公开(公告)号：WO2005055369A2

公开(公告)日：2005-06-16

申请号：PCT/US2004/039394

申请日：2004-11-22

Applicant: FORMFACTOR, INC. ,  MATHIEU, Gaetan, L. ,  KHANDROS, Igor, K. ,  REYNOLDS, Carl, V.

Inventor： MATHIEU, Gaetan, L. ,  KHANDROS, Igor, K. ,  REYNOLDS, Carl, V.

IPC: H01R

CPC classification number: H05K3/42 ,  G01R1/06711 ,  G01R1/07307 ,  G01R3/00 ,  H05K3/308 ,  H05K2201/09836 ,  H05K2203/0338

Abstract: Methods are provided for making vertical feed through electrical connection structures in a substrate or tile. The vertical feed throughs can be configured to make plated through holes usable for inserting and attaching connector probes. . Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires. Vertical feed throughs can also be configured to make tiles attachable and detachable as a layer between other substrates. The vertical feed through paths are formed with one end of each feed through hole permanently encapsulating a first electrical contact, and a second end supporting another pluggable and unpluggable electrical probe contact. Decoupling capacitors can be further plugged into holes formed in close proximity to the vertical feed through holes to increase performance of the decoupling capacitor.

Abstract translation: 提供了用于通过基底或瓦片中的电连接结构进行垂直馈送的方法。 垂直进料通道可以配置为制造可用于插入和连接连接器探头的电镀通孔。 。 探针可以附着到电镀通孔或连接孔，以产生弹性弹簧触点，以形成晶片探针卡组件。 通过将涂覆有电镀材料的扭转牺牲线支撑在基板中，并且随后蚀刻掉线来形成扭曲管镀通孔结构。 垂直进料通道也可以被配置成使得瓦片可附着和分离成其它基底之间的层。 垂直进料通道形成有每个进料通孔的一端，其永久地密封第一电接触，第二端支撑另一可插拔和可拔出的电探针接触。 去耦电容器可以进一步插入靠近垂直馈通孔形成的孔中，以提高去耦电容的性能。

公开(公告)号：WO2003043394A1

公开(公告)日：2003-05-22

申请号：PCT/EP2002/012774

申请日：2002-11-14

Applicant: GIESECKE & DEVRIENT GMBH ,  USNER, Jürgen ,  WELLING, Ando

Inventor： USNER, Jürgen ,  WELLING, Ando

IPC: H05K3/40

CPC classification number: G06K19/0775 ,  B26D7/27 ,  B26F1/18 ,  B26F1/22 ,  G06K19/077 ,  H05K3/4084 ,  H05K2201/09081 ,  H05K2201/09836 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49156 ,  Y10T29/5136 ,  Y10T29/5148 ,  Y10T29/5313 ,  Y10T83/0207

Abstract: Ein Verfahren und eine Vorrichtung zum Durchkontaktieren von flexiblen Substraten 1, insbesondere Leiterplatten, mit auf zwei einander gegenüberliegenden Oberflächen 1a, 1b des Substrats vorliegenden elekrisch leitfähigen Kontaktzonen 4, 41 sieht vor, dass im Bereich der Kontaktzonen ein Schnitt 11 schräg zu den Oberflächen des Substrats erzeugt wird und die beiden an den schrägen Schnitt angrenzenden Substratbereiche 20, 30 aneinander vorbeibewegt werden, bis sie hintereinander verrasten. Das aneinander Vorbeibewegen erfolgt mittels einem Stössel 12, unter Beaufschlagung mit Druckluft 13, unter Anlegung eines Unterdrucks 14 oder mittels einem am Schneidwerkzeug fixierten Mitnahmehaken 15. Die beiden Schritte des Schnitterzeugens und aneinander Vorbeibewegens der beiden an den Schnitt angrenzenden Substratbereiche erfolgt in einer gemeinsamen Bearbeitungsstation, vorzugsweise in einem einzigen Arbeitsgang.

