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61.发明申请公开(公告)号：US20170339779A1
公开(公告)日：2017-11-23
申请号：US15158399
申请日：2016-05-18
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
CPC classification number: H05K1/0204 , H01L23/4275 , H01L23/4338 , H05K1/181 , H05K3/34 , H05K2201/10227 , H05K2201/10507
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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公开(公告)号：US20170273175A1
公开(公告)日：2017-09-21
申请号：US15447374
申请日：2017-03-02
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Tsukasa OBINATA , Yusuke KARASAWA , Hideyuki TAKO , Goshi IMAI , Suguru YAMATO
CPC classification number: H05K1/0266 , G06K19/06028 , H05K1/0269 , H05K1/113 , H05K3/429 , H05K3/4602 , H05K2201/0959 , H05K2201/10227
Abstract: An interconnection substrate having a barcode includes a core layer, an interconnection layer over a first surface of the core layer, an insulating layer to cover the interconnection layer, and one or more additional interconnection layers over the insulating layer, wherein the barcode includes cells arranged at spaced intervals, and a cell pattern is made by forming penetrating holes through the core layer in some of the cells but not in remaining ones of the cells, wherein the penetrating holes are filled with resin, and an end face of the resin is exposed on the same side as the first surface such that the interconnection layer is situated in a surrounding area of the end face but not over the end face, and wherein a number of interconnection layers over the end face is smaller than a number of interconnection layers in the surrounding area of the end face.
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公开(公告)号：US20240057251A1
公开(公告)日：2024-02-15
申请号：US18113834
申请日：2023-02-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Eun Su Kwon
IPC: H05K1/02
CPC classification number: H05K1/0296 , H05K2201/10227 , H05K2201/10984
Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.
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公开(公告)号：US20180279515A1
公开(公告)日：2018-09-27
申请号：US15469135
申请日：2017-03-24
Applicant: Microsoft Technology Licensing, LLC
Inventor： Mark Mitchell Gloster , Whitney Giaimo , John Godfrey
CPC classification number: H05K9/0032 , H05K1/181 , H05K3/303 , H05K9/0026 , H05K2201/10227
Abstract: The edge shields disclosed herein utilize a plated edge surface of a PCB to form one or more sides of an electronic shield to reduce the amount of top surface area of the PCB occupied by the electronic shield. More specifically, an edge shield lid is mechanically attached to the plated edge surface to remove a need for solder overprint at the edge of the PCB. The edge shield lid is soldered, welded, adhered, or mechanically attached to edge walls where there is no available edge surface for attachment.
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公开(公告)号：US10064315B2
公开(公告)日：2018-08-28
申请号：US15297458
申请日：2016-10-19
Inventor： Chien-Hsiung Tsao , Yan-Ning Chen
CPC classification number: H05K7/209 , H05K1/0203 , H05K1/0209 , H05K1/0263 , H05K1/181 , H05K3/301 , H05K2201/09072 , H05K2201/10015 , H05K2201/1003 , H05K2201/10166 , H05K2201/10227 , H05K2201/10272 , H05K2201/10492 , H05K2201/10522 , H05K2201/10553 , H05K2201/10568 , H05K2201/10606
Abstract: The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.
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Patent Agency Ranking
公开(公告)号：US09978486B2
公开(公告)日：2018-05-22
申请号：US15410409
申请日：2017-01-19
Applicant: Fluke Corporation
Inventor： Mark Steven Buckner , Steven Wayne Higgins , Donald A. Gessling , Bryan Charles Hoog , Michael A. Schoch
IPC: H05B3/00 , H05K3/30 , H05K7/12 , H01B17/00 , H05K1/14 , H05K1/00 , H05K1/18 , H05K7/00 , H01C3/10 , H01C7/22 , H01C13/02
CPC classification number: H01C13/02 , H01C1/01 , H01C1/082 , H05K1/181 , H05K3/301 , H05K2201/10022 , H05K2201/10227 , H05K2201/10409 , H05K2201/10583 , H05K2201/10606
Abstract: A resistor support assembly includes first, second, third, and fourth support members. Each of the first and second support members includes one or more resistor contact regions and apertures extending therethrough. Each third support member is at least partially disposed within one of the apertures of one of the first support members and one of the apertures of one of the second support members. Recesses may be formed in the resistor contact regions of the first and the second support members, and one or more load resistors may be at least partially disposed within the recesses. The resistor support assembly may be used to mount one or more load resistors to a printed circuit board, without obstructing airflow through hollow portions of the load resistors. To reduce parasitic capacitance and inductance, the first support members and the second support members are formed from non-conductive materials.
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公开(公告)号：US09949370B2
公开(公告)日：2018-04-17
申请号：US15373583
申请日：2016-12-09
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki Tanabe , Naohiro Terada , Yuu Sugimoto , Daisuke Yamauchi
CPC classification number: H05K1/05 , G11B5/483 , G11B5/4853 , H05K1/117 , H05K3/22 , H05K3/3442 , H05K3/4608 , H05K3/4644 , H05K2201/10151 , H05K2201/10227 , Y02P70/613
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.
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公开(公告)号：US09936576B2
公开(公告)日：2018-04-03
申请号：US15174208
申请日：2016-06-06
Applicant: International Business Machines Corporation
Inventor： Ai Kiar Ang , Michael Lauri
IPC: H01L21/44 , H05K1/11 , H05K1/18 , H05K3/32 , H05K3/34 , H05K1/14 , H01L23/495 , H01L25/10 , H01L25/00 , H01L21/48 , H05K1/03
CPC classification number: H05K1/11 , H01L21/4839 , H01L23/49537 , H01L23/49555 , H01L23/49565 , H01L23/49575 , H01L25/105 , H01L25/50 , H01L2225/1029 , H01L2924/181 , H05K1/0313 , H05K1/144 , H05K1/18 , H05K1/181 , H05K3/328 , H05K3/341 , H05K3/3421 , H05K3/3426 , H05K2201/10015 , H05K2201/10227 , H05K2201/10515 , H05K2201/1053 , H05K2201/10962 , Y02P70/613 , H01L2924/00012
Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
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公开(公告)号：US20170332492A1
公开(公告)日：2017-11-16
申请号：US15152218
申请日：2016-05-11
Applicant: Flextronics Automotive GmbH & Co. KG
Inventor： Peter Lutz , Kevin Buermann
CPC classification number: H05K1/189 , H05K3/288 , H05K3/305 , H05K3/328 , H05K2201/05 , H05K2201/0929 , H05K2201/10037 , H05K2201/10227 , H05K2201/1031 , H05K2201/10931 , H05K2203/0278 , H05K2203/04 , H05K2203/16
Abstract: The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.
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70.发明申请公开(公告)号：US20170303427A1
公开(公告)日：2017-10-19
申请号：US15297458
申请日：2016-10-19
Inventor： CHIEN-HSIUNG TSAO , YAN-NING CHEN
CPC classification number: H05K7/209 , H05K1/0203 , H05K1/181 , H05K2201/10015 , H05K2201/1003 , H05K2201/10166 , H05K2201/10227
Abstract: The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.
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