公开(公告)号：US07267558B1

公开(公告)日：2007-09-11

申请号：US11509535

申请日：2006-08-24

Applicant: Igor Polnyi

Inventor： Igor Polnyi

IPC: H01R12/00

CPC classification number: H05K3/325 ,  H05K2201/0969 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2203/167

Abstract: An electrical connector includes an insulative housing adapted to engage a conductive contact (20). The conductive contact has a tail end, wherein the tail end (22) is angled and has a generally dished shape such that at least a portion of the tail end terminates within a hole (10) in a contact pad (12) of a circuit board (1). The conductive contact tail end in a dished shape has the advantages of facilitating the guiding of the tail end into or out of the hole of the circuit board during wipe actions, without removing gold plated layer, and of achieving a reliable travel of the tail end across the hole of the contact pad of the circuit board.

Abstract translation: 电连接器包括适于接合导电触头（20）的绝缘外壳。 导电接触具有尾端，其中尾端（22）成角度并且具有大体上的碟形形状，使得尾端的至少一部分终止于电路的接触焊盘（12）内的孔（10）内 董事会（1）。 导电接触尾端呈碟形状的优点在于，在擦除动作期间，便于将尾端引入或移出电路板的孔，而无需去除镀金层，并且实现尾端的可靠行进 穿过电路板接触垫的孔。

公开(公告)号：US5654878A

公开(公告)日：1997-08-05

申请号：US489642

申请日：1995-06-12

Applicant: Masami Sasao ,  Hideyuki Hirata

Inventor： Masami Sasao ,  Hideyuki Hirata

IPC: H01R12/55 ,  H01R43/20 ,  H05K3/30 ,  H01L23/48

CPC classification number: H05K3/308 ,  H01R12/716 ,  H01R43/205 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10795 ,  H05K2201/10863 ,  H05K2203/167

Abstract: An improved connector terminal has a profile which facilitates insertion into engagement holes on a circuit board and increases resistance to deformation. The terminals may be part of an assembly which includes a series of terminals arranged in a spaced-apart array. Each has a solder tail portion defined by a straight edge (11) proximate to the centerline (9) and a slanted edge (12) which diagonally extends from the other side and which traverses the centerline (9) to intersect with the straight edge (11) to thereby form an acute angle at the tip (E) of the terminal near the centerline (9) to provide comparable positioning allowances on the opposite sides of the centerline (9) to facilitate mounting of the terminals on a circuit board. The acute angle point is advantageous to the optical measurement of terminal intervals for the quality control.

Abstract translation: 改进的连接器端子具有易于插入到电路板上的接合孔中并且增加抗变形性的轮廓。 端子可以是组件的一部分，其包括以间隔开的阵列布置的一系列端子。 每个具有由靠近中心线（9）的直边缘（11）限定的焊接尾部和从另一侧对角地延伸并且横过中心线（9）以与直边缘相交的倾斜边缘（12） 11），从而在靠近中心线（9）的端子的尖端（E）处形成锐角，以在中心线（9）的相对侧上提供相当的定位余量，以便于将端子安装在电路板上。 锐角点对质量控制的终端间隔的光学测量是有利的。

公开(公告)号：US11674977B2

公开(公告)日：2023-06-13

申请号：US17682769

申请日：2022-02-28

Applicant: JF MICROTECHNOLOGY SDN. BHD

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee ,  Grace Ann Nee Yee

IPC: H05K1/02 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/0466 ,  G01R1/0735 ,  G01R1/07364 ,  H05K1/0268 ,  H05K1/0283 ,  H05K1/0296 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10704 ,  H05K2201/10795

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

公开(公告)号：US09775242B2

公开(公告)日：2017-09-26

申请号：US15005589

申请日：2016-01-25

Applicant: Intel Corporation

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H01L23/488 ,  H01L21/60 ,  H05K1/11 ,  H01L23/48 ,  H05K3/10 ,  H01L21/48 ,  H05K5/00 ,  H01R13/04 ,  H01L23/498 ,  H05K3/40 ,  H01L23/373 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

公开(公告)号：US09508639B2

公开(公告)日：2016-11-29

申请号：US14819755

申请日：2015-08-06

Applicant: ROHM CO., LTD.

Inventor： Hirotoshi Usui

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L23/36 ,  H05K1/18 ,  H01L23/00 ,  H01L23/467

CPC classification number: H01L23/49861 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/467 ,  H01L23/49555 ,  H01L23/498 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10469 ,  H05K2201/10757 ,  H05K2201/10795 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.

