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    Optically transparent conductive material
    51.
    发明授权
    Optically transparent conductive material 有权

    公开(公告)号：US09836176B1

    公开(公告)日：2017-12-05

    申请号：US15533416

    申请日：2015-12-10

    Applicant: MITSUBISHI PAPER MILLS LIMITED

    Inventor： Takenobu Yoshiki ,  Kazuhiko Sunada

    IPC: G06F3/044 ,  H05K1/02

    CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04111 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0289 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/09218 ,  H05K2201/09781

    Abstract: Provided is an optically transparent conductive material which is suitable as an optically transparent electrode for capacitive touchscreens, the optically transparent conductive material not causing moire even when placed over a liquid crystal display, having a favorably low pattern conspicuousness (non-conspicuousness), and having a high reliability. The optically transparent conductive material has, on an optically transparent support, an optically transparent conductive layer having optically transparent sensor parts electrically connected to terminal parts and optically transparent dummy parts not electrically connected to terminal parts, and in this optically transparent conductive material, the sensor parts and the dummy parts are formed of a metal thin line pattern having a mesh shape, and in the plane of the optically transparent conductive layer, the contour shape of each of the sensor parts extends in a first direction, the dummy parts are arranged alternately with the sensor parts in a second direction perpendicular to the first direction, the sensor parts are arranged at a cycle of L in the second direction, at least part of the metal thin line pattern in the sensor parts has a cycle of 2L/N in the second direction (wherein N is any natural number), and the metal thin line pattern in the dummy parts has a cycle longer than 2L/N or does not have a cycle in the second direction.

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    54.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    印刷线路板及其制造方法

    公开(公告)号：US20160044780A1

    公开(公告)日：2016-02-11

    申请号：US14820978

    申请日：2015-08-07

    Applicant: IBIDEN CO., LTD.

    Inventor： Yasushi INAGAKI ,  Kota NODA

    IPC: H05K1/02 ,  H05K1/09 ,  H05K3/18 ,  H05K3/20 ,  H05K3/06 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

    CPC classification number: H05K1/111 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/007 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/202 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4069 ,  H05K2201/0302 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/098 ,  H05K2203/06 ,  Y02P70/611

    Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.

    Abstract translation: 印刷布线板包括绝缘层，第一导体层，其嵌入绝缘层的第一表面中，并且包括用于连接电子部件的连接部分，从绝缘层的第二表面突出的第二导体层，阻焊层 覆盖第一导体层并具有露出连接部分的开口结构，形成在连接部分上的阻挡金属层，使得阻挡层从绝缘层的第一表面突出，以及形成在阻挡层上的金属柱，使得 金属柱分别位于连接部分上。 每个金属柱的宽度大于相应连接部分的宽度，并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。

    TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES
    59.
    发明公开
    TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES 审中-公开

    公开(公告)号：US20240074046A1

    公开(公告)日：2024-02-29

    申请号：US17899336

    申请日：2022-08-30

    Applicant: Intel Corporation

    Inventor： Ziyin Lin ,  Karumbu Nathan Meyyappan ,  Dingying Xu

    IPC: H05K1/11 ,  H05K1/18 ,  H05K3/46

    CPC classification number: H05K1/11 ,  H05K1/181 ,  H05K3/46 ,  H05K2201/0302 ,  H05K2201/10378

    Abstract: Technologies for integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails socket can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a foam cap layer that seals the liquid metal interconnects, electrically coupling the nails to the liquid metal interconnects. A fabric layer adjacent to the foam cap layer helps secure the foam cap layer, preventing small pieces of the foam cap layer that may be dislodged during repeated insertion into a bed of nails socket from becoming separated from the foam cap layer. The fabric layer can provide additional benefits, such as removing more of the liquid metal from the nails when the integrated circuit component is removed from the bed of nails socket.

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