公开(公告)号：US07943855B2

公开(公告)日：2011-05-17

申请号：US11425442

申请日：2006-06-21

Applicant: Chi-Chen Cheng ,  Chi-Chung Lo

Inventor： Chi-Chen Cheng ,  Chi-Chung Lo

IPC: H05K1/00

CPC classification number: H05K1/0204 ,  H05K1/189 ,  H05K3/281 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/10689

Abstract: A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat produced from the electronic component can be transmitted to the main layer by a heat-conductive medium between the electronic component and the main layer, and can be diffused via the first opening.

Abstract translation: 柔性印刷电路（FPC）和电子部件组件。 FPC包括具有第一开口的第一保护层，第一保护层上的主层，以及具有暴露主层的第二开口的第二保护层。 由电子部件产生的热量可以通过电子部件和主体层之间的导热介质传输到主层，并且可以经由第一开口扩散。

公开(公告)号：US20090212423A1

公开(公告)日：2009-08-27

申请号：US12196210

申请日：2008-08-21

Applicant: Junji TANAKA ,  Masahiko HARAYAMA ,  Masanori ONODERA

Inventor： Junji TANAKA ,  Masahiko HARAYAMA ,  Masanori ONODERA

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H05K3/38 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2225/06568 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/20752 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device is provided that includes a semiconductor chip, a plurality of solder bumps that electrically couple the semiconductor chip to the outside, and a metal bump being provided on the surface of each first solder bump which is at least a part of the plurality of solder bumps and being made of a metal having a melting point higher than that of the first solder bump. The wettability of the first solder bump is improved as each metal bump serves as a core when the corresponding first solder bump melts. Thus, the connection reliability of the first solder bump can be improved.

Abstract translation: 提供了一种半导体器件，其包括半导体芯片，将半导体芯片电耦合到外部的多个焊料凸块以及设置在每个第一焊料凸块的表面上的金属凸块，该第一焊料凸块是至少部分多个 焊料凸起并且由熔点高于第一焊料凸点的金属制成。 当相应的第一焊料凸块熔化时，每个金属凸块用作芯时，第一焊料凸块的润湿性得到改善。 因此，可以提高第一焊料凸块的连接可靠性。

公开(公告)号：US20070084629A1

公开(公告)日：2007-04-19

申请号：US11538823

申请日：2006-10-05

Applicant: William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

Inventor： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

IPC: H05K1/16

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US07199309B2

公开(公告)日：2007-04-03

申请号：US11167662

申请日：2005-06-27

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US07170187B2

公开(公告)日：2007-01-30

申请号：US10711185

申请日：2004-08-31

Applicant: William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

Inventor： William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

IPC: H01L23/48

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US07120033B2

公开(公告)日：2006-10-10

申请号：US10196027

申请日：2002-07-16

Applicant: Kurt Gross ,  Hans Rappl

Inventor： Kurt Gross ,  Hans Rappl

IPC: H05K7/10

CPC classification number: H01L23/13 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/308 ,  H05K3/44 ,  H05K2201/1025 ,  H05K2201/10416 ,  H05K2201/1059 ,  Y10T29/49147 ,  Y10T29/49153 ,  H01L2924/00

Abstract: An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).

Abstract translation: 在布置在导电支撑板（1）的电子电路（S）和支撑板（1）之间通过提供一个孔（4,5）而产生导电接合连接（B） 具有可粘合表面（3）的元件（2）以支撑板（1）和接合元件（2）进入导电和摩擦连接的方式被按压; 随后用接合元件（2）产生接合连接。

公开(公告)号：US20050214971A1

公开(公告)日：2005-09-29

申请号：US10907158

申请日：2005-03-23

Applicant: Ching-Fu Hung

Inventor： Ching-Fu Hung

IPC: H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/73203 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/0379 ,  H05K2201/1025 ,  H05K2203/043 ,  Y02P70/613 ,  H01L2924/0105 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05099

Abstract: A bumping process, a bump structure, a packaging process and a package structure are described. The bump structure comprises a first solder portion, a second solder portion and a conductive layer. The second solder portion is disposed on the first solder portion and the conductive layer is disposed between the first solder portion and the second solder portion. The bumping process produces a bump structure having a greater height. The bumping process can also be applied in a package process to form a package structure having a highly reliable connection between a chip and a packaging substrate.

