公开(公告)号：EP2472077B1

公开(公告)日：2015-04-01

申请号：EP11193747.0

申请日：2011-12-15

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Ihms, David W.

IPC: F01N3/04 ,  F01N3/08

CPC classification number: F01N3/0857 ,  B01D53/92 ,  B01D2257/504 ,  F01N3/04 ,  F01N3/0871 ,  F01N2240/02 ,  F01N2570/10 ,  Y02C10/06 ,  Y02T10/20

公开(公告)号：EP2818657A1

公开(公告)日：2014-12-31

申请号：EP14171584.7

申请日：2014-06-06

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott, D. ,  Eltom, Khalid M. ,  Myers, Bruce A. ,  Eesley, Gary, L. ,  Moor, Bruce

IPC: F01N5/02 ,  F01N13/16

CPC classification number: F01N5/025 ,  F01N2240/02 ,  Y02T10/16

Abstract: An assembly (10) for coupling thermally a thermoelectric generator (TEG (12)) to an exhaust manifold of an internal combustion engine. The assembly (10) includes a first heat exchanger (14) configured to guide exhaust gas (16) of an internal combustion engine past an opening (23) defined by the first heat exchanger (14), and a heat sink (50) configured to couple thermally the TEG (12) to the exhaust gas (16) and fluidicly seal the opening (23). The assembly (10) is configured so the heat sink (50) is directly exposed to the exhaust gas (16) so that heat is efficiently transferred from the exhaust gas (16) to the TEG (12).

Abstract translation: 一种用于将热电发生器（TEG（12））热耦合到内燃机的排气歧管的组件（10）。 组件（10）包括第一热交换器（14），其被构造成引导内燃机的废气（16）经过由第一热交换器（14）限定的开口（23）和配置在第一热交换器 将所述TEG（12）热耦合到所述废气（16），并且流体地密封所述开口（23）。 组件10被配置成使得散热器50直接暴露于废气16，使得热量有效地从排气（16）传递到TEG（12）。

公开(公告)号：EP1609838A3

公开(公告)日：2010-09-29

申请号：EP05076406.7

申请日：2005-06-16

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Chaudhuri. Arun K.

IPC: C09K5/06 ,  C09K5/14 ,  H01L23/373

CPC classification number: H01L23/4275 ,  C09K5/063 ,  C09K5/14 ,  H01L23/3737 ,  H01L2924/0002 ,  Y02P20/13 ,  Y10T428/25 ,  H01L2924/00

Abstract: The present invention provides a high performance polymer-base material (10, 20, 30) capable of dissipating transient thermal energy generated by an electronic module, such as a heat-generating power device. The methods of the present invention involve adding a suitable thinner to reduce the viscosity and increase the volume of a polymer-base matrix material (12) so that a large amount of thermal absorbing particles (14, 22, 25) may be added. The final cured product may have a filler content of more than 80 weight %. Further, the present invention provides a new and reduced cost formulation of a polymer-base thermal transient suppression material (30) containing organic wax particles.

公开(公告)号：EP1351562B1

公开(公告)日：2010-09-01

申请号：EP03075806.4

申请日：2003-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Myers, Bruce A. ,  Tsai, Jeenhuei ,  Chengalva, Suresh K.

IPC: H05K9/00

CPC classification number: H05K5/065 ,  H05K1/0203 ,  H05K3/284 ,  H05K9/0045 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172

公开(公告)号：EP1739746A3

公开(公告)日：2008-12-24

申请号：EP06076224.2

申请日：2006-06-14

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Sanftleben, Henry M.

IPC: H01L23/44

CPC classification number: H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/16251 ,  H01L2924/00

Abstract: A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.

公开(公告)号：EP1995777A1

公开(公告)日：2008-11-26

申请号：EP08154902.4

申请日：2008-04-21

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Elmoursi, Alaa A. ,  Van Steenkiste, Thomas H. ,  Zhao, Zhibo ,  Gillespie, Bryan A.