Abstract translation: 封装在衬底中的衬底包括具有能够接触外部的表面的裸露焊盘; 布置在与所述裸露焊盘的表面相对的表面上的半导体芯片; 用于模制半导体芯片的模塑树脂; 以及从模制树脂的侧表面延伸并具有加工形状的前端部的引线框架。 引线框架的前端部被切割成具有相对于封装的顶表面由引线框架的延伸的直线形成的锐角的切割角。

公开(公告)号：US08902603B2

公开(公告)日：2014-12-02

申请号：US13210329

申请日：2011-08-15

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K7/00 ,  H05K3/32 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US08497429B2

公开(公告)日：2013-07-30

申请号：US12727146

申请日：2010-03-18

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01B5/00 ,  H05K1/11 ,  H01R12/00 ,  H01R4/18 ,  H01R4/02

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

公开(公告)号：US20110316137A1

公开(公告)日：2011-12-29

申请号：US13225788

申请日：2011-09-06

Applicant: Hiroyuki NAKAMURA ,  Atsushi NISHIKIZAWA ,  Nobuya KOIKE

Inventor： Hiroyuki NAKAMURA ,  Atsushi NISHIKIZAWA ,  Nobuya KOIKE

IPC: H01L23/495

CPC classification number: H01L21/4835 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The semiconductor device includes a semiconductor chip, a chip mounting portion, a suspension lead, and a plurality of leads. Each of the plurality of leads has a first part and a second part, and the suspension lead has a first part and a second part. The first part of each of the plurality of leads and the suspension lead project from the plurality of side surfaces of the sealing body, respectively. Parts of the side surfaces of the plurality of leads and the suspension lead are exposed from the plurality of side surfaces of the sealing body, respectively. An area of the obverse surface of the first part of the suspension lead is larger than an area of the obverse surface of the first part of each of the plurality of leads in a plan view.

Abstract translation: 半导体器件包括半导体芯片，芯片安装部分，悬挂引线和多个引线。 多个引线中的每一个具有第一部分和第二部分，并且悬架引线具有第一部分和第二部分。 多个引线中的每一个的第一部分和悬挂引线分别从密封体的多个侧表面伸出。 多个引线的侧面部分和悬挂引线分别从密封体的多个侧面露出。 在俯视图中，悬架引线的第一部分的正面的面积大于多根引线中的每一个的第一部分的正面的面积。

公开(公告)号：US08026130B2

公开(公告)日：2011-09-27

申请号：US12432075

申请日：2009-04-29

Applicant: Hiroyuki Nakamura ,  Atsushi Nishikizawa ,  Nobuya Koike

Inventor： Hiroyuki Nakamura ,  Atsushi Nishikizawa ,  Nobuya Koike

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/4835 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method is provided for manufacturing a QFN type semiconductor integrated circuit device using a multi-device lead frame having a tie bar for tying external end portions of plural leads, wherein sealing resin filled between an outer periphery of a mold cavity and the tie bar is removed by a laser and thereafter a surface treatment such as solder plating is performed.

Abstract translation: 提供一种使用具有用于捆扎多个引线的外端部的连接杆的多器件引线框架来制造QFN型半导体集成电路器件的方法，其中填充在模腔的外周和连接杆之间的密封树脂是 通过激光去除，然后进行诸如焊料镀覆的表面处理。

公开(公告)号：US20110044040A1

公开(公告)日：2011-02-24

申请号：US12543520

申请日：2009-08-19

Applicant: WEN-CHUNG CHIN

Inventor： WEN-CHUNG CHIN

IPC: F21S4/00 ,  F21V21/00 ,  H01J9/24

CPC classification number: H05K3/306 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10795 ,  H05K2201/10863

Abstract: A lighting device includes a printed circuit board, a plurality of electrical connection units, and a plurality of illuminant units. The printed circuit board has a layer of insulation and a layer of circuit. The insulation layer forms a plurality of holes corresponding to a plurality of electrically conductive zones of the circuit layer. The electrical connection units are connected to the electrically conductive zones through the holes. The illuminant units are set in electrical connection with the electrical connection units. The electrical connection units are fixedly mounted to the circuit layer and electrical power is supplied through the electrically conductive zones to the illuminant units. The electrical connection units are arranged in an array on the printed circuit board.

Abstract translation: 照明装置包括印刷电路板，多个电连接单元和多个发光单元。 印刷电路板有一层绝缘层和一层电路。 绝缘层形成与电路层的多个导电区对应的多个孔。 电连接单元通过孔连接到导电区。 光源单元设置为与电气连接单元电连接。 电连接单元固定地安装到电路层，并且电力通过导电区域供应到光源单元。 电连接单元布置在印刷电路板上的阵列中。