BONDING AGENT SHEET FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT CONNECTION SUBSTRATE USING THAT AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH10144736A

    公开(公告)日:1998-05-29

    申请号:JP29619996

    申请日:1996-11-08

    Abstract: PROBLEM TO BE SOLVED: To provide a new bonding agent composition for a semiconductor device, which is superior in laminating processability, adhesive force and durability, a semiconductor integrated circuit connection substrate using that composition and a semiconductor device from an industrial viewpoint and to raise the economical efficiency and reliability of the high-density mounting semiconductor integrated circuit connection substrate and the semiconductor substrate, which are based on an easy processability of the substrate and the device. SOLUTION: In a substrate for semiconductor integrated circuit connection, which has at least one layer of more of insulator layers 3 and wiring board layers 4 consisting of a wiring pattern and at least one layer or more of layers 7, which are not formed with a conductor pattern, and bonding agent layers 6, when the tack strengths of both surfaces of a bonding agent sheet forming the layers 6 are respectively assumed P1 and P2 (P1 >P2 ), the P2 and P1 are set on the condition of 0 .

    TAPE WITH ADHESIVE FOR TAB, SEMICONDUCTOR CONNECTING BOARD AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH09289232A

    公开(公告)日:1997-11-04

    申请号:JP3594297

    申请日:1997-02-20

    Abstract: PROBLEM TO BE SOLVED: To obtain a product superior in adhesion, chemicals resistance and insulation by using an adhesive layer contg. an org. coupling agent. SOLUTION: A tape with adhesive for TAB is composed of a laminate of an adhesive layer 2 and protective film layer on a flexible org. insulation film 1. The adhesive layer 2 contains an organic metal coupling agent. A polyamide resin, an epoxy resin and a phenol resin are e.g. dissolved in a methanol- monochlorobenzene mixed soln. to prepare an adhesive soln, and this adhesive is applied to the polyimide film 1 and hardened to form an adhesive sheet. The org. metal coupling agent is dissolved in isopropanol to prepare a soln. and it is applied to a polyethylene terephthalate film and dried to prepare an org. metal coupling agent sheet which is then laminated on the adhesive layer 2 of the adhesive sheet.

    TAPE WITH ADHESIVE FOR TAB AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH09115966A

    公开(公告)日:1997-05-02

    申请号:JP21269796

    申请日:1996-08-12

    Abstract: PROBLEM TO BE SOLVED: To obtain a tape with adhesive for TAB having improved insulation and heat-resistance deformation property by allowing an adhesive layer to include modified polyamide resin with a specific substituent group as an essential ingredient. SOLUTION: A tape with adhesive for TAB is constituted of a lamination body having an adhesive layer and a protection film layer on a flexible organic insulation film. Then, the adhesive layer contains a modified polyamide resin with a substituent group expressed by a shown general expression as an essential ingredient (x-z: natural numbers, x=1-3, y=0-3, z=0-3, 1

    TAPE WITH ADHESIVE FOR TAB AND SEMICONDUCTOR DEVICE

    公开(公告)号:JPH0959573A

    公开(公告)日:1997-03-04

    申请号:JP21370495

    申请日:1995-08-22

    Abstract: PROBLEM TO BE SOLVED: To obtain a new type tape for tape automated bonding(TAB) excellent in both adhesiveness and electrical insulation properties. SOLUTION: This tape is obtained by laminating a flexible electrical insulation organic film with an adhesive layer and a protective film layer. The adhesive layer essentially comprises (A) 100 pts.wt. of a polyamide resin pref. containing 3-6C dicarboxylic acid unit and (B) 5-100 (pref. 20-600) pts.wt. of an epoxy resin having in one molecule a glycidyl amino group and plural epoxy group (e.g. a diglycidyl ether such as bisphenol A, epoxidized phenol novolak, epoxidized tetraphenylolethane). The glycidyl amino group pref. contains a tertiary nitrogen atom, its amount being pref. 3×10 to 2×10 mol (esp. 1×10 to 1.5×10 mol) based on 100 pts.wt. of the resin in the adhesive.

    BASE MATERIAL FILM FOR POLARIZING FILM

    公开(公告)号:JPH03274508A

    公开(公告)日:1991-12-05

    申请号:JP7763990

    申请日:1990-03-26

    Inventor: KIGOSHI SHOJI

    Abstract: PURPOSE:To make improvement in polarization characteristic and wet heat resistance by specifying the syndiotactic content determined from the IR absorption spectra of a polyvinyl alcohol (PVA) polymer constituting a base material film to specific % or above. CONSTITUTION:This base material film for a polarizing film is formed by absorbing a dichromatic coloring matter on a base material film of PVA system and orienting the dye and has >=50% syndiotactic content determined from the IR absorption spectra of the PVA polymer constituting the base material film. This base material film for the polarizing film has the structure consisting of the PVA base material film on which the dichromatic coloring matter oriented in a specific direction is absorbed. More specifically, the film formed by absorbing polyiodine ion or the dichromatic dye as the dichromatic colring matter on a PVA film, then stretching the film to orient the dichromatic coloring matter is exemplified. The improvement in the polarization performance and wet heat resistance is made in this way.