Abstract translation: 一种用于通过接触柔性基板1，特别是电路板，具有相对的两个面1a，存在于由电传导接触区4的基板1b中，41方法和装置提供的是，在接触区的区域中的部分11倾斜于所述衬底的所述表面 被生成并在两个邻接的斜明暗基板部分20，30通过彼此移动，直到它们锁定在彼此之后。 过去的一通过柱塞12的装置的另一个移动，压缩空气13的作用下，在真空下14的应用程序或通过的手段固定到切削工具的驱动钩15的部分发生的两个步骤和经过彼此移动两个基板区域邻接切割发生在共同的处理站， 优选在单次操作。

公开(公告)号：WO98047326A1

公开(公告)日：1998-10-22

申请号：PCT/JP1998/001746

申请日：1998-04-16

IPC: H05K3/44 ,  H01L23/498 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4038 ,  H05K2201/09836 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/0235 ,  H01L2924/00

Abstract: A wiring board in which vias radially extending through the wiring board from one side to the other side in such a way that the interval between the vias on one side of the wiring board is smaller than those between the vias on the other side, characterized in that a plurality of vias (12, 12, ...) are radially arranged from one side (10a) of the wiring board (10) to the other side (10b) in such a way that the interval (Wa) between the vias on one side (10a) is smaller than the interval (Wa) between the vias on the other side (10b) in order to prevent electrical short-circuit even if the interval between the vias on one side of the wiring board is very small, and that a conductor forming a core portion (14) of each of the vias (12) is covered with a sheath portion (16) made of an insulator.

Abstract translation: 一种布线板，其中通孔从一侧向另一侧径向延伸穿过所述布线板，使得所述布线板的一侧上的通孔之间的间隔小于另一侧的通孔之间的间隔，其特征在于， 多个通孔（12,12，...）从布线板（10）的一侧（10a）径向布置到另一侧（10b），使得通孔之间的间隔（Wa） 在一侧（10a）上小于另一侧（10b）上的通路之间的间隔（Wa），以防止电气短路，即使布线板一侧的通孔之间的间隔非常小， 并且形成每个通孔（12）的芯部分（14）的导体被由绝缘体制成的护套部分（16）覆盖。

公开(公告)号：WO1993026144A1

公开(公告)日：1993-12-23

申请号：PCT/CH1993000147

申请日：1993-06-10

Applicant: DYCONEX PATENTE AG ,  SCHMIDT, Walter ,  MARTINELLI, Marco

Inventor： DYCONEX PATENTE AG

IPC: H05K03/40

CPC classification number: H05K3/4084 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: The process for producing subsequently contactable contact points between two conductive track planes on a circuit substrate separated by an electrically insulating layer makes it possible to produce, for example, a basic conductor pattern which can subsequently be easily adapted to requirements. By laying windows in the conductive track planes out in such a way that, when the electrically insulating layer is subsequently through-etched due to under-etching, rod-like parts connected to the aperture periphery are revealed between or in the apertures which can be brought into contact with electrically conductive parts of the other conductive track plane, these conductive tracks can be electrically interconnected by mechanical bending.

公开(公告)号：EP2503859A1

公开(公告)日：2012-09-26

申请号：EP10839574.0

申请日：2010-12-24

Applicant: Fujikura, Ltd.

Inventor： YAMAMOTO Satoshi ,  SUZUKI Takanao ,  MATSUYAMA Masami

IPC: H05K1/11 ,  H01L23/12 ,  H05K3/40

CPC classification number: H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid.

Abstract translation: 本发明的内插基板具有平面基板和贯通孔布线，所述通孔布线通过填充将该基板的第一主表面和第二主表面连接在一起的通孔而形成。 当在基板的垂直截面图中看到通孔时，通孔具有梯形，其侧壁由通孔的内表面形成，并且梯形的两个侧面不平行于每个 其他。 梯形的两个侧面相对于形成梯形的顶面或底面的两个顶点处垂直于第一主表面或第二主表面的两条垂直线而朝向相同侧倾斜。

公开(公告)号：EP2298048A1

公开(公告)日：2011-03-23

申请号：EP09772960.2

申请日：2009-06-23

Applicant: Koninklijke Philips Electronics N.V.

Inventor： ELZINGA, Marcus, J., G.

IPC: H05K3/34 ,  H01L33/48

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

公开(公告)号：EP1988758A1

公开(公告)日：2008-11-05

申请号：EP07708420.0

申请日：2007-02-20

Applicant: IBIDEN CO., LTD.

Inventor： IKEDA, Tomoyuki c/o IBIDEN CO., LTD.,

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: To provide a printed wiring board having through-holes made by plating perforations formed on the insulating resin base material, wherein the position of an axis of the center of gravity of each of the through-holes exposed from the front surface and back surface of the insulating resin base material is out of alignment with each other to reduce defects such as voids and cracking in order to reduce poor connection and to improve the mechanism strength of the wiring board.