IPC: H01L23/492

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A low cost transistor package (10) is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die (12), high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer (16) is fixed to a silicon transistor die (12), for coupling to a heat conducting buffer (26) and attachment to a substrate (24). The dielectric layer (16) is fixed to the die (12) by growing the dielectric layer (16), depositing the dielectric layer (16), or applying the dielectric layer (16) using a plasma spray. In an aspect, a conductive layer (14) is formed to the silicon transistor die (12) by a thermal or kinetic spray process, and the dielectric layer (16) is applied to the conductive layer (14). The dielectric layer (16) may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die (12).

Abstract translation: 为高功率应用提供了低成本晶体管封装（10）。 该封装为硅晶体管管芯（12）提供高导热性和耗散性，高电流承载能力和隔离性以及高功率和热循环寿命性能和可靠性。 电介质层（16）被固定到硅晶体管管芯（12）上，用于耦合到导热缓冲器（26）并连接到衬底（24）。 通过生长电介质层（16），沉积电介质层（16）或使用等离子体喷涂来施加电介质层（16），将电介质层（16）固定到管芯（12）。 在一个方面中，通过热或动力学喷涂工艺将硅导体层（14）形成到硅晶体管管芯（12）上，并且介电层（16）被施加到导电层（14）。 介电层（16）也可以在晶体管制造之前或之后建立。 电和热互连有利地从硅晶体管管芯（12）的相对侧定位。

公开(公告)号：EP1988572A1

公开(公告)日：2008-11-05

申请号：EP08154019.7

申请日：2008-04-03

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Brauer, Eric A.

IPC: H01L23/473 ,  H01L25/065

CPC classification number: H01L23/473 ,  H01L25/074 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/0002 ,  H01L2924/10158 ,  H01L2924/00

Abstract: A stacked array (10/40) of channeled semiconductor chips (12a-12d) defining a power electronic circuit is mounted in a sealed container (50) provided with inlet and outlet passages (66, 68) for liquid coolant. Leadframe terminals (58a-58f, 64a-64b, 70) supported by the container (50) engage selected terminals (14, 16, 18) of the semiconductor chips (12a-12d) and form leads for mounting the container (50) on a circuit board having electrical and fluid interconnects.

Abstract translation: 引导半导体芯片（12A-12D）的功率限定电子电路被安装在设置有入口和出口通道（66，68），用于液体冷却剂的密封容器（50）的堆叠阵列（10/40）。 由半导体芯片的所述容器（50）接合选定终端（14，16，18）（12A-12D）和形式支撑引线框端子（58A-58F，64A-64B，70），导致用于安装在所述容器（50） 具有电和流体互连件的电路板。

公开(公告)号：EP1291912B1

公开(公告)日：2008-07-30

申请号：EP02078469.0

申请日：2002-08-21

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Brandenburg, Scott D. ,  Tsai, Jeenhuei S.

IPC: H01L23/31 ,  H01L21/56

CPC classification number: H01L21/563 ,  H01L23/3107 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15151

公开(公告)号：EP1628515B1

公开(公告)日：2007-09-19

申请号：EP05076577.5

申请日：2005-07-11

Applicant: Delphi Technologies, Inc.

Inventor： Chang, Shih-chia ,  Berlin, Carl W. ,  Myers, Bruce A. ,  Fairchild, Ray M. ,  Peugh, Darrel E.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

公开(公告)号：EP1622436A3

公开(公告)日：2007-08-01

申请号：EP05076530.4

申请日：2005-07-05

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Degenkolb, Thomas A.

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H01G9/012 ,  H05K2201/10651 ,  H05K2201/10757 ,  Y02P70/613

Abstract: A surface mountable axial leaded component (100) including a component body (102), a first component lead (104A) and a second component lead (104B). The first component lead (104A) extends from a first end of the component body (102) and a second component lead (104B) extends from a second end of the component body (102) that is opposite the first end. A portion of the first and second component leads (104A,104B) is formed in a loop and a diameter of the loop is at least equal to the diameter of the component body (102). The loop may be formed as a circular loop, an elliptical loop, a polygon loop, a square loop or rectangular loop, among other loop configurations. When formed as a circular loop, the loop may include a flat segment.