公开(公告)号：TW200820364A

公开(公告)日：2008-05-01

申请号：TW096125249

申请日：2007-07-11

Applicant: 魯道夫科技股份有限公司 RUDOLPH TECHNOLOGIES, INC.

Inventor： 艾傑 潘 PAI, AJAY ,  吐安 雷 LE, TUAN

IPC: H01L ,  G01B

Abstract: 邊緣特徵量測系統和方法用於將物件(例如半導體晶圓)的一或更多特色進行特徵化。被特徵化的特色包括接近晶圓邊緣之阻劑層外部邊界、和接近晶圓邊緣之所欲的其他晶圓特色。在一些實施例中,藉由成像系統可發現從晶圓邊緣至阻劑層邊緣的相對距離,在該處例如繞著半導體晶圓圓周移除阻劑。在其他實施例中,發現晶圓的中心(或一個或更多阻劑層的中心),且如果想要的話,也可發現晶圓中心和一或更多阻劑層的中心之間的相對偏移。

Abstract in simplified Chinese: 边缘特征量测系统和方法用于将对象(例如半导体晶圆)的一或更多特色进行特征化。被特征化的特色包括接近晶圆边缘之阻剂层外部边界、和接近晶圆边缘之所欲的其他晶圆特色。在一些实施例中,借由成像系统可发现从晶圆边缘至阻剂层边缘的相对距离,在该处例如绕着半导体晶圆圆周移除阻剂。在其他实施例中,发现晶圆的中心(或一个或更多阻剂层的中心),且如果想要的话,也可发现晶圆中心和一或更多阻剂层的中心之间的相对偏移。

公开(公告)号：DE112014001440T5

公开(公告)日：2016-01-14

申请号：DE112014001440

申请日：2014-03-17

Applicant: RUDOLPH TECHNOLOGIES INC

Inventor： BENSON DENNIS

IPC: H01L21/00

Abstract: Hierin wird ein Element beschrieben, das die Handhabung von Halbleiterobjekt mit beliebigen Formen und Größen durch Handhabungsgeräte erleichtert, die normalerweise nicht zur Handhabung solcher Objekte angepasst sind. Das Element umfasst eine Basis, die ein Substrat emuliert, für das ein Handhabungsgerät verfügbar ist. Eine Befestigungseinrichtung an der Basis sichert das Objekt am Element. Eine Vakuumstruktur erlaubt es einem Vakuum-Spannsystem, das Element und ein Objekt an dem Handhabungsgerät gleichzeitig zu befestigen.

公开(公告)号：SG11201505661XA

公开(公告)日：2015-08-28

申请号：SG11201505661X

申请日：2014-01-23

Applicant: RUDOLPH TECHNOLOGIES INC

Inventor： ROY RAJIV ,  GRANT DAVID ,  MARX DAVID S ,  CHU HANH

IPC: G01B9/02 ,  G01B11/00 ,  G01N21/00

Abstract: A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.

公开(公告)号：SG10201505017PA

公开(公告)日：2015-08-28

申请号：SG10201505017P

申请日：2011-07-07

Applicant: AZORES AND RUDOLPH TECHNOLOGIES INC

Inventor： DONAHER J CASEY ,  SIMPSON CRAIG R ,  MCCLEARY ROGER

Abstract: Projection systems and methods with mechanically decoupled metrology plates according to embodiments of the present invention can be used to characterize and compensate for misalignment and aberration in production images due to thermal and mechanical effects. Sensors on the metrology plate measure the position of the metrology plate relative to the image and to the substrate during exposure of the substrate to the production image. Data from the sensors are used to adjust the projection optics and/or substrate dynamically to correct or compensate for alignment errors and aberration-induced errors. Compared to prior art systems and methods, the projection systems and methods described herein offer greater design flexibility and relaxed constraints on mechanical stability and thermally induced expansion. In addition, decoupled metrology plates can be used to align two or more objectives simultaneously and independently.