Abstract translation: 描述了碰撞过程，凸块结构，包装过程和包装结构。 凸块结构包括第一焊料部分，第二焊料部分和导电层。 第二焊料部分设置在第一焊料部分上，并且导电层设置在第一焊料部分和第二焊接部分之间。 碰撞过程产生具有较大高度的凸块结构。 碰撞过程也可以应用于封装工艺中以形成具有在芯片和封装衬底之间的高度可靠连接的封装结构。

公开(公告)号：US20050048770A1

公开(公告)日：2005-03-03

申请号：US10914227

申请日：2004-08-10

Applicant: Naohiro Mashino

Inventor： Naohiro Mashino

IPC: H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/22 ,  H05K3/42 ,  H05K3/46 ,  H01L21/44 ,  H01L23/053 ,  H01L23/12 ,  H01L23/34

CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

Abstract: A process for manufacturing a wiring board comprising a substrate made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrate to electrically connect the first conductor pattern with the second conductor pattern; the process comprising the following steps of: forming the substrate with a through-hole penetrating thereto and defining openings at the first and second surfaces, respectively; plating the substrate with a metal so that a metal layer having a predetermined thickness is formed on the respective first and second surfaces of the substrate and the through-hole is substantially filled with the metal to be the via conductor; irradiating a laser beam, as a plurality of spots, around a metal-less portion of the plated metal, such as a dimple or seam, at positions corresponding to the openings of the through-hole, so that the a part of the plated metal melts to fill the metal-less portion with the molten metal.

Abstract translation: 一种制造布线板的方法，包括由绝缘材料制成并具有第一和第二表面的基底，分别形成在第一和第二表面上的第一和第二导体图案，以及穿过基板的通孔导体，以将第一导体 图案与第二导体图案; 该方法包括以下步骤：用穿透其的通孔形成基底并分别在第一和第二表面处限定开口; 用金属电镀基板，使得在基板的相应的第一和第二表面上形成具有预定厚度的金属层，并且通孔基本上填充有作为通路导体的金属; 在对应于通孔的开口的位置处，将激光束作为多个点照射在电镀金属的无金属部分（例如凹坑或接缝）周围，使得电镀金属的一部分 熔化以用熔融金属填充无金属部分。

公开(公告)号：US06424037B1

公开(公告)日：2002-07-23

申请号：US09941384

申请日：2001-08-28

Applicant: Chung W Ho ,  Tsing-Chow Wang

Inventor： Chung W Ho ,  Tsing-Chow Wang

IPC: H01L2348

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13583 ,  H01L2224/136 ,  H01L2224/13647 ,  H01L2224/13671 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/1025 ,  H05K2201/2081 ,  H05K2203/0315 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: Within a method for forming a solder interconnection structure for use within a microelectronic fabrication, there is first provided a substrate having formed thereover a bond pad. There is then formed upon the bond pad a first solder interconnection layer. There is then formed over the first solder interconnection layer an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer. There is then formed over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.

公开(公告)号：JP2015144202A

公开(公告)日：2015-08-06

申请号：JP2014017063

申请日：2014-01-31

Applicant: 株式会社豊田自動織機

Inventor： 松本 尚能 ,  紺谷 一善 ,  山上 智弘

IPC: H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H01L25/07

CPC classification number: H01L25/07 ,  H01L25/18 ,  H02M7/003 ,  H05K1/0263 ,  H05K1/144 ,  H05K7/1432 ,  H01L2924/0002 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10242 ,  H05K2201/1025

Abstract: 【課題】回路パターンを形成する金属箔を厚くすること無く、基板に大電流を流すことができる半導体装置を提供する。 【解決手段】インバータ装置1は、複数のスイッチング素子15が実装される下回路基板11と、この下回路基板11の上に近接配置され、複数のコンデンサ9が実装される上回路基板13とを有している。上回路基板13の表面には、正極電極パターンと負極電極パターