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公开(公告)号：KR101317599B1
公开(公告)日：2013-10-11
申请号：KR1020060068501
申请日：2006-07-21
Applicant: 삼성전자주식회사
CPC classification number: G03F7/0047 , B05D1/185 , C03C17/06 , H05K3/02 , H05K2201/0257 , H05K2203/0514 , Y10S977/777 , Y10S977/778 , Y10S977/779 , Y10T428/2991
Abstract: 본 발명은, 표면상에, 말단 반응성 기를 포함하는 사이올계, 이소시아나이드계, 아민계, 카복실레이트계, 또는 포스페이트계 화합물로 이루어진 자기 분자 조립층을 형성하거나, 또는 말단 반응성 기를 포함하지 않는 사이올계 등의 화합물로 이루어진 자기 분자 조립층을 형성하고, 말단 반응성 기를 도입한 다음, 말단 반응성 기에 산 또는 염기에 의해 탈리되는 작용기를 도입한 금속 나노입자 및 이를 이용한 전도성 패턴 형성방법에 관한 것이다. 본 발명에 따른 금속 나노입자의 경우, UV 조사 및 광분해에 의해 전도성 필름 또는 패턴을 용이하게 형성할 수 있고, 수득된 필름 또는 패턴의 전도성이 매우 우수하며, 필요에 따라 전도성을 임의로 조절할 수 있어서 대전방지성 점착 시트 또는 신발, 전도성 폴리우레탄 프린트 롤러, 전자파 차폐 쉴드(Electromagnetic Interference Shielding) 등에 유리하게 사용될 수 있다.
금속 나노입자, 광분해, 산 또는 염기 분해성 기, 전도성, 네거티브 패턴Abstract translation: 本发明之间形成自组装单分子层的表面上，包括，基于olgye之间，异氰酸根合基氰化物，胺系，羧酸盐，包括一个末端反应，或磷酸酯类化合物，或不含有末端反应 形成的化合物形成自组装分子层如olgye，以及在一个，则反应性端基的酸或导电图案使用金属纳米粒子的形成方法，和该导入的官能团的由引入的基反应性末端解吸。 在根据本发明，UV照射和通过光解的金属纳米粒子的情况下，它可以很容易地形成导电膜或图形，并且得到的膜或优异的图案的导电性，充电也能够控制任选必需的导电性 导电聚氨酯印刷辊，电磁干扰屏蔽（电磁干扰屏蔽）等。
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公开(公告)号：KR101291855B1
公开(公告)日：2013-07-31
申请号：KR1020060075148
申请日：2006-08-09
Applicant: 삼성전자주식회사
Abstract: 본 발명은, 표면에, 링커로서 사이올기(-SH), 이소시아나이드기(-CN), 아미노기(-NH
2 ), 카복실레이트기(-COO), 또는 포스페이트기를 포함하는 소정의 화합물로 이루어진 자기분자조립층(self assembled monolayer)이 형성된 프린팅이 가능한 금속 나노입자 및 이를 이용한 전도성 패턴형성방법에 관한 것이다. 본 발명에 따른 금속 나노입자의 경우, 프린팅 방법에 의해 전도성 필름 또는 패턴을 용이하게 형성할 수 있고, 수득된 필름 또는 패턴의 전도성이 매우 우수하며, 필요에 따라 전도성을 임의로 조절할 수 있어 대전방지성 점착시트 또는 신발, 전도성 폴리우레탄 프린트 롤러, 전자파 차폐 쉴드(Electromagnetic Interference Shielding) 등에 유리하게 사용될 수 있다.
금속 나노입자, 프린팅, 전도성, 패턴-
公开(公告)号：KR1020090018503A
公开(公告)日：2009-02-20
申请号：KR1020070082988
申请日：2007-08-17
Applicant: 삼성전자주식회사 , 삼성모바일디스플레이주식회사
IPC: C07D271/10 , C09K11/06
Abstract: An oxadiazole derivative compound is provided to improve the thermal and electrical stability, thereby producing the organic light-emitting device having low driving voltage, excellent color purity and long durability property. The organic light-emitting device comprises a first electrode, a second electrode and an organic film between the first and second electrodes which comprises the oxadiazole derivative compound represented by the chemical formula(1), wherein R1 is substituted or unsubstituted C1-C20 alkylene group, substituted or unsubstituted C3-C20 cycloalkylene group, substituted or unsubstituted C1-C20 heteroalkylene group, substituted or unsubstituted C3-C20 arylene group, substituted or unsubstituted C1-C20 heteroarylene group, thiophenyl, silylene, carbazolylene, fluorenylene, -PH-, -O- or -SOO-; and R2 is substituted or unsubstituted C1-C20 heteroaryl or thiophenyl.
