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公开(公告)号：US20160193407A1
公开(公告)日：2016-07-07
申请号：US15015627
申请日：2016-02-04
Applicant: Cam Med LLC
Inventor： Yanzhe Qin , Zhifei Ge
CPC classification number: A61M5/14248 , A61M5/14586 , A61M5/16881 , A61M39/24 , A61M2005/14252 , A61M2205/3334 , A61M2205/35 , A61M2205/581 , A61M2205/582 , A61M2207/00 , B32B37/12 , B32B2535/00 , B81B2201/036 , B81C1/00158 , B81C2201/034 , F04B43/043 , F04B53/10 , F16K2099/008 , F16K2099/0094
Abstract: A flexible patch pump for controllable accurate subcutaneous delivery of one or more medicaments to a patient includes a laminated layered structure. The pump may have a rigid reservoir layer including a number of rigid reservoirs disposed in a flexible material; a flexible microfluidic layer including a compliant membrane for sealing the rigid reservoirs, a network of microfluidic channels connecting the rigid reservoirs, and a number of inlet and/or outlet valves corresponding to the rigid reservoirs; and a flexible-rigid electronic circuit layer including a number of individually-addressable actuators. In operation, the rigid reservoirs may contain medicament that is dispensed in precise volumes at appropriate times due, for to example, to a pressure change in an addressed reservoir caused by displacement of the compliant membrane or other actuation element.
Abstract translation: 用于将一种或多种药物可控地精确皮下递送给患者的柔性贴剂泵包括层压层状结构。 泵可以具有刚性贮存器层，其包括设置在柔性材料中的多个刚性储存器; 柔性微流体层，其包括用于密封刚性贮存器的柔性膜，连接刚性储存器的微流体通道网络和对应于刚性储存器的多个入口和/或出口阀; 以及包括多个单独寻址的致动器的柔性刚性电子电路层。 在操作中，刚性贮存器可以包含在适当的时间以精确的体积分配的药剂，例如由于顺应性膜或其它致动元件的位移引起的地址储存器中的压力变化。
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52.发明授权Universal hardware platform and toolset for operating and fabricating microfluidic devices 有权用于操作和制造微流体设备的通用硬件平台和工具集公开(公告)号：US09365418B2
公开(公告)日：2016-06-14
申请号：US14241975
申请日：2012-09-04
Applicant: Carlo Joseph Quinonez
Inventor： Carlo Joseph Quinonez
IPC: B81C99/00 , B29C45/17 , F04B19/00 , F04B43/04 , F04B49/06 , G05D7/06 , B01L1/02 , B01L3/00 , B29C45/34 , B29C45/40 , G01N35/00 , B29C45/00
CPC classification number: B81C99/0085 , B01L1/025 , B01L3/502707 , B01L3/502715 , B01L2200/027 , B01L2200/028 , B01L2300/0645 , B01L2400/0481 , B01L2400/0487 , B29C45/1753 , B29C45/34 , B29C45/401 , B29C2045/0094 , B81C2201/034 , F04B19/006 , F04B43/043 , F04B49/065 , G01N2035/00158 , G05D7/0694 , Y10T137/8376
Abstract: A microfluidic device platform may include a valve manifold adapted to deliver a programmable pressure to a plurality of ports, a cell chamber having programmable environmental control, and a chip-to-world interface.
Abstract translation: 微流体装置平台可以包括适于将可编程压力递送到多个端口的阀歧管，具有可编程环境控制的电池室和芯片到世界接口。
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53.发明授权公开(公告)号：US09221217B2
公开(公告)日：2015-12-29
申请号：US13983637
申请日：2012-02-03
Applicant: Thomas Lisec , Mato Knez
Inventor： Thomas Lisec , Mato Knez
CPC classification number: B29C67/0074 , B29C64/141 , B81C99/0085 , B81C2201/034 , C23C16/01 , C23C16/045 , C23C16/403 , C23C16/45525 , C23C16/56 , Y10T428/249955
Abstract: The invention relates to a method for producing a three-dimensional structure. The method according to the invention comprises the following steps: applying to or introducing into a carrier element (1; 7; 16) particles (2), a plurality of at least partially interlinked cavities being formed between the particles (2) and the particles (2) coming into contact in points of contact, and interconnecting the particles (2) in the points of contact by coating the system consisting of particles and the carrier element, the coat (4) produced during coating penetrating the cavities at least to some extent. The method according to the invention allows the production of three-dimensional structures with little effort.
