公开(公告)号：US09980393B2

公开(公告)日：2018-05-22

申请号：US14704597

申请日：2015-05-05

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-cheol Bae ,  Jung Hyun Noh ,  Jong Tae Moon

IPC: H05K3/12 ,  C25D5/02 ,  H05K3/18 ,  H05K3/10 ,  H05K1/09

CPC classification number: H05K3/1216 ,  C25D5/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K1/095 ,  H05K3/102 ,  H05K3/188 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0302 ,  H05K2203/0425

Abstract: A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.

公开(公告)号：US20180070442A1

公开(公告)日：2018-03-08

申请号：US15693523

申请日：2017-09-01

Applicant: FANUC CORPORATION

Inventor： Takeshi SAWADA ,  Yuichi OKOCHI ,  Norihiro SAIDO

IPC: H05K1/02 ,  H05K1/14 ,  G01R31/02

CPC classification number: H05K1/0268 ,  G01R31/021 ,  H05K1/141 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0302

Abstract: To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part. One mode of the replacement-enabling connection part of the printed circuit board is a connection part (solder joint) constituted by solder, another mode thereof is a connection part (electrically conductive adhesive connection part) constituted by electrically conductive adhesive, and yet another mode thereof is a connection part (cable) constituted by a cable.

公开(公告)号：US09807848B2

公开(公告)日：2017-10-31

申请号：US14792092

申请日：2015-07-06

Applicant: YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM, LTD.

Inventor： Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

IPC: H05B33/28 ,  H01B1/02 ,  H01B1/10 ,  H01L31/0224 ,  C23C4/18 ,  C23C26/00 ,  H01L31/18 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  C23C16/513 ,  B05D3/10 ,  B05D5/06 ,  B05D5/12 ,  H01L33/42 ,  H05K1/02 ,  H05K3/14

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

公开(公告)号：US09368261B2

公开(公告)日：2016-06-14

申请号：US14361057

申请日：2014-04-03

Applicant: Nuovo Film, Inc.

Inventor： Hakfei Poon

IPC: H01B13/30 ,  H01B1/22 ,  H01L31/0224 ,  G06F3/041 ,  H01L31/18 ,  H01B1/02

CPC classification number: H01B13/30 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/032

Abstract: Discloses herein is a method to make a transparent conductive electrode. The methods comprises providing a substrate, forming a film comprising a first region having a plurality of metal nanowires, wherein at least some of metal nanowires are surface functionalized and inert to oxidation or acid reactions; evaporating away the solvent in the metal nanowire film; exposing the nanowire film to a chemical reagent; forming a second region comprising nanowires, and annealing the film having the first and second region, wherein the resistivity difference between the first and second region is more than 1000.

公开(公告)号：US09167684B2

公开(公告)日：2015-10-20

申请号：US13902149

申请日：2013-05-24

Applicant: Nokia Corporation

Inventor： Mark Lee Allen ,  Chris Bower ,  Darryl Cotton

IPC: H05K1/16 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H01L23/00 ,  H05K3/10

CPC classification number: H05K1/0272 ,  H01L23/52 ,  H01L24/00 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24101 ,  H01L2224/24226 ,  H01L2224/24997 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/2919 ,  H01L2224/82101 ,  H01L2224/82138 ,  H01L2224/8284 ,  H01L2224/82862 ,  H01L2224/82874 ,  H01L2224/82877 ,  H01L2224/82986 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K1/092 ,  H05K1/097 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0257 ,  H05K2201/0302 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A substrate including a fluid reservoir and a connected fluid channel, the fluid reservoir positioned away from a component region of the substrate, the fluid channel configured to extend from the fluid reservoir to guide an electrically conductive fluid from the fluid reservoir at a reservoir end of the fluid channel through the fluid channel to a component end of the fluid channel, the component end extending to the component region of the substrate to enable the formation of an electrical connection to a connector of an electronic component appropriately positioned in the component region, formation of the electrical connection allowing the electronic component to be interconnected to other electronic components using one or more of the fluid reservoir and fluid channel.

Abstract translation: 包括流体储存器和连接的流体通道的基板，所述流体储存器远离所述基板的部件区域定位，所述流体通道被配置为从所述流体储存器延伸以在所述流体储存器的储存器端部处从所述流体储存器引导导电流体 通过流体通道的流体通道流到流体通道的部件端，部件端部延伸到基板的部件区域，以使得能够形成与适当地定位在部件区域中的电子部件的连接器的电连接，形成 的电连接，允许使用一个或多个流体储存器和流体通道将电子部件互连到其他电子部件。

公开(公告)号：US20150235728A1

公开(公告)日：2015-08-20

申请号：US14361062

申请日：2014-04-03

Applicant: Nuovo Film, Inc.