    PRODUCTION OF POLARIZING FILM
    66.
    发明专利

    公开(公告)号:JPH02275905A

    公开(公告)日:1990-11-09

    申请号:JP9836989

    申请日:1989-04-18

    Abstract: PURPOSE:To obtain the polarizing film having excellent wet heat resistance by subjecting the polarizing film, which is formed by adsorbing iodine on a base material film consisting of a polyvinyl chloride (PVC) system, then treating the film with a fixing aq. soln. contg. boric acid after orienting the film, to irradiation with UV light and a heat treatment under specific conditions. CONSTITUTION:The polarizing film, which is formed by adsorbing the iodine on the base material film consisting of the PVC, then treating the film with the fixing aq. soln. contg. the boric acid after orienting the film is subjected to the irradiation with UV light and the heat treatment under the conditions satisfying equation I. In the equation I, T denotes a heat treatment temp. ( deg.C); W denotes an irradiation quantity of UV light (mJ/cm ); lambda denotes a wavelength of UV light (nm), respectively. The polarizing film which has the excellent wet heat resistance and is particularly adequate for the liquid crystal display device is obtd. in this way.

    POLARIZING FILM
    67.
    发明专利

    公开(公告)号:JPH02125202A

    公开(公告)日:1990-05-14

    申请号:JP28001388

    申请日:1988-11-04

    Abstract: PURPOSE:To obtain the polarizing film for a color liquid crystal display body which is improved in wet heat resistance by controlling the density of a base material film consisting of a polyvinyl alcohol (PVA) and the (b) value in the color solid coordinates of an Lab system. CONSTITUTION:The density of the base material film consisting of the PVA is specified to 1.2980 to 1.3140g/cm , more preferably 1.3020 to 1.3130g/cm . The wet heat resistance is poor and the degree of polarization decreases drastically if the density is below 1.2980g/cm . The wet heat resistance is also poor if the density exceeds 1.3140g/cm . Such densities are, therefore, undesirable. The (b) value in the color solid coordinates of the Lab system of the polarizing film is specified to -2.0 to 4.0, more preferably -1.0 to 2.0. Blue is strong if the (b) value is below -2.0 and yellow is strong at >=4.0 in the case of using this film for a color liquid crystal display. Natural color reproducibility is unobtainable in both cases. The polarizing film which has the excellent wet heat resistance and is adequate for the color liquid crystal display device is obtd. in this way.

    PRODUCTION OF POLARIZING FILM
    68.
    发明专利

    公开(公告)号:JPH0243504A

    公开(公告)日:1990-02-14

    申请号:JP19424088

    申请日:1988-08-03

    Abstract: PURPOSE:To improve wet heat resistance and to obtain the polarizing film of a neutral gray hue by treating a polyvinyl alcohol (PVA) film with an aq. soln. contg. a dissolution preventive agent for the PVA film after a heat treatment. CONSTITUTION:The concn. of the potassium iodide and the concn. of boric acid in an aq. soln. contg. the potassium iodide and boric acid after adsorption of iodine to the PVA film are adjusted to the desirable concn. and the treatment is executed at the most desirable temp. of the heat treatment in the treatment of the above-mentioned aq. soln. The dissolution preventive agent for the PVA film to be used as the post treatment thereof is preferably the agent which has the effect of substantially preventing the dissolution of the PVA film during the treatment; above all, an aq. soln. of the boric acid or borax has low toxicity, is easy to handle and is highly effective in changing the hue to the neutral gray. The wet heat resistance of the polarizing film is improved in this way and the hue thereof is made into the neutral gray.

    COPPER PLATED TAPE FOR FLEXIBLE SUBSTRATE, COMPONENT THEREWITH, AND SEMICONDUCTOR DEVICE

    公开(公告)号:JP2001244302A

    公开(公告)日:2001-09-07

    申请号:JP2000051154

    申请日:2000-02-28

    Abstract: PROBLEM TO BE SOLVED: To provide a component wherein a circuit is formed to be used for a COF method with a suitability for transportation and processing in a conven tional TAB tape manufacturing line, and to provide a semiconductor device. SOLUTION: A copper plated tape for a flexible substrate consists of an insulation film (A) provided with an electrically conducting part on the surface, and a film (C) for reinforcement provided on the reverse side of the electrically conductive part of this insulation film through an adhesive layer (B). The reinforcement film can be easily peeled from the insulation film and the bending resistance is 5×10-4 to 1×10-1N.

    ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE, AND COMPONENT AND SEMICONDUCTOR DEVICE BY USING THE SAME

    公开(公告)号:JP2000273415A

    公开(公告)日:2000-10-03

    申请号:JP8107899

    申请日:1999-03-25

    Abstract: PROBLEM TO BE SOLVED: To obtain the subject sheet excellent in sticking processability at the time of production of a substrate for connecting a semiconductor integrated circuit while keeping the excellent adhesion and heat resistance even after a long term preservation by including a compound having a blocked carboxyl group. SOLUTION: This adhesive sheet is composed of a thermoplastic resin comprising a compound having a blocked carboxyl group represented by formula I [X is formula II (R1 to R3 are each H or a 1-18C organic group; R4 is a 1-18C alkyl; R3 and R4 may foam a heterocycle by bonding to each other)], and having 5,000-1,000,000 number average molecular weight. The adhesive sheet preferably contains a self crosslinkable compound having one or more reactive functional groups capable of forming chemical bonds with the carboxyl groups in one molecule, especially an epoxy resin, for example, the diglycidyl ether or the like of bisphenol-F as the epoxy resin in an amount of about 5-400 pts.wt. based on 100 pts.wt. of the thermoplastic resin is preferably formulated therewith.

Patent Agency Ranking