公开(公告)号：SG11201502436SA

公开(公告)日：2015-04-29

申请号：SG11201502436S

申请日：2013-09-27

Applicant: RUDOLPH TECHNOLOGIES INC

Inventor： ZHOU WEI

IPC: H01L21/66

公开(公告)号：SG192203A1

公开(公告)日：2013-09-30

申请号：SG2013057682

申请日：2012-01-27

Applicant: RUDOLPH TECHNOLOGIES INC

Inventor： MEHENDALE MANJUSHA ,  KOTELYANSKII MICHAEL ,  MUKUNDHAN PRIYA ,  COLGAN MICHAEL ,  ZHOU WEI

Abstract: An automatically adjustable method for use in opto-acoustic metrology or other types of metrology operations is described. The method includes modifying the operation of a metrology system that uses a PSD style sensor arrangement. The method may be used to quickly adjust the operation of a metrology system to ensure that the data obtained therefrom are of the desired quality. Further, the method is useful in searching for and optimizing data that is or can be correlated to substrate or sample features or characteristics that of interest. Apparatus and computer readable media are also described.

公开(公告)号：SG175097A1

公开(公告)日：2011-12-29

申请号：SG2011072899

申请日：2010-04-22

Applicant: RUDOLPH TECHNOLOGIES INC

Inventor： DOE RODNEY BRYAN ,  STROM JOHN ,  MCLAUGHLIN CHRISTOPHER

Abstract: A method of optimizing an optical inspection and fabrication process is herein disclosed. Images, preferably color digital images, of an object are obtained and multiple filter space representations of these images are created. Each of the representations and the channels or data that define them are analyzed separately or in combination with one another to determine which representations, combination of representations, channels, combinations of channels, data or combinations of data provide the most optimal data for analysis by optical inspection algorithms. The process may be automated in terms of the creation of image representations and/or single or multivariate analysis.

公开(公告)号：AU2002341544A1

公开(公告)日：2003-01-29

申请号：AU2002341544

申请日：2002-07-12

Applicant: RUDOLPH TECHNOLOGIES INC

Inventor： STONER ROBERT J ,  MORATH CHRISTOPHER

IPC: G01B11/06 ,  G01B11/28 ,  G01B9/02

Abstract: An apparatus for improving the signal to noise ratio of measurements of the thickness of layers in a thin film stack uses a photoacoustic measurement system that includes a time differentiation system for inducing a delay in pump beam pulses. The time differentiation system uses, among other things, a birefringent element and other elements to control the polarization of pump beam pulses. Use of the apparatus involves applying a time varying voltage to an electro-optic modulator driver and setting a time differentiation step; or, in another embodiment, applying a time varying voltage to an electro-optic modulator to induce a fixed time delay delta-t between a vertically polarized pulse and a horizontally polarized pulse. The high frequency operation of the system provides for improved determinations of film thickness.

公开(公告)号：SG10201502024UA

公开(公告)日：2015-05-28

申请号：SG10201502024U

申请日：2010-06-14

Applicant: RUDOLPH TECHNOLOGIES INC

Inventor： MARX DAVID S ,  GRANT DAVID L

Abstract: A system (10) for directly measuring the depth of a high aspect ratio etched feature on a wafer (80) that includes an etched surface (82) and a non-etched surface (84). The system (10) utilizes an infrared reflectometer (12) that in a preferred embodiment includes a swept laser (14), a fiber circulator (16), a photodetector (22) and a combination collimator (18) and an objective lens (20). From the objective lens (20) a focused incident light (23) is produced that is applied to the non-etched surface (84) of the wafer (80). From the wafer (80) is produced a reflected light (25) that is processed through the reflectometer (12) and applied to an ADC (24) where a corresponding digital data signal (29) is produced. The digital data signal (29) is applied to a computer (30) that, in combination with software (32), measures the depth of the etched feature that is then viewed on a display (34).

公开(公告)号：AT531075T

公开(公告)日：2011-11-15

申请号：AT99934136

申请日：1999-07-15

Applicant: AUGUST TECHNOLOGY CORP ,  RUDOLPH TECHNOLOGIES INC

Inventor： O'DELL JEFFREY ,  HARLESS MARK ,  VERBURGT THOMAS ,  WATKINS CORY

IPC: H01L21/00 ,  G01N21/88 ,  G01N21/95