Abstract translation: 提供恶二唑衍生化合物以改善热稳定性和电气稳定性，从而制得驱动电压低，色纯度高，耐久性好的有机发光元件。 有机发光器件包括第一和第二电极之间的第一电极，第二电极和有机膜，其包含由化学式（1）表示的恶二唑衍生物化合物，其中R 1为取代或未取代的C 1 -C 20亚烷基 取代或未取代的C 3 -C 20亚环烷基，取代或未取代的C 1 -C 20杂亚烷基，取代或未取代的C 3 -C 20亚芳基，取代或未取代的C 1 -C 20杂亚芳基，噻吩基，亚甲硅烷基，咔唑基，芴基， O-或-SOO-; 并且R 2是取代或未取代的C 1 -C 20杂芳基或噻吩基。
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公开(公告)号：KR1020080047209A
公开(公告)日：2008-05-28
申请号：KR1020060117250
申请日：2006-11-24
Applicant: 삼성전자주식회사
IPC: C09K11/06
CPC classification number: C07D209/80 , C09K11/06 , C09K2211/1007 , C09K2211/1011 , C09K2211/1014 , H01L51/0061 , H01L51/5012 , H05B33/14
Abstract: An organic light emitting compound, an organic light emitting device containing the compound, and a method for preparing the organic light emitting device are provided to enhance the solubility and thermal stability of the compound, to lower drive voltage and improve efficiency, color purity and brightness. An organic light emitting compound is represented by the formula 1 or 2, wherein CY1 and CY2 are independently a benzene ring or a naphthalene ring but the case of both of CY1 and CY2 are a benzene ring is excluded; Ar1 and Ar4 are a substituted or unsubstituted C6-C50 arylene group; Ar2 and Ar3 are independently a substituted or unsubstituted C6-C50 aryl group or a substituted or unsubstituted C13-C100 heteroaryl group; R1 and R2 are independently H, a halogen atom, a cyano group, a nitro group, a hydroxyl group, a substituted or unsubstituted C1-C50 alkyl or alkoxy group, a substituted or unsubstituted C5-C50 cycloalkyl or heterocycloalkyl group, a substituted or unsubstituted C6-C50 aryl group, a substituted or unsubstituted C2-C50 heteroaryl group, -N(Z1)(Z2) or -Si(Z3)(Z4)(Z5); Z1 to Z5 are independently H, a substituted or unsubstituted C1-C50 alkyl group, a substituted or unsubstituted C6-C50 aryl group, a substituted or unsubstituted C2-C50 heteroaryl group, a substituted or unsubstituted C6-C50 cycloalkyl group or a substituted or unsubstituted C5-C50 heterocycloalkyl group; and CY3 and CY4 are independently a C6-C30 aromatic ring.
