公开(公告)号：CA3064088A1

公开(公告)日：2018-12-27

申请号：CA3064088

申请日：2018-06-20

Applicant: BUTTERFLY NETWORK INC

Inventor： ALIE SUSAN A ,  FIFE KEITH G ,  LUTSKY JOSEPH ,  GROSJEAN DAVID

IPC: G01N29/22 ,  B06B1/02 ,  G01N29/24

Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.

公开(公告)号：AU2017240043A1

公开(公告)日：2018-10-11

申请号：AU2017240043

申请日：2017-03-31

Applicant: BUTTERFLY NETWORK INC

Inventor： CHEN KAILIANG ,  RALSTON TYLER S ,  FIFE KEITH G

IPC: A61B8/00 ,  H01L41/00 ,  H02N2/00

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

公开(公告)号：AU2016364736A1

公开(公告)日：2018-06-14

申请号：AU2016364736

申请日：2016-12-01

Applicant: BUTTERFLY NETWORK INC

Inventor： CHEN KAILIANG ,  FIFE KEITH G ,  SANCHEZ NEVADA J ,  CASPER ANDREW J ,  RALSTON TYLER S

IPC: H04R31/00 ,  B06B1/00 ,  B06B3/00

Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.

公开(公告)号：AU2014235032B2

公开(公告)日：2017-11-09

申请号：AU2014235032

申请日：2014-03-13

Applicant: BUTTERFLY NETWORK INC

Inventor： ROTHBERG JONATHAN M ,  FIFE KEITH G ,  RALSTON TYLER S ,  CHARVAT GREGORY L ,  SANCHEZ NEVADA J

IPC: G01S7/52 ,  B06B1/02 ,  B81C1/00 ,  G01S15/89

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the "ultrasound- on- a-chip" solution disclosed herein.

公开(公告)号：AU2015247484A1

公开(公告)日：2016-11-10

申请号：AU2015247484

申请日：2015-04-17

Applicant: BUTTERFLY NETWORK INC

Inventor： ROTHBERG JONATHAN M ,  FIFE KEITH G ,  SANCHEZ NEVADA J ,  ALIE SUSAN A

IPC: H01L27/06 ,  A61B5/02 ,  A61B8/00 ,  B06B1/02 ,  B81C1/00 ,  H01L21/768 ,  H01L27/092

Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.

公开(公告)号：CA2905040A1

公开(公告)日：2014-09-25

申请号：CA2905040

申请日：2014-03-13

Applicant: BUTTERFLY NETWORK INC

Inventor： ROTHBERG JONATHAN M ,  FIFE KEITH G ,  RALSTON TYLER S ,  CHARVAT GREGORY L ,  SANCHEZ NEVADA J

IPC: B06B1/02 ,  B81C1/00 ,  G01N29/24 ,  H01L27/04 ,  H01L29/94

Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.

公开(公告)号：AU2022218473A1

公开(公告)日：2022-09-08

申请号：AU2022218473

申请日：2022-08-15

Applicant: BUTTERFLY NETWORK INC

Inventor： CRISTMAN PAUL FRANCIS ,  SANCHEZ NEVADA J ,  ALIE SUSAN A ,  ZAHORIAN JAIME SCOTT ,  DE JONGE MATTHEW ,  FIFE KEITH G ,  RALSTON TYLER S ,  MCNULTY CHRISTOPHER THOMAS ,  ROTHBERG JONATHAN M

IPC: A61B8/00 ,  A61B8/08 ,  A61B8/14 ,  A61N7/00 ,  B06B1/02 ,  G01S7/52 ,  G01S15/89

Abstract: An ultrasound device is described configurable to operate in a variety of modes. At least some of the modes are associated with different frequencies of ultrasound signals. A system is also described, comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles .0 and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

公开(公告)号：AU2017240043B2

公开(公告)日：2021-12-16

申请号：AU2017240043

申请日：2017-03-31

Applicant: BUTTERFLY NETWORK INC

Inventor： CHEN KAILIANG ,  RALSTON TYLER S ,  FIFE KEITH G

IPC: A61B8/00 ,  H01L41/00 ,  H02N2/00

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

公开(公告)号：CA3119753A1

公开(公告)日：2020-05-22

申请号：CA3119753

申请日：2019-11-14

Applicant: BUTTERFLY NETWORK INC

Inventor： MIAO LINGYUN ,  FIFE KEITH G ,  LIU JIANWEI ,  ROTHBERG JONATHAN M

IPC: G01N29/22 ,  G01N29/24 ,  G01N29/34 ,  H04R15/02 ,  H04R19/01 ,  H04R19/02 ,  H04R19/04 ,  H04R19/06 ,  H04R19/08 ,  H04R19/10

Abstract: A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.

公开(公告)号：CA3103940A1

公开(公告)日：2019-12-26

申请号：CA3103940

申请日：2019-06-18

Applicant: BUTTERFLY NETWORK INC

Inventor： CHEN CHAO ,  CHEN KAILIANG ,  CHIU LEUNG KIN ,  KOOK YOUN-JAE ,  FIFE KEITH G

IPC: A61B8/00 ,  A61B8/14 ,  B06B1/02

Abstract: Aspects of technology described herein relate to ultrasound apparatuses including capacitive micromachines ultrasonic transducers (CMUTs) that are directly electrically coupled to delta-sigma analog-to-digital converters (ADCs). The apparatus may lack an amplifier or multiplexer between each CMUT and delta-sigma ADC. The apparatus may include between 100 and 20,000 CMUTs and between 100 and 20,000 delta-sigma ADCs, each of the CMUTs directly electrically coupled to one of the delta-sigma ADCs. The CMUTs and the delta-sigma ADCs may be monolithically integrated on a single substrate. The delta-sigma ADCs may lack an integrator distinct from the CMUT. An internal capacitance of the CMUT may serve as an integrator for the delta-sigma ADC.