METHODS FOR MAKING VERTICAL ELECTRICAL FEED THROUGH STRUCTURES
    51.
    发明申请
    METHODS FOR MAKING VERTICAL ELECTRICAL FEED THROUGH STRUCTURES 审中-公开
    通过结构制作垂直电气进给的方法

    公开(公告)号:WO2005055369A2

    公开(公告)日:2005-06-16

    申请号:PCT/US2004/039394

    申请日:2004-11-22

    IPC: H01R

    Abstract: Methods are provided for making vertical feed through electrical connection structures in a substrate or tile. The vertical feed throughs can be configured to make plated through holes usable for inserting and attaching connector probes. . Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires. Vertical feed throughs can also be configured to make tiles attachable and detachable as a layer between other substrates. The vertical feed through paths are formed with one end of each feed through hole permanently encapsulating a first electrical contact, and a second end supporting another pluggable and unpluggable electrical probe contact. Decoupling capacitors can be further plugged into holes formed in close proximity to the vertical feed through holes to increase performance of the decoupling capacitor.

    Abstract translation: 提供了用于通过基底或瓦片中的电连接结构进行垂直馈送的方法。 垂直进料通道可以配置为制造可用于插入和连接连接器探头的电镀通孔。 。 探针可以附着到电镀通孔或连接孔,以产生弹性弹簧触点,以形成晶片探针卡组件。 通过将涂覆有电镀材料的扭转牺牲线支撑在基板中,并且随后蚀刻掉线来形成扭曲管镀通孔结构。 垂直进料通道也可以被配置成使得瓦片可附着和分离成其它基底之间的层。 垂直进料通道形成有每个进料通孔的一端,其永久地密封第一电接触,第二端支撑另一可插拔和可拔出的电探针接触。 去耦电容器可以进一步插入靠近垂直馈通孔形成的孔中,以提高去耦电容的性能。

    VERFAHREN UND VORRICHTUNG ZUM DURCHKONTAKTIEREN VON SUBSTRATEN UND LEITERPLATTEN
    52.
    发明申请
    VERFAHREN UND VORRICHTUNG ZUM DURCHKONTAKTIEREN VON SUBSTRATEN UND LEITERPLATTEN 审中-公开
    方法和装置接触基板,电路板等

    公开(公告)号:WO2003043394A1

    公开(公告)日:2003-05-22

    申请号:PCT/EP2002/012774

    申请日:2002-11-14

    Abstract: Ein Verfahren und eine Vorrichtung zum Durchkontaktieren von flexiblen Substraten 1, insbesondere Leiterplatten, mit auf zwei einander gegenüberliegenden Oberflächen 1a, 1b des Substrats vorliegenden elekrisch leitfähigen Kontaktzonen 4, 41 sieht vor, dass im Bereich der Kontaktzonen ein Schnitt 11 schräg zu den Oberflächen des Substrats erzeugt wird und die beiden an den schrägen Schnitt angrenzenden Substratbereiche 20, 30 aneinander vorbeibewegt werden, bis sie hintereinander verrasten. Das aneinander Vorbeibewegen erfolgt mittels einem Stössel 12, unter Beaufschlagung mit Druckluft 13, unter Anlegung eines Unterdrucks 14 oder mittels einem am Schneidwerkzeug fixierten Mitnahmehaken 15. Die beiden Schritte des Schnitterzeugens und aneinander Vorbeibewegens der beiden an den Schnitt angrenzenden Substratbereiche erfolgt in einer gemeinsamen Bearbeitungsstation, vorzugsweise in einem einzigen Arbeitsgang.

    Abstract translation: 一种用于通过接触柔性基板1,特别是电路板,具有相对的两个面1a,存在于由电传导接触区4的基板1b中,41方法和装置提供的是,在接触区的区域中的部分11倾斜于所述衬底的所述表面 被生成并在两个邻接的斜明暗基板部分20,30通过彼此移动,直到它们锁定在彼此之后。 过去的一通过柱塞12的装置的另一个移动,压缩空气13的作用下,在真空下14的应用程序或通过的手段固定到切削工具的驱动钩15的部分发生的两个步骤和经过彼此移动两个基板区域邻接切割发生在共同的处理站, 优选在单次操作。

    WIRING BOARD HAVING VIAS
    53.
    发明申请
    WIRING BOARD HAVING VIAS 审中-公开
    有线电视板

