classification number: H05K9/00 ,  H05K1/0266 ,  H05K3/064 ,  H05K2201/09781 ,  H05K2201/09927 ,  Y10T29/49155

    Abstract: A circuit board having barcode and fabrication method thereof are disclosed. The method of the present invention includes the steps of providing a substrate body that has an insulation layer covered with a copper foil; forming a dry film on the copper foil; disposing a film having a circuit pattern and a barcode pattern on the dry film and performing an exposure process so as to harden portions of the dry film at positions corresponding to the circuit pattern and the barcode pattern; performing a development process such that non-hardened portions of the dry film are removed and portions of the dry film that are hardened are remained as an etch mask; and performing an etch process so as to remove portions of the copper foil that are exposed from the dry film. Thus, circuit and barcode are formed in the copper foil at the same time, thereby saving cost and eliminating time for manually attaching barcode.

    Abstract translation: 公开了具有条形码及其制造方法的电路板。 本发明的方法包括提供具有被铜箔覆盖的绝缘层的基体的步骤; 在铜箔上形成干膜; 将具有电路图案和条形码图案的膜设置在干膜上并执行曝光处理，以使干膜的部分在与电​​路图案和条形码图形相对应的位置处硬化; 进行显影处理，使得去除干膜的未硬化部分，并且残留硬化部分的干膜作为蚀刻掩模; 并进行蚀刻处理以除去从干膜暴露出的部分铜箔。 因此，电路和条形码同时形成在铜箔中，从而节省了成本并消除了手动附加条形码的时间。

    Combined electromagnetic and optical communication system
    49.
    发明申请
    Combined electromagnetic and optical communication system 失效
    综合电磁光通信系统

    公开(公告)号：US20050284941A1

    公开(公告)日：2005-12-29

    申请号：US10878963

    申请日：2004-06-28

    Applicant: Allen Lubow

    Inventor： Allen Lubow

    IPC: G06K7/10 ,  G06K19/06 ,  G06K19/077 ,  G06K19/08 ,  H05K1/02 ,  H05K1/16

    CPC classification number: G06K19/07769 ,  G06K19/06018 ,  G06K19/07749 ,  G06K19/083 ,  H05K1/0266 ,  H05K1/165 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10098

    Abstract: A communication system is provided that includes both an electromagnetic (“EM”) communication device and an optical communication device including at least a machine readable symbol where at least a portion of the EM communication device and at least a portion of the machine readable symbol are formed from the same material. This material may be, for example, a conductable ink or a conductable foil. If desired, the EM communication device may include an antenna where at least a portion of the antenna includes at least a portion of the machine readable symbol.

    Abstract translation: 提供了一种通信系统，其包括电磁（“EM”）通信设备和至少包括机器可读符号的光通信设备，其中EM通信设备的至少一部分和机器可读符号的至少一部分是 由相同的材料形成。 该材料可以是例如可导电油墨或可导电箔。 如果需要，EM通信设备可以包括天线，其中天线的至少一部分包括机器可读符号的至少一部分。

    Circuit board inspection apparatus
    50.
    发明申请
    Circuit board inspection apparatus 有权
    电路板检查装置

    公开(公告)号：US20050274802A1

    公开(公告)日：2005-12-15

    申请号：US10863211

    申请日：2004-06-09

    Applicant: Wei-Chi Yang

    Inventor： Wei-Chi Yang

    IPC: G06K7/00 ,  H05K1/02 ,  H05K3/00 ,  H05K13/08

    CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K3/0052 ,  H05K13/08 ,  H05K2201/09927

    Abstract: A circuit board inspection apparatus aims to inspect a circuit board panel which contains a plurality of sub-panels. The panel is bonded with a panel barcode and each sub-panel is bonded with a different sub-panel barcode. The circuit board inspection apparatus includes an automatic optic inspection (AOI) system to inspect the circuit board panel and read the panel barcode and the sub-panel barcode, a data link module to link data contained in the panel barcode and the sub-panel barcode and generate linkage data, and a database to store the linkage data. The relationship of the panel and the sub-panel may still be maintained through the linkage data provided by the data link module even after the panel and the sub-panel have been separated.

    Abstract translation: 电路板检查装置旨在检查包含多个子面板的电路板面板。 面板与面板条形码结合，每个子面板用不同的子面板条形码粘合。 电路板检查装置包括自动光学检测（AOI）系统，用于检查电路板面板并读取面板条形码和子面板条形码，数据链接模块，用于链接包含在面板条形码中的数据和子面板条形码 并生成链接数据，以及数据库来存储链接数据。 即使在面板和子面板分离之后，面板和子面板的关系仍然可以通过数据链接模块提供的联系数据进行维护。

Patent Agency Ranking