Inventor： Hakfei Poon

IPC: H01B1/02 ,  H05K1/02 ,  C23C22/73 ,  C23C22/78 ,  B22F9/16 ,  C23C22/58

CPC classification number: H01B1/02 ,  B22F9/16 ,  C23C22/58 ,  C23C22/73 ,  C23C22/78 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/22 ,  H01B13/30 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/032 ,  Y10T428/249921

Abstract: Discloses herein is a method to make a surface functionalized metal nanowire. The surface functionalized metal nanowire retains the electrical conductivity but lose the luster. This is a key enabler for making ultra-low haze (haze

Abstract translation: 本文公开了制备表面官能化金属纳米线的方法。 表面官能化金属纳米线保持导电性，但失去光泽。 这是制造超低雾度（雾度<0.5）银纳米线基导电膜的关键推动因素。

公开(公告)号：US09107275B2

公开(公告)日：2015-08-11

申请号：US13503772

申请日：2010-11-02

Applicant: Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

Inventor： Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

IPC: H01L31/0224 ,  H05B33/28 ,  C23C4/18 ,  C23C26/00 ,  H01L31/18 ,  C23C16/513 ,  B05D3/10 ,  B05D5/06 ,  B05D5/12 ,  H01L33/42

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

Abstract translation: 本发明提供了用于制造导电透明膜的方法和包括其的电子或光电子器件。

公开(公告)号：US20150022741A1

公开(公告)日：2015-01-22

申请号：US14377621

申请日：2013-03-25

Applicant: Sharp Kabushiki Kaisha

Inventor： Yusuke Nii ,  Masayuki Kitami ,  Masayoshi Okita

IPC: H05K1/18 ,  H04M1/02 ,  G06F1/16

CPC classification number: H05K1/189 ,  G06F1/1643 ,  G06F3/0412 ,  G06F3/0416 ,  G06F2203/04107 ,  H04M1/0268 ,  H05K2201/0302 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: A plurality of first terminals each being pulled out from a sensor area and a pair of second terminals connected together are provided so as to be lined with one another in a terminal area of a touch panel layer on a cover substrate and, in an FPC, a plurality of first wirings each being configured such that one end thereof is connected to each of the first terminals and the other end thereof extends at an external connection side, a second wiring configured such that one end thereof is connected to one of the second terminals and the other end thereof is grounded, and a third wiring configured such that one end thereof is connected to the other one of the second terminals and the other end thereof extends to reach the external connection side are provided.

Abstract translation: 在盖基板上的触摸面板层的端子区域中，设置从传感器区域拉出的多个第一端子和连接在一起的一对第二端子，并且在FPC基板中， 多个第一配线各自被构造成使得其一端连接到每个第一端子，并且另一端在外部连接侧延伸，第二配线被构造成使得其一端连接到第二端子中的一个 并且其另一端被接地，并且第三配线被配置为使得其一端连接到另一个第二端子并且另一端延伸到达外部连接侧。

公开(公告)号：US20150002464A1

公开(公告)日：2015-01-01

申请号：US14378072

申请日：2013-02-21

Applicant: Mitsubishi Electric Corporation

Inventor： Takahiro Nishioka ,  Naoki Nakagawa ,  Masafumi Agari ,  Takeshi Ono ,  Seiichiro Mori

IPC: H05K1/02 ,  G06F3/044

CPC classification number: G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F3/047 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: Detection column wires and detection row wires are configured of thin wires made of a conductive material having light reflectivity, such as a metal or alloy including silver and aluminum. A predetermined plural number of detection column wires are electrically connected to form a plurality of column-direction bundle wires. A predetermined plural number of detection row wires are electrically connected to form a plurality of row-direction bundle wires. A reflected-light distribution pattern is further provided. When viewed in a direction vertical to the surface of the touch screen, the reflected-light distribution pattern includes a curved portion, and the normal lines of the curved portion head for all directions.

Abstract translation: 检测列线和检测行线由具有光反射率的导电材料制成的细线构成，例如包括银和铝的金属或合金。 预定多个检测列线被电连接以形成多个列方向束线。 预定的多个检测行布线电连接以形成多个行方向的布线。 还提供反射光分布图案。 当在垂直于触摸屏的表面的方向上观察时，反射光分布图案包括弯曲部分和弯曲部分头部的法线沿所有方向。

公开(公告)号：US20130146342A1

公开(公告)日：2013-06-13

申请号：US13611220

申请日：2012-09-12

Applicant: Yong Sung EOM ,  Kwang-Seong Choi ,  Hyun-cheol Bae ,  Jung Hyun Noh ,  Jong Tae Moon

Inventor： Yong Sung EOM ,  Kwang-Seong Choi ,  Hyun-cheol Bae ,  Jung Hyun Noh ,  Jong Tae Moon

IPC: H01B1/02 ,  H05K3/00 ,  C25D5/02 ,  H05K1/09 ,  H05K3/12

CPC classification number: H05K3/1216 ,  C25D5/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K1/095 ,  H05K3/102 ,  H05K3/188 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0302 ,  H05K2203/0425

Abstract: The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.