公开(公告)号：DE2920766A1

公开(公告)日：1979-11-29

申请号：DE2920766

申请日：1979-05-22

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with non-formaldehyde-type agents, specifically hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.

公开(公告)号：EP0276276A4

公开(公告)日：1989-03-29

申请号：EP87905030

申请日：1987-06-25

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD

IPC: C25D7/00 ,  B05D1/32 ,  C23C18/28 ,  C23C28/00 ,  C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

CPC classification number: C25D5/56 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184 ,  H05K3/427 ,  H05K2203/0706 ,  H05K2203/072 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/1415 ,  H05K2203/1476 ,  Y10S205/926

Abstract: Printed circuit boards containing through-holes (140) requiring metallization are manufactured by first applying to a circuit board which comprises insulating substrate (100) and metal foil (120) an alkaline strippable resist (180) in a predetermined desired pattern, thereafter applying material catalytic to subsequent metallization, thereafter treating the board with an aqueous alkaline solution to remove catalytic material from resist surfaces without adversely affecting catalyst at the non-resist areas, and then metallizing the non-resist areas to form a metal layer (160). The ability to preliminarily apply the resist pattern before catalyst application, metallization, et cetera, yet prevent metallization of the resist, enables the manufacturing process to proceed straight through the activation, metallization, et cetera steps without need for interruption for resist application.

公开(公告)号：EP0277148A4

公开(公告)日：1989-10-25

申请号：EP87904437

申请日：1987-06-17

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E

IPC: H05K3/28 ,  C25D7/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/244 ,  H05K3/062 ,  H05K3/108 ,  H05K3/28 ,  H05K3/384 ,  H05K3/42 ,  H05K3/427 ,  H05K2203/0361

Abstract: A method of preparing printed circuit boards in which the solder mask on the circuit pattern and, optionally, the solder on the through-holes and surrounding pads, and like areas to receive solder, is applied over a layer of lead covering the copper layer at said loci. This method eliminates the need to strip tin-lead alloy etch resist which step is commonly employed in prior processes. The method overcomes the problems associated with migration of tin into the copper layer which can occur when tin-lead alloys are applied directly over copper.

公开(公告)号：EP0096034A4

公开(公告)日：1984-05-03

申请号：EP82900581

申请日：1981-12-21

Applicant: MACDERMID INC

Inventor： FERRIER DONALD R ,  RHODENIZER HAROLD L ,  KUKANSKIS PETER E ,  GRUNWALD JOHN

IPC: H05K3/18 ,  C23C18/40 ,  C23C3/02

CPC classification number: C23C18/40

Abstract: Suitably complexed cupric solutions can deposit conductive copper films electrolessly on properly catalyzed non-conductive substrates, at plating bath pH values in the range of about 2.0 to 3.5, using a non-formaldehyde reducer such as hypophosphite. Certain conditions are critical to successful results: (1) ability of the complexer selected to chelate copper at pH values of 2.0 to 3.5 at elevated temperatures (140 to 160 F); (2) avoidance of certain anions, such as halides and acetates, in significant concentrations in the plating solution; and (3) provision of an "active" catalytic surface on the non-conductive substrate.

公开(公告)号：EP0284626A4

公开(公告)日：1989-02-21

申请号：EP87906858

申请日：1987-07-31

Applicant: MACDERMID INC

Inventor： BACH WOLF ,  FERRIER DONALD R ,  KUKANSKIS PETER E ,  WILLIAMS ANN S ,  SENECHAL MARY JANE

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  C23C18/26 ,  C23C18/28 ,  C23C18/31 ,  C23C18/38 ,  C23C18/40 ,  C23C18/54 ,  H05K3/38 ,  H05K3/42

CPC classification number: C23C18/1893 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/28 ,  C23C18/285 ,  C23C18/30 ,  H05K3/389 ,  H05K3/422 ,  H05K3/427

Abstract: Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, are treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.

公开(公告)号：EP0148209A4

公开(公告)日：1986-01-07

申请号：EP84902283

申请日：1984-05-21

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  SAWOSKA DAVID

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/42

CPC classification number: C23C18/28 ,  H05K3/422

Abstract: A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an accelerator bath containing an agent which oxidizes the tin.

公开(公告)号：EP0057232A4

公开(公告)日：1982-12-15

申请号：EP81902342

申请日：1981-08-10

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E

IPC: H05K3/42 ,  C23C18/40 ,  C23C18/52 ,  C25D3/38 ,  C25D5/00 ,  C25D5/54 ,  H05K3/18 ,  H05K3/24

CPC classification number: C25D5/54 ,  C23C18/1653 ,  C23C18/40 ,  C25D3/38 ,  H05K3/241 ,  H05K3/424

Abstract: A method of continuously depositing a metallic plating on the surface of a workpiece from a non-autocatalytic electroless plating bath that is normally inherently self-limiting as to the thickness of metal which can be deposited by electrolessly plating by applying an electric potential on the workpiece in the electroless bath. The method provides non-autocatalytic baths, such as hypophosphite-reduced electroless copper baths, with the ability to plate on nonconductors to a desired thickness which increases with time at a rate dependent on the amount of current applied A more uniform thickness of deposit over the workpiece being plated and greater deposit penetration into blind holes, deep recesses and tubular portions of complex-shaped parts is obtainable by the method.

Abstract translation: 的工件的表面上连续沉积金属电镀从非自催化无电镀浴那样一种方法，通常是固有地自限，以金属的厚度可以由通过施加到电势在工件上化学镀来沉积 在化学浴。 该方法提供了非自催化浴，颜色：例如次磷酸盐还原的非电解铜浴，使用对非导体板至所需的厚度随时间的速率取决于在存款的电流施加更均匀的厚度的量增加的能力 被电镀的工件和更大的存款渗透到盲孔，深凹槽和复杂形状的部件的管状部分是可获得的由该方法。