公开(公告)号：AT279089T

公开(公告)日：2004-10-15

申请号：AT00960304

申请日：2000-07-24

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  PATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH

Inventor： DEBRAY ALEXANDRA ,  WAITL GUENTER ,  KUMMER FRANZ ,  ZWASCHKA FRANZ ,  ELLENS ANDRIES

IPC: C09K11/78 ,  C09K11/08 ,  C09K11/62 ,  C09K11/77 ,  C09K11/80 ,  H01L33/50 ,  H05B33/14 ,  H01L33/00

Abstract: A number of fluorescent materials are mixed, containing a garnet, in which the first component A is at least partially substituted by Tb. The garnet is of formula known mixture includes A 3B 5O 12, where A and B are first and second components. A is Y, Lu, Se, La, Gd or Am. B is Al, Ga or In. In each case, for A or B, a mixed content is feasible. An independent claim is also included for a waveguide using the above fluorescent composition.

公开(公告)号：DE10303455A1

公开(公告)日：2004-08-19

申请号：DE10303455

申请日：2003-01-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  JAEGER HARALD

IPC: H01L23/495 ,  H01L33/62 ,  H01L33/00

Abstract: The lead frame band (9) includes several component lead frames (1) held in a support and guiding area (6). Each of the component lead frames has at least two electrical connection strips (2). The lead frames are held by connection links (3) between the connection strips and the support and guiding area. The connection links are springy, so that the lead frame can be moved in all directions with respect to the support and guiding area. An INDEPENENT CLAIM is also provided for a method for manufacturing several lead frame based light emitting diode components.

公开(公告)号：DE19922361C2

公开(公告)日：2003-05-28

申请号：DE19922361

申请日：1999-05-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  BLUEMEL SIMON

IPC: B61L5/18 ,  E01F9/559 ,  E01F9/582 ,  E01F9/594 ,  F21S8/00 ,  F21V5/04 ,  F21Y115/10 ,  H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  F21K7/00 ,  F21S8/10

公开(公告)号：DE10140831A1

公开(公告)日：2003-03-13

申请号：DE10140831

申请日：2001-08-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00 ,  H01L23/495

Abstract: Designed to go between a chip connection area and a soldered connecting strip (2a,2b), a flexible ductile element (3a) runs on one and the same surface level of a conductor frame (1) as the soldered connecting strip and enables the soldered connecting strip to move in relation to the chip connection area in a parallel direction to a mounting surface for a component casing (8). A radiation-emitting chip (16) like an LED semiconductor chip or a semiconductor LASER is fastened, soldered on or glued on with an electrically conductive bonding agent on an area that is formed by a chip connection part (14) and is part of a radiation emission window (12). Independent claims are also included for a casing for a radiation-emitting surface-mounted component, for a surface-mounted radiation-emitting component and for a structure with multiple radiation-emitting components.

公开(公告)号：DE10020465A1

公开(公告)日：2001-11-08

申请号：DE10020465

申请日：2000-04-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： DEBRAY ALEXANDRA ,  BRUNNER HERBERT ,  WAITL GUENTER ,  JAEGER HARALD

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: The invention concerns a radiation emitting semiconductor component with a luminescence-converting element (7), wherein the semiconductor body (3) is disposed in a groove of the base body (1). A cup-shaped area containing the luminescence-converting element (7) surrounding the semiconductor body (3) is formed inside the groove around the semiconductor body. The cup-shaped area is formed in the shape of a hollowness inside the groove or as an annular fringe (6) on the bottom of the groove.

公开(公告)号：DE10013056A1

公开(公告)日：2001-09-20

申请号：DE10013056

申请日：2000-03-19

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BLUEMEL SIMON ,  WAITL GUENTER

IPC: F21V5/02 ,  F21V5/04 ,  H01L33/58 ,  H01L25/13 ,  F21V5/00

Abstract: The module (1) has an arrangement (2) of light emitting diodes and an optical device (3) in the beam path of the arrangement that radiates light to a surface (4) at a distance. The optical device changes the light emitted by the LED arrangement so that the light density distribution on the surface is uniform. Independent claims are also included for the following: an illumination arrangement with a light source module.

公开(公告)号：DE19963791A1

公开(公告)日：2001-07-05

申请号：DE19963791

申请日：1999-12-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： DEBRAY ALEXANDRA ,  WAITL GUENTER

IPC: C09K11/77 ,  C09K11/80 ,  H01L33/50 ,  H05B33/14 ,  H01L33/00 ,  C09K11/88

Abstract: Fluorescent, cerium-activated garnet-based structure comprises A3B5O12 structure with B representing Al and/or Ga, a novel introduction of terbium is included in the first component A. An Independent claim is included for the method of making the fluorescent material by melting the oxide with addition of flux, heating strongly in forming gas, grinding and sieving, and reheating.

公开(公告)号：DE19936605A1

公开(公告)日：2001-02-15

申请号：DE19936605

申请日：1999-08-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEHN KLAUS ,  WAITL GUENTER ,  ARNDT KARLHEINZ

IPC: C08G59/24 ,  C08G59/32 ,  C08G59/38 ,  C08G59/42 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56 ,  C08L63/00 ,  C08K5/092

Abstract: The invention relates to a cast resin material which can be used as a material for assembling and encapsulating electronic and optoelectronic parts, modules and components. The inventive resin material can be used to cast optoelectronic parts made from epoxy compounds which are acid-anhydride curable, especially bisphenol-A-diglycidylether, and is characterized in that it contains poly-functional epoxynovolac resins, especially one epoxycresolnovalac. Said cast resin material exhibits a significantly higher glass transition temperature, is suitable for mass production processes, is not harmful to health and yields SMT-enabled products which can be used in car production.

公开(公告)号：DE19909399C1

公开(公告)日：2001-01-04

申请号：DE19909399

申请日：1999-03-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BACHL BERNHARD ,  WAITL GUENTER

IPC: H05K7/12 ,  F21S8/10 ,  F21V5/00 ,  F21V19/00 ,  F21V29/00 ,  F21Y115/10 ,  H01L25/13 ,  H05K1/02 ,  H05K1/18 ,  H01L25/075 ,  F21V23/00

公开(公告)号：DE19922361A1

公开(公告)日：2000-11-30

申请号：DE19922361

申请日：1999-05-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  BLUEMEL SIMON

IPC: B61L5/18 ,  E01F9/559 ,  E01F9/582 ,  E01F9/594 ,  F21S8/00 ,  F21V5/04 ,  F21Y115/10 ,  H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  F21S8/10 ,  H01L25/13

Abstract: The invention relates to an LED module having a regular array of LEDs (10), wherein each LED (10) is provided with a lens (20) and the LEDs (10) are mounted on a plate (1). An optics support plate (2) is provided that contains a regular arrangement of light bundling optical devices (20; 30) corresponding to the LED array. The light bundling optical devices can be lenses (20) or optical channels with reflecting side walls which are integrated into the optics support plate (2).