Abstract translation: 本发明涉及三维结构的制造方法。 根据本发明的方法包括以下步骤：向载体元件（1; 7; 16）施加或引入颗粒（2），在颗粒（2）和颗粒之间形成多个至少部分互连的空腔 （2）以接触点接触，并且通过涂覆由颗粒和载体元件组成的系统将接触点中的颗粒（2）互连，在涂覆期间产生的涂层（4）至少渗透到空腔中 程度。 根据本发明的方法允许以很小的努力生产三维结构。
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54.发明申请ENCAPSULATED COMPONENT COMPRISING A MEMS COMPONENT AND METHOD FOR THE PRODUCTION THEREOF 有权包含MEMS组件的封装组件及其生产方法公开(公告)号：US20150344296A1
公开(公告)日：2015-12-03
申请号：US14759602
申请日：2013-10-23
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
CPC classification number: B81B7/0058 , B81B7/0054 , B81B7/0061 , B81B7/007 , B81B2201/0257 , B81B2201/0264 , B81B2207/012 , B81C1/0023 , B81C1/00301 , B81C3/001 , B81C2201/034 , B81C2203/0154 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48472 , H01L2924/1461 , H01L2924/19107 , H04R23/00 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process.
Abstract translation: 提出了包括载体，芯片部件和MEMS部件的部件，其中机械敏感的MEMS部件安装在载体上的半壳下方。 该组分在传递模塑过程中用模塑料封装。
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55.发明授权Method for making a 3D nanostructure having a nanosubstructure, and an insulating pyramid having a metallic tip, a pyramid having nano-apertures and horizontal and/or vertical nanowires obtainable by this method 有权制造具有纳米级结构的3D纳米结构的方法和具有金属尖端的绝缘金字塔，具有纳米孔的金字塔和通过该方法可获得的水平和/或垂直的纳米线公开(公告)号：US08932473B2
公开(公告)日：2015-01-13
申请号：US12811674
申请日：2008-12-22
Applicant: Johan Willem Berenschot , Niels Roelof Tas
Inventor： Johan Willem Berenschot , Niels Roelof Tas
CPC classification number: B81C1/00111 , B33Y10/00 , B33Y80/00 , B81C2201/034 , B82Y35/00 , G01Q70/10 , G01Q70/16 , Y10T428/2913 , Y10T428/2982
Abstract: The invention relates to a method for making a 3D nanostructure having a nanosubstructure, comprising the steps of: i) providing a mold comprising at least one sharp concave corner; ii) conformational depositing at least one structural material in the sharp concave corner; iii) isotropically removing structural material; iv) depositing at least one other structural material; v) removing earlier deposited structural material; vi) forming a nanosubstructure; and vii) removing the mold thereby providing the 3D nanostructure having the nanosubstructure.
Abstract translation: 本发明涉及一种制备具有纳米结构的3D纳米结构的方法，包括以下步骤：i）提供包括至少一个锋利的凹角的模具; ii）在锋利的凹角中构造沉积至少一种结构材料; iii）各向同性地除去结构材料; iv）沉积至少一种其他结构材料; v）清除较早沉积的结构材料; vi）形成纳米结构; 和vii）去除模具，从而提供具有纳米结构的3D纳米结构。
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Patent Agency Ranking
公开(公告)号：US20140322489A1
公开(公告)日：2014-10-30
申请号：US14218872
申请日：2014-03-18
Applicant: California Institute of Technology
Inventor： Marc A. Unger , Hou-Pu Chou , Todd A. Thorsen , Axel Scherer , Stephen R. Quake
IPC: F16K13/00
CPC classification number: B29C51/00 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2300/0861 , B01L2300/0887 , B01L2300/123 , B01L2400/046 , B01L2400/0481 , B01L2400/0655 , B33Y80/00 , B81B5/00 , B81B2201/036 , B81B2201/054 , B81C1/00119 , B81C2201/019 , B81C2201/034 , C12Q1/6874 , F04B43/043 , F15C1/06 , F15C5/00 , F16K11/20 , F16K13/00 , F16K31/126 , F16K99/0001 , F16K99/0015 , F16K99/0046 , F16K99/0048 , F16K99/0051 , F16K99/0059 , F16K2099/0074 , F16K2099/0076 , F16K2099/0078 , F16K2099/008 , F16K2099/0094 , Y10T137/0491 , Y10T137/0497 , Y10T137/2224 , Y10T137/87249 , Y10T156/10 , Y10T428/24479 , Y10T428/24744 , C12Q2535/125
Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.