Abstract translation: 提供有机发光化合物，含有该化合物的有机发光装置及其制备方法，以提高化合物的溶解度和热稳定性，降低驱动电压并提高效率，色纯度和亮度 。 有机发光化合物由式1或2表示，其中CY1和CY2独立地为苯环或萘环，但CY1和CY2均为苯环的情况除外; Ar 1和Ar 4是取代或未取代的C 6 -C 50亚芳基; Ar 2和Ar 3独立地是取代或未取代的C 6 -C 50芳基或取代或未取代的C 13 -C 100杂芳基; R 1和R 2独立地为H，卤素原子，氰基，硝基，羟基，取代或未取代的C 1 -C 50烷基或烷氧基，取代或未取代的C 5 -C 50环烷基或杂环烷基，取代或未取代的 未取代的C 6 -C 50芳基，取代或未取代的C 2 -C 50杂芳基，-N（Z 1）（Z 2）或-Si（Z 3）（Z 4）（Z 5）; Z 1至Z 5独立地为H，取代或未取代的C 1 -C 50烷基，取代或未取代的C 6 -C 50芳基，取代或未取代的C 2 -C 50杂芳基，取代或未取代的C 6 -C 50环烷基或取代或未取代的C 6 -C 50环烷基， 未取代的C 5 -C 50杂环烷基; 且CY3和CY4独立地为C6-C30芳环。
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55.发明授权
公开(公告)号：KR100819554B1
公开(公告)日：2008-04-07
申请号：KR1020060121572
申请日：2006-12-04
Applicant: 삼성전자주식회사
IPC: H05K3/40
CPC classification number: H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/98 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24227 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K3/225 , H05K3/3442 , H05K2201/10636 , H05K2201/10674 , H05K2203/176 , Y02P70/611 , Y10T29/4913 , Y10T29/49144 , Y10T29/53274 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: An electronic device having reproducible electronic components, a method for manufacturing the same, and a method for reproducing electronic components are provided to detect an error of a connection pattern by exposing the connection pattern to the outside. An electronic device having reproducible electronic components includes a substrate body(203), a first cavity(205a), a first metal pattern(210a), a first electronic component, and a first conductive connection pattern. The first cavity is provided to the substrate body. The first metal pattern is provided to the substrate body and is close to the first cavity. The first electronic component is inserted into the first cavity, and has a ball pad which is provided to the first body and an upper edge part of the first body. The first conductive connection pattern is located on an upper edge of the first electronic component, and is expanded to the first metal pattern. The first conductive connection pattern is contacted with the ball pad and the first metal pattern.
Abstract translation: 提供具有可再生电子元件的电子设备，其制造方法以及再现电子元件的方法，用于通过将连接图案暴露于外部来检测连接图案的错误。 具有可再现电子部件的电子设备包括基板主体（203），第一空腔（205a），第一金属图案（210a），第一电子部件和第一导电连接图案。 第一腔被提供到衬底主体。 第一金属图案被提供到基板主体并且靠近第一空腔。 第一电子部件被插入到第一腔体中，并且具有设置到第一主体的球垫和第一主体的上边缘部。 第一导电连接图案位于第一电子部件的上边缘，并且扩展到第一金属图案。 第一导电连接图案与球垫和第一金属图案接触。
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Patent Agency Ranking
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57.发明公开볼그리드어레이 반도체 패키지에 사용되는 모듈 기판, 이를가지는 반도체 장치 및 반도체 패키지 실장 방법 无效用于球网架半导体封装的模块板，具有模块板的半导体器件及其安装半导体封装件的方法
公开(公告)号：KR1020060109379A
公开(公告)日：2006-10-20
申请号：KR1020050031618
申请日：2005-04-15
Applicant: 삼성전자주식회사
Abstract: A module substrate used in a BGA(Ball Grid Array) semiconductor package, a semiconductor apparatus having the same, and a method for mounting a semiconductor package are provided to reduce cracks of the BGA semiconductor package, a solder coupling unit, and a module printed circuit board pattern in the BGA semiconductor package and the semiconductor package by forming a dummy solder on a predetermined region on the module printed circuit board. Plural normal pads corresponding to plural solder balls are formed on a substrate(100). Plural normal solders corresponding to the plural solder balls of the normal pad are formed on the substrate. At least one dummy pad(132) is formed on a predetermined region of the substrate corresponding to a peripheral region of at least one BGA semiconductor package. A solder resist(120) is formed on the substrate where the plural normal pads and at least one dummy pad are formed to be used as a solder mask. At least one dummy solder(102) is formed on at least one dummy pattern to be corresponded to the peripheral region of at least one BGA semiconductor package.
