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公开(公告)号：US11579668B2
公开(公告)日：2023-02-14
申请号：US17030677
申请日：2020-09-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Steven Dean , John Franz , Brady Dulian
Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.
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公开(公告)号：US20220369513A1
公开(公告)日：2022-11-17
申请号：US17237732
申请日：2021-04-22
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Ernesto Ferrer
Abstract: A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.
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公开(公告)号：US11381017B2
公开(公告)日：2022-07-05
申请号：US16847924
申请日：2020-04-14
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Brian T. Purcell , Paul Danna
Abstract: A method and system are disclosed that allow easier coupling between high-density connectors. In one example implementation, the connectors on a computer board are mounted on flexible tabs extending from the computer board, the tabs having been formed by cutting slots on both sides of each of the tabs. A milled section within each tab makes the tab thinner, allowing it additional flexibility. In another example implementation, a pass-through connector is used as an intermediary between two mating connectors. The pass-through connector has internal pins with greater tolerance than the tolerance between the two mating connectors, allowing it easier alignment of pins for coupling. In yet another example implementation, mating connectors are coupled using a bundle of cables between the mating connectors that allows the coupling of multiple connectors, one at a time, reducing or eliminating the need to simultaneously couple multiple connectors.
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公开(公告)号：US20220039295A1
公开(公告)日：2022-02-03
申请号：US17278514
申请日：2019-02-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Harvey Lunsman
Abstract: An electronic component enclosure includes a plurality of wall structures defining outer walls of the enclosure. Each wall structure has an internal fluid channel for circulation of cooling fluid. The enclosure further includes at least one partition structure disposed within the outer walls and having an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one of the plurality of wall structures. The internal fluid channel of at least one of the plurality of wall structures and the internal fluid channel of the at least one partition structure defines a continuous fluid circulation path between a fluid inflow port and a fluid outflow port.
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公开(公告)号：US10955883B1
公开(公告)日：2021-03-23
申请号：US16653335
申请日：2019-10-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Robert Mascia , Harvey Lunsman , Steven Dean , Michael Scott
Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.
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Patent Agency Ranking
公开(公告)号：US10667431B1
公开(公告)日：2020-05-26
申请号：US16398115
申请日：2019-04-29
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , John Franz , Tahir Cader , Ernesto Ferrer Medina
Abstract: An example thermal interface device to attach to and cool a memory module. The device includes two sides sections that cover and contact the side faces of the memory module when installed. The device includes an outer layer that is a thermally conductive and resilient material, and an inner layer that is a thermally conductive and malleable metal. The inner layer may be nested within the outer layer, and the inner layer contacts the memory circuits of the memory module when installed. The outer layer includes spring fingers extending outward so as to contact and be compressed by a heat transfer device, such as a heat pipe, that is positioned on a side of the memory module. A thermally conductive path is thereby provided between the memory module and the heat transfer device via the thermal interface device.
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公开(公告)号：US20200159294A1
公开(公告)日：2020-05-21
申请号：US16191916
申请日：2018-11-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , William K. Norton , Ernesto Ferrer Medina
IPC: G06F1/20 , G11C5/04 , H01L27/108 , H05K1/02
Abstract: A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.
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公开(公告)号：US10542640B1
公开(公告)日：2020-01-21
申请号：US16143775
申请日：2018-09-27
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Kevin B. Leigh , John Franz , Everett Salinas
Abstract: Liquid chamber housings are described herein. In one example, an apparatus for liquid chamber housings can include a first housing segment coupled to a first side of a board and a second housing segment coupled to a second side of the board to create a liquid chamber for a portion of the board between the first housing segment and the second housing segment.
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公开(公告)号：US20190025896A1
公开(公告)日：2019-01-24
申请号：US16139109
申请日：2018-09-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Thomas Robert Bowden , Alan B. Doerr , John Franz , Melvin K. Benedict , Joseph Allen , John Norton , Binh Nguyen
IPC: G06F1/20 , G06F13/42 , G06F1/18 , H01L23/40 , H01L23/367
CPC classification number: G06F1/206 , G06F1/185 , G06F1/20 , G06F13/42 , H01L23/367 , H01L23/4093 , H01L2924/0002 , H01L2924/00
Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.
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公开(公告)号：US20180112656A1
公开(公告)日：2018-04-26
申请号：US15569249
申请日：2015-09-04
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Tahir Cader , John Franz , Sammy L. Zimmerman
CPC classification number: F04B49/065 , F04B37/14 , F04B49/02 , F04B51/00 , G06F1/20 , G06F2200/201
Abstract: In one example implementation pump based issue identification includes monitoring a total number of operational cycles of a vacuum pump associated with a cooling device, comparing the total number of operational cycles to an operational cycle threshold, identify an issue based on the comparison of the total number of operational cycles to the operational cycle threshold, and generating a notification in response to identifying the issue.
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