Abstract translation: 一种制造弹性体结构的方法，包括：在第一微加工模具的顶部上形成第一弹性体层，所述第一微加工模具具有形成沿所述第一弹性体层的底表面延伸的第一凹槽的第一凸起突起; 在第二微加工模具的顶部上形成第二弹性体层，所述第二微加工模具具有第二凸起突起，所述第二凸起突起形成沿所述第二弹性体层的底表面延伸的第二凹槽; 将第二弹性体层的底表面粘合到第一弹性体层的顶表面上，使得控制通道在第一和第二弹性体层之间的第二凹部中形成; 以及将第一弹性体层定位在平面基底的顶部上，使得流动通道在第一弹性体层和平面基底之间的第一凹部中形成。
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57.发明授权Continuous microscale forming of metal-based microchannels and other microchannel devices 有权金属微通道和其他微通道器件的连续微量成型公开(公告)号：US08857234B2
公开(公告)日：2014-10-14
申请号：US13006951
申请日：2011-01-14
Applicant: Wen Jin Meng , Fanghua Mei
Inventor： Wen Jin Meng , Fanghua Mei
CPC classification number: B81C1/00071 , B81C2201/034
Abstract: A process is disclosed for producing metal-based, high-aspect-ratio microscale structures (HARMs), for example microchannels in a heat exchanger. The preferred manufacturing method operates in a continuous mode, and employs low-temperature rolling of metals. A process is disclosed for bonding metal microchannel sheets or plates to flat metal sheets or plates to form single-, double-, and multiple-layered microchannel structures. The process can operate at much lower temperatures than prior methods of compression microscale molding of metals, at room temperature or even lower.
Abstract translation: 公开了用于生产金属基高纵横比微结构（HARM）的方法，例如热交换器中的微通道。 优选的制造方法以连续模式操作，并且采用金属的低温轧制。 公开了一种用于将金属微通道片或板接合到平板金属片或板以形成单层，双层和多层微通道结构的方法。 该方法可以在比现有的金属压缩微细成型方法低得多的温度下操作，在室温甚至更低的温度下。
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58.发明申请UNIVERSAL HARDWARE PLATFORM AND TOOLSET FOR OPERATING AND FABRICATING MICROFLUIDIC DEVICES 有权通用硬件平台和操作和制作微流体设备的工具公开(公告)号：US20140220173A1
公开(公告)日：2014-08-07
申请号：US14241975
申请日：2012-09-04
Applicant: Carlo Joseph Quinonez
Inventor： Carlo Joseph Quinonez
CPC classification number: B81C99/0085 , B01L1/025 , B01L3/502707 , B01L3/502715 , B01L2200/027 , B01L2200/028 , B01L2300/0645 , B01L2400/0481 , B01L2400/0487 , B29C45/1753 , B29C45/34 , B29C45/401 , B29C2045/0094 , B81C2201/034 , F04B19/006 , F04B43/043 , F04B49/065 , G01N2035/00158 , G05D7/0694 , Y10T137/8376
Abstract: A microfluidic device platform may include a valve manifold adapted to deliver a programmable pressure to a plurality of ports, a cell chamber having programmable environmental control, and a chip-to-world interface.
Abstract translation: 微流体装置平台可以包括适于将可编程压力递送到多个端口的阀歧管，具有可编程环境控制的电池室和芯片到世界接口。
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公开(公告)号：US20140065347A1
公开(公告)日：2014-03-06
申请号：US14016683
申请日：2013-09-03
Inventor： Metin Sitti , Seok Kim
IPC: C09J7/02
CPC classification number: C09J7/00 , A44B18/0049 , B29C33/3842 , B29C33/424 , B29C33/52 , B29C39/34 , B29C39/36 , B29C39/42 , B29L2031/756 , B81B2203/0361 , B81C99/0085 , B81C2201/034 , C09J9/00 , C09J2201/626 , Y10T428/23957 , Y10T428/2933 , Y10T428/2935 , Y10T428/2976
Abstract: A dry adhesive and a method of forming a dry adhesive. The method includes forming an opening through an etch layer and to a barrier layer, expanding the opening in the etch layer at the barrier layer, filling the opening with a material, removing the barrier layer from the material in the opening, and removing the etch layer from the material in the opening.
Abstract translation: 干燥粘合剂和形成干燥粘合剂的方法。 该方法包括通过蚀刻层和阻挡层形成开口，在阻挡层处扩展蚀刻层中的开口，用材料填充开口，从开口中的材料移除阻挡层，以及去除蚀刻 从开口的材料层。
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公开(公告)号：US20140010988A1
公开(公告)日：2014-01-09
申请号：US14016700
申请日：2013-09-03
Inventor： Metin Sitti , Seok Kim
CPC classification number: C09J7/00 , A44B18/0049 , B29C33/3842 , B29C33/424 , B29C33/52 , B29C39/34 , B29C39/36 , B29C39/42 , B29L2031/756 , B81B2203/0361 , B81C99/0085 , B81C2201/034 , C09J9/00 , C09J2201/626 , Y10T428/23957 , Y10T428/2933 , Y10T428/2935 , Y10T428/2976
Abstract: A dry adhesive and a method of forming a dry adhesive. The method includes forming an opening through an etch layer and to a barrier layer, expanding the opening in the etch layer at the barrier layer, filling the opening with a material, removing the barrier layer from the material in the opening, and removing the etch layer from the material in the opening.
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