Abstract translation: 提供了用于BGA（球栅阵列）半导体封装的模块衬底，具有该半导体封装的半导体装置和用于安装半导体封装的方法，以减少BGA半导体封装，焊料耦合单元和印刷模块 通过在模块印刷电路板上的预定区域上形成虚拟焊料，在BGA半导体封装中的电路板图案和半导体封装。 对应于多个焊球的多个正常焊盘形成在基板（100）上。 在基板上形成对应于普通焊盘的多个焊球的多个正常焊料。 在与至少一个BGA半导体封装的周边区域对应的基板的预定区域上形成至少一个虚拟焊盘（132）。 在基板上形成阻焊剂（120），其中形成多个正常焊盘和至少一个虚拟焊盘作为焊接掩模。 至少一个虚拟焊料（102）形成在至少一个虚拟图案上，以对应于至少一个BGA半导体封装的外围区域。
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公开(公告)号：KR1020050052647A
公开(公告)日：2005-06-03
申请号：KR1020030085818
申请日：2003-11-28
Applicant: 삼성전자주식회사
IPC: H01R33/76
CPC classification number: H01R13/2471 , H01R13/111
Abstract: 소켓에 투입되는 이물질이 모듈 및 소켓에 주는 영향을 최소한으로 하는 개방형 소켓이 개시된다. 상기 개방형 소켓은, 모듈이 장착되는 부분의 하부에 위치한 하단지지대 전체가 개방되거나, 모듈이 장착되는 부분의 하부에 위치하는 하단지지대 중에서, 소켓의 한 쪽 에지 또는 양쪽의 에지 부분은 밀폐되고 중간 부분은 개방되는 것이다. 또한, 상기 개방형 소켓은, 모듈의 전기적 연결부와 서로 접촉하는 소켓의 전기적 연결부의 형태를 원형으로 하는 것이다.
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公开(公告)号：KR1020040060449A
公开(公告)日：2004-07-06
申请号：KR1020020087247
申请日：2002-12-30
Applicant: 삼성전자주식회사
IPC: H01L23/36
Abstract: PURPOSE: An apparatus for adhering a heat-sink plate and an adhering method thereof are provided to fix firmly the heat-sink plate at a semiconductor module by riveting the heat-sink plate. CONSTITUTION: An apparatus for adhering a heat-sink plate includes a loading die, a pressure unit, and a punch unit. A semiconductor module is loaded on the loading die. The pressure unit(200) is installed on an upper part of the loading die in order to press a heat-sink plate arranged on a semiconductor chip. The punch unit(250) is installed at a lateral part of the pressure unit in order to fix an end part of the heat-sink plate to the semiconductor module. The punch unit is used for riveting a predetermined part of the heat-sink plate.
Abstract translation: 目的：提供一种用于粘附散热板的装置及其粘接方法，以通过铆接散热板将散热板牢固地固定在半导体模块上。 构成：用于粘附散热板的装置包括加载模具，压力单元和冲压单元。 半导体模块装载在加载模具上。 压力单元（200）安装在装载模具的上部，以便按压布置在半导体芯片上的散热板。 冲压单元（250）安装在压力单元的侧部，以将散热板的端部固定到半导体模块。 冲压单元用于铆接散热板的预定部分。
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公开(公告)号：KR1020000010141A
公开(公告)日：2000-02-15
申请号：KR1019980030897
申请日：1998-07-30
Applicant: 삼성전자주식회사
IPC: H05K13/00
CPC classification number: H05K13/0015 , H05K13/0023 , H05K13/0061
Abstract: PURPOSE: Apparatus for aligning a printed circuit board(PCB) for a semiconductor module independently aligns each PCB accommodated in a jig in a module assembling apparatus. CONSTITUTION: Apparatus for aligning a printed circuit board includes at least two alignment pins(140) separated to be corresponded to each reference surface(124), a body(150) to which the alignment pins are connected toward the reference surface(124) with a predetermined flow feature, and a driver(158) for horizontally/vertically driving the body. If the body(150) is driven horizontally or vertically, the alignment pins align the PCB(110) to be proper to the reference surface, are connected therebetween through absorption part. Accordingly, the PCBs are independently operated.
Abstract translation: 目的：用于对准用于半导体模块的印刷电路板（PCB）的装置独立地对准容纳在模块组装装置中的夹具中的每个PCB。 构造：用于对准印刷电路板的装置包括至少两个分离成对应于每个参考表面（124）的对准销（140），对准销朝着参考表面（124）连接的主体（150），主体 预定的流动特征，以及用于水平/垂直驱动身体的驱动器（158）。 如果主体（150）被水平或垂直地驱动，则对准销将PCB（110）对准参考表面，通过吸收部分连接在它们之间。 因此，PCB是独立运行的。
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