Abstract:
Methods are provided for making vertical feed through electrical connection structures in a substrate or tile. The vertical feed throughs can be configured to make plated through holes usable for inserting and attaching connector probes. . Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires. Vertical feed throughs can also be configured to make tiles attachable and detachable as a layer between other substrates. The vertical feed through paths are formed with one end of each feed through hole permanently encapsulating a first electrical contact, and a second end supporting another pluggable and unpluggable electrical probe contact. Decoupling capacitors can be further plugged into holes formed in close proximity to the vertical feed through holes to increase performance of the decoupling capacitor.
Abstract:
Ein Verfahren und eine Vorrichtung zum Durchkontaktieren von flexiblen Substraten 1, insbesondere Leiterplatten, mit auf zwei einander gegenüberliegenden Oberflächen 1a, 1b des Substrats vorliegenden elekrisch leitfähigen Kontaktzonen 4, 41 sieht vor, dass im Bereich der Kontaktzonen ein Schnitt 11 schräg zu den Oberflächen des Substrats erzeugt wird und die beiden an den schrägen Schnitt angrenzenden Substratbereiche 20, 30 aneinander vorbeibewegt werden, bis sie hintereinander verrasten. Das aneinander Vorbeibewegen erfolgt mittels einem Stössel 12, unter Beaufschlagung mit Druckluft 13, unter Anlegung eines Unterdrucks 14 oder mittels einem am Schneidwerkzeug fixierten Mitnahmehaken 15. Die beiden Schritte des Schnitterzeugens und aneinander Vorbeibewegens der beiden an den Schnitt angrenzenden Substratbereiche erfolgt in einer gemeinsamen Bearbeitungsstation, vorzugsweise in einem einzigen Arbeitsgang.
Abstract:
A wiring board in which vias radially extending through the wiring board from one side to the other side in such a way that the interval between the vias on one side of the wiring board is smaller than those between the vias on the other side, characterized in that a plurality of vias (12, 12, ...) are radially arranged from one side (10a) of the wiring board (10) to the other side (10b) in such a way that the interval (Wa) between the vias on one side (10a) is smaller than the interval (Wa) between the vias on the other side (10b) in order to prevent electrical short-circuit even if the interval between the vias on one side of the wiring board is very small, and that a conductor forming a core portion (14) of each of the vias (12) is covered with a sheath portion (16) made of an insulator.
Abstract:
The process for producing subsequently contactable contact points between two conductive track planes on a circuit substrate separated by an electrically insulating layer makes it possible to produce, for example, a basic conductor pattern which can subsequently be easily adapted to requirements. By laying windows in the conductive track planes out in such a way that, when the electrically insulating layer is subsequently through-etched due to under-etching, rod-like parts connected to the aperture periphery are revealed between or in the apertures which can be brought into contact with electrically conductive parts of the other conductive track plane, these conductive tracks can be electrically interconnected by mechanical bending.
Abstract:
An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid.
Abstract:
A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.
Abstract:
To provide a printed wiring board having through-holes made by plating perforations formed on the insulating resin base material, wherein the position of an axis of the center of gravity of each of the through-holes exposed from the front surface and back surface of the insulating resin base material is out of alignment with each other to reduce defects such as voids and cracking in order to reduce poor connection and to improve the mechanism strength of the wiring board.
Abstract:
A method and device for through-hole plating of flexible substrates (1), especially printed circuit boards, by means of two electrically conductive contact areas (4,41) on opposite-lying surfaces (1a,1b) of the substrate. A cut (11) is made in the region of the contact areas in a slanted position with respect to the surfaces of the substrate and the two substrate areas (20,30) adjacent to the slanted cut are displaced until they interlock with each other. Said displacement is carried out by means of a tappet (12) with impingement of compressed area (13) and the application of a low pressure (14) or by means of a driver hook (15) fixed on the cutting tool. The two steps involving the production of the cut and displacement of the two substrate areas adjacent to the hut are carried out in a single work process.
Abstract:
There is provided a wiring board comprising vias which penetrate the wiring board from one side to the other side, the vias being radially arranged in the direction from one side to the other side so that the interval between the vias on one side can be made smaller than the interval between the vias on the other side. In order to prevent the vias from being electrically short-circuited to each other, even if the interval between the vias provided on one side of the wiring board is extremely reduced, a plurality of vias 12, 12, · · are radially arranged in the direction from one side 10a of the wiring board 10 to the other side 10b so that an interval (Wa) between the vias on one side 10a of the wiring board 10 can be made smaller than interval (Wc) of the vias on the other side 10b, and a conductor forming the core portion 14 of the via 12 is coated with the sheath portion 16 made of insulating material.
Abstract:
The process for producing subsequently contactable contact points between two conductive track planes on a circuit substrate separated by an electrically insulating layer makes it possible to produce, for example, a basic conductor pattern which can subsequently be easily adapted to requirements. By laying windows in the conductive track planes out in such a way that, when the electrically insulating layer is subsequently through-etched due to under-etching, rod-like parts connected to the aperture periphery are revealed between or in the apertures which can be brought into contact with electrically conductive parts of the other conductive track plane, these conductive tracks can be electrically interconnected by mechanical bending.