    公开(公告)号:WO98047326A1

    公开(公告)日:1998-10-22

    申请号:PCT/JP1998/001746

    申请日:1998-04-16

    Abstract: A wiring board in which vias radially extending through the wiring board from one side to the other side in such a way that the interval between the vias on one side of the wiring board is smaller than those between the vias on the other side, characterized in that a plurality of vias (12, 12, ...) are radially arranged from one side (10a) of the wiring board (10) to the other side (10b) in such a way that the interval (Wa) between the vias on one side (10a) is smaller than the interval (Wa) between the vias on the other side (10b) in order to prevent electrical short-circuit even if the interval between the vias on one side of the wiring board is very small, and that a conductor forming a core portion (14) of each of the vias (12) is covered with a sheath portion (16) made of an insulator.

    Abstract translation: 一种布线板,其中通孔从一侧向另一侧径向延伸穿过所述布线板,使得所述布线板的一侧上的通孔之间的间隔小于另一侧的通孔之间的间隔,其特征在于, 多个通孔(12,12,...)从布线板(10)的一侧(10a)径向布置到另一侧(10b),使得通孔之间的间隔(Wa) 在一侧(10a)上小于另一侧(10b)上的通路之间的间隔(Wa),以防止电气短路,即使布线板一侧的通孔之间的间隔非常小, 并且形成每个通孔(12)的芯部分(14)的导体被由绝缘体制成的护套部分(16)覆盖。

    THROUGH-WIRED SUBSTRATE AND MANUFACTURING METHOD THEREFOR
    55.
    发明公开
    THROUGH-WIRED SUBSTRATE AND MANUFACTURING METHOD THEREFOR 审中-公开
    美国麻省理工学院EINEMDURCHFÜHRUNGSDRAHTUND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号:EP2503859A1

    公开(公告)日:2012-09-26

    申请号:EP10839574.0

    申请日:2010-12-24

    Applicant: Fujikura, Ltd.

    Abstract: An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid.

    Abstract translation: 本发明的内插基板具有平面基板和贯通孔布线,所述通孔布线通过填充将该基板的第一主表面和第二主表面连接在一起的通孔而形成。 当在基板的垂直截面图中看到通孔时,通孔具有梯形,其侧壁由通孔的内表面形成,并且梯形的两个侧面不平行于每个 其他。 梯形的两个侧面相对于形成梯形的顶面或底面的两个顶点处垂直于第一主表面或第二主表面的两条垂直线而朝向相同侧倾斜。

    WIRING BOARD HAVING VIAS
    59.
    发明公开
    WIRING BOARD HAVING VIAS 失效
    LEITERPLATTE MIT DURCHKONTAKTIERUNGEN

    公开(公告)号:EP0926931A1

    公开(公告)日:1999-06-30

    申请号:EP98914051.2

    申请日:1998-04-16

    Abstract: There is provided a wiring board comprising vias which penetrate the wiring board from one side to the other side, the vias being radially arranged in the direction from one side to the other side so that the interval between the vias on one side can be made smaller than the interval between the vias on the other side. In order to prevent the vias from being electrically short-circuited to each other, even if the interval between the vias provided on one side of the wiring board is extremely reduced, a plurality of vias 12, 12, · · are radially arranged in the direction from one side 10a of the wiring board 10 to the other side 10b so that an interval (Wa) between the vias on one side 10a of the wiring board 10 can be made smaller than interval (Wc) of the vias on the other side 10b, and a conductor forming the core portion 14 of the via 12 is coated with the sheath portion 16 made of insulating material.

    Abstract translation: 提供一种布线板,其包括从一侧到另一侧穿透布线板的通孔,通孔沿着从一侧到另一侧的方向径向布置,使得一侧的通孔之间的间隔可以变小 比在另一侧的通孔之间的间隔。 为了防止通孔彼此电短路,即使设置在布线板的一侧上的通孔之间的间隔极大地减小,也可以是多个通孔12,12。 。 沿着从布线板10的一侧10a到另一侧10b的方向径向地布置,使得可以使布线板10的一侧10a上的通路之间的间隔(Wa)小于 在另一侧10b的通孔和形成通孔12的芯部14的导体涂覆有由绝缘材料制成的护套部分16。

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