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    METHOD FOR FABRICATING SUSPENDED MEMS STRUCTURES
    53.
    发明申请
    METHOD FOR FABRICATING SUSPENDED MEMS STRUCTURES 审中-公开
    制造悬挂MEMS结构的方法

    公开(公告)号：WO2016167853A1

    公开(公告)日：2016-10-20

    申请号：PCT/US2016/014223

    申请日：2016-01-21

    Applicant: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY OF THE NAVY ,  MEYER, David, J. ,  DOWNEY, Brian, P.

    Inventor： MEYER, David, J. ,  DOWNEY, Brian, P.

    IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L27/04

    CPC classification number: B81C1/00539 ,  B81C1/00936 ,  B81C2201/0107 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0177

    Abstract: A process for fabricating a suspended microelectromechanical system (MEMS) structure comprising epitaxial semiconductor functional layers that are partially or completely suspended over a substrate. A sacrificial release layer and a functional device layer are formed on a substrate. The functional device layer is etched to form windows in the functional device layer defining an outline of a suspended MEMS device to be formed from the functional device layer. The sacrificial release layer is then etched with a selective release etchant to remove the sacrificial release layer underneath the functional layer in the area defined by the windows to form the suspended MEMS structure.

    Abstract translation: 一种用于制造包括部分地或完全地悬置在衬底上的外延半导体功能层的悬置微机电系统（MEMS）结构的工艺。 牺牲释放层和功能器件层形成在衬底上。 对功能器件层进行蚀刻以在功能器件层中形成窗口，从而界定将从功能器件层形成的悬置MEMS器件的轮廓。 然后用选择性释放蚀刻剂对牺牲释放层进行蚀刻，以去除由窗口限定的区域中的功能层下方的牺牲释放层，以形成悬浮的MEMS结构。

    PCB SPEAKER AND METHOD FOR MICROMACHINING SPEAKER DIAPHRAGM ON PCB SUBSTRATE
    54.
    发明申请
    PCB SPEAKER AND METHOD FOR MICROMACHINING SPEAKER DIAPHRAGM ON PCB SUBSTRATE 审中-公开
    印刷电路板扬声器和印刷电路板基板上的扬声器胶片的方法

    公开(公告)号：WO2016029359A1

    公开(公告)日：2016-03-03

    申请号：PCT/CN2014/085207

    申请日：2014-08-26

    Applicant: GOERTEK INC.

    Inventor： ZOU, Quanbo

    IPC: H04R19/02 ,  H04R7/14

    CPC classification number: H04R31/003 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C1/00476 ,  B81C2201/0107 ,  B81C2201/019 ,  H04R1/06 ,  H04R7/04 ,  H04R7/14 ,  H04R19/005 ,  H04R19/02 ,  H04R31/00 ,  H04R2201/003 ,  H04R2499/11

    Abstract: A PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate (S110); providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate (S120); providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer (S130); and releasing the sacrificial layer and the diaphragm layer remains (S140).

    Abstract translation: 一种PCB扬声器和用于在PCB基板上微加工扬声器振膜的方法，用于在PCB基板上微加工扬声器振动膜的方法包括：在PCB基板上提供金属通路和至少一个通孔（S110）; 在所述PCB衬底上提供图案化牺牲层，所述牺牲层覆盖所述PCB衬底上的所有通孔（S120）; 通过沉积，安装或层叠覆盖牺牲层并与PCB衬底上的金属路径电连接的隔膜层在牺牲层上提供隔膜层，从而形成隔膜层（S130）; 并释放牺牲层和隔膜层（S140）。

    MICRO-DEVICE ON GLASS
    55.
    发明申请
    MICRO-DEVICE ON GLASS 审中-公开
    玻璃上的MICRO-DEVICE

    公开(公告)号：WO2012134394A1

    公开(公告)日：2012-10-04

    申请号：PCT/SG2011/000129

    申请日：2011-03-30

    Applicant: VISWANADAM, Gautham

    Inventor： VISWANADAM, Gautham

    IPC: H01L21/00

    CPC classification number: B81C1/00341 ,  B81B2201/051 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C1/00476 ,  B81C2201/0107 ,  B81C2203/036 ,  H01L21/00

    Abstract: A method of fabricating a micro-device having micro-features on glass is presented. The method includes the steps of preparing a first glass substrate, fabricating a metallic pattern on the first glass substrate, preparing a second glass substrate and providing one or more apertures on the second glass substrate, heating the first glass substrate and the second glass substrate with a controlled temperature raise, bonding the first glass substrate and the second glass substrate by applying pressure to form a bonded substrate, wherein the metallic pattern is embedded within the bonded substrate, cooling the bonded substrate with a controlled temperature drop and thereafter maintaining the bonded substrate at a temperature suitable for etching, etching the metallic pattern within the bonded substrate, wherein an etchant has access to the metallic pattern via the apertures, forming a void within the bonded substrate, wherein the void comprises micro-features.

    Abstract translation: 提出了一种在玻璃上制造具有微特征的微器件的方法。 该方法包括以下步骤：制备第一玻璃基板，在第一玻璃基板上制造金属图案，制备第二玻璃基板并在第二玻璃基板上提供一个或多个孔，加热第一玻璃基板和第二玻璃基板， 控制温度升高，通过施加压力来接合第一玻璃基板和第二玻璃基板以形成接合基板，其中金属图案嵌入在接合基板内，以受控的温度下降冷却接合基板，然后保持接合基板 在适于蚀刻的温度下蚀刻所述键合衬底内的所述金属图案，其中所述蚀刻剂经由所述孔进入所述金属图案，在所述键合衬底内形成空隙，其中所述空隙包括微特征。

    PROCESS FOR FORMING MICROSTRUCTURES
    57.
    发明申请
    PROCESS FOR FORMING MICROSTRUCTURES 审中-公开
    形成微结构的方法

    公开(公告)号：WO2006068737A1

    公开(公告)日：2006-06-29

    申请号：PCT/US2005/041661

    申请日：2005-11-18

    Applicant: TOUCHDOWN TECHNOLOGIES, INC.

    Inventor： TANG, Weilong ,  HSU, Tseng-Yeng ,  ISMAIL, Salleh ,  TEA, Nim, Hak ,  KHOO, Melvin, B. ,  GARABEDIAN, Raffi ,  NAMBURI, Lakshmikanth

    IPC: G03F7/00

    CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

    Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

    Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

    PROCESS FOR FORMING MICROSTRUCTURES
    60.
    发明公开
    PROCESS FOR FORMING MICROSTRUCTURES 审中-公开
    用于地层微结构的

    公开(公告)号：EP1869528A1

    公开(公告)日：2007-12-26

    申请号：EP05845202.0

    申请日：2005-11-18

    Applicant: Touchdown Technologies, Inc.

    Inventor： TANG, Weilong ,  HSU, Tseng-Yeng ,  ISMAIL, Salleh ,  TEA, Nim, Hak ,  KHOO, Melvin, B. ,  GARABEDIAN, Raffi ,  NAMBURI, Lakshmikanth

    IPC: G03F7/00

    CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

    Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

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