公开(公告)号：DE102005042035A1

公开(公告)日：2007-03-08

申请号：DE102005042035

申请日：2005-09-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: C08L101/00 ,  B29C45/14 ,  B29C45/20 ,  C08J5/04 ,  C08J5/10 ,  C08K5/17 ,  C09D5/25 ,  C09D163/00 ,  H01L23/29

公开(公告)号：DE102005037321A1

公开(公告)日：2007-02-15

申请号：DE102005037321

申请日：2005-08-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: H01L23/48 ,  H01L21/48 ,  H01L21/60

Abstract: The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads on the circuit carrier. The conductor tracks include an electrically conductive polymer in the semiconductor device.

公开(公告)号：DE102005026098B3

公开(公告)日：2007-01-04

申请号：DE102005026098

申请日：2005-06-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  CHAN KAI CHONG

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/08

Abstract: A panel and a semiconductor component including a composite board with semiconductor chips and plastic package molding compound and a method for the production thereof is disclosed. In one embodiment, the panel includes a composite board with semiconductor chips arranged in rows and columns in a corresponding plastic package molding compound with a plurality of semiconductor component positions. The thickness of the plastic package molding compound corresponds to the thickness of the semiconductor chips so that a coplanar upper side and a coplanar rear side are formed on the composite board. Located on the coplanar rear side of the composite board is a plastic layer whose coefficient of thermal expansion corresponds to the coefficient of thermal expansion of the composite board. Located on the coplanar upper side of the composite board is a wiring structure which has corresponding external contacts.

公开(公告)号：DE102005025543A1

公开(公告)日：2006-12-14

申请号：DE102005025543

申请日：2005-06-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  POHL JENS

IPC: H01L23/29 ,  C09D5/25 ,  H01L21/60 ,  H01L23/50

公开(公告)号：DE102005020453A1

公开(公告)日：2006-11-09

申请号：DE102005020453

申请日：2005-04-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  WIENEKE-KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: H01L23/495 ,  B82B1/00 ,  B82B3/00 ,  H01L21/48

Abstract: A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.

公开(公告)号：DE102005015454A1

公开(公告)日：2006-10-05

申请号：DE102005015454

申请日：2005-04-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  MAHLER JOACHIM ,  HAIMERL ALFRED

IPC: H01L23/48 ,  B32B15/02 ,  B81B1/00 ,  B81C1/00 ,  C08K3/10 ,  C08K5/56 ,  C08L83/00 ,  C08L101/00 ,  G01N33/50 ,  H01L21/48 ,  H01L23/057 ,  H01L23/16

Abstract: Semiconductor sensor component comprises a cavity container (2) and components arranged in a cavity (3) of the container, which exhibit a sensor chip (4) with sensor range (5), where the cavity container exhibits an opening (6), the sensor range is turned to the opening, the sensor chip is embedded in the cavity of the container into back or edges of a rubber elastic layer (7) that exhibits cleavable store-metal-organic or inorganic metal containing-complex (11), which lies freely at the top side of the elastic layer and forms metallic-germs for wiring lines (14). Semiconductor sensor component comprises a cavity container (2) and components arranged in a cavity (3) of the container, which exhibit a sensor chip (4) with sensor range (5), where the cavity container exhibits an opening (6) for adjacency and the sensor range is turned to the opening, the sensor chip is embedded in the cavity of the container into back or edges of a rubber elastic layer (7) that exhibits cleavable store-metal-organic or inorganic metal containing-complex (11), which lies freely at the top side of the elastic layer and forms metallic-germs for wiring lines (14), the wiring lines electrically connects to the sensor range of the sensor chip with contact connection areas in the cavity of the cavity container, the top of the components within the cavity container is arranged to an elastic sealing layer (17). An independent claim is included for the preparation of semiconductor sensor components.

公开(公告)号：DE102004056534A1

公开(公告)日：2006-06-01

申请号：DE102004056534

申请日：2004-11-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/50

公开(公告)号：DE102004058877A1

公开(公告)日：2006-04-13

申请号：DE102004058877

申请日：2004-12-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: B81B1/00 ,  B81C1/00 ,  H01L21/50 ,  H01L29/06 ,  H01L31/0248 ,  H01L33/00

Abstract: Semiconductor chip (1) comprises a front section (3) with a semiconductor functional element, and a rear section (4). The rear section has at least one cut out (2). A section of the rear surface has a solderable metal layer (8).

公开(公告)号：DE102004049663B3

公开(公告)日：2006-04-13

申请号：DE102004049663

申请日：2004-10-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  BACHMAIER ULRICH ,  HAGEN ROBERT

IPC: H01L23/50 ,  H01L23/06 ,  H01L25/065

Abstract: A plastic package and to a semiconductor component including such a plastic package, as well as to a method for its production is disclosed. In one embodiment, the plastic package includes plastic outer faces, which include lower outer contact faces on a lower side of the plastic package and upper outer contact faces on an upper side, which are connected together via outer conductor tracks. The conductor tracks include conduction paths which are formed on exposed conducting deposits in the plastic package.

公开(公告)号：DE102004049654B3

公开(公告)日：2006-04-13

申请号：DE102004049654

申请日：2004-10-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  BACHMAIER ULRICH ,  HAGEN ROBERT ,  POHL JENS ,  STEINER RAINER ,  STROBEL PETER ,  VILSMEIER HERMANN ,  WOERNER HOLGER ,  ZUHR BERNHARD

IPC: H01L23/50 ,  H01L23/055 ,  H01L25/10

Abstract: A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.