Abstract translation: 为了提供一种具有通过在绝缘树脂基材上形成的穿孔而形成的通孔的印刷电路板，其中每个通孔的重心的位置从该表面的表面和背面暴露出来 绝缘树脂基材彼此不对齐，以减少诸如空隙和开裂的缺陷，以减少连接不良和提高布线板的机械强度。

公开(公告)号：EP1449415B1

公开(公告)日：2005-03-16

申请号：EP02791679.0

申请日：2002-11-14

Applicant: Giesecke & Devrient GmbH

Inventor： USNER, Jürgen ,  WELLING, Ando

IPC: H05K3/40 ,  G06K19/077 ,  B26D7/27

CPC classification number: G06K19/0775 ,  B26D7/27 ,  B26F1/18 ,  B26F1/22 ,  G06K19/077 ,  H05K3/4084 ,  H05K2201/09081 ,  H05K2201/09836 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49156 ,  Y10T29/5136 ,  Y10T29/5148 ,  Y10T29/5313 ,  Y10T83/0207

Abstract: A method and device for through-hole plating of flexible substrates (1), especially printed circuit boards, by means of two electrically conductive contact areas (4,41) on opposite-lying surfaces (1a,1b) of the substrate. A cut (11) is made in the region of the contact areas in a slanted position with respect to the surfaces of the substrate and the two substrate areas (20,30) adjacent to the slanted cut are displaced until they interlock with each other. Said displacement is carried out by means of a tappet (12) with impingement of compressed area (13) and the application of a low pressure (14) or by means of a driver hook (15) fixed on the cutting tool. The two steps involving the production of the cut and displacement of the two substrate areas adjacent to the hut are carried out in a single work process.

公开(公告)号：EP0926931A1

公开(公告)日：1999-06-30

申请号：EP98914051.2

申请日：1998-04-16

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： HORIUCHI, Michio Shinko Electric Ind., Co., Ltd. ,  SUYAMA, Toshiaki Shinko Electric Ind., Co., Ltd. ,  TOKITA, Masakuni Shinko Electric Ind., Co., Ltd.

IPC: H05K1/11

CPC classification number: H01L23/49827 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4038 ,  H05K2201/09836 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/0235 ,  H01L2924/00

Abstract: There is provided a wiring board comprising vias which penetrate the wiring board from one side to the other side, the vias being radially arranged in the direction from one side to the other side so that the interval between the vias on one side can be made smaller than the interval between the vias on the other side. In order to prevent the vias from being electrically short-circuited to each other, even if the interval between the vias provided on one side of the wiring board is extremely reduced, a plurality of vias 12, 12, · · are radially arranged in the direction from one side 10a of the wiring board 10 to the other side 10b so that an interval (Wa) between the vias on one side 10a of the wiring board 10 can be made smaller than interval (Wc) of the vias on the other side 10b, and a conductor forming the core portion 14 of the via 12 is coated with the sheath portion 16 made of insulating material.

Abstract translation: 提供一种布线板，其包括从一侧到另一侧穿透布线板的通孔，通孔沿着从一侧到另一侧的方向径向布置，使得一侧的通孔之间的间隔可以变小 比在另一侧的通孔之间的间隔。 为了防止通孔彼此电短路，即使设置在布线板的一侧上的通孔之间的间隔极大地减小，也可以是多个通孔12,12。 。 沿着从布线板10的一侧10a到另一侧10b的方向径向地布置，使得可以使布线板10的一侧10a上的通路之间的间隔（Wa）小于 在另一侧10b的通孔和形成通孔12的芯部14的导体涂覆有由绝缘材料制成的护套部分16。

公开(公告)号：EP0600052B1

公开(公告)日：1996-04-17

申请号：EP93909756.4

申请日：1993-06-10

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco

IPC: H05K3/40

CPC classification number: H05K3/4084 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: The process for producing subsequently contactable contact points between two conductive track planes on a circuit substrate separated by an electrically insulating layer makes it possible to produce, for example, a basic conductor pattern which can subsequently be easily adapted to requirements. By laying windows in the conductive track planes out in such a way that, when the electrically insulating layer is subsequently through-etched due to under-etching, rod-like parts connected to the aperture periphery are revealed between or in the apertures which can be brought into contact with electrically conductive parts of the other conductive track plane, these conductive tracks can be electrically interconnected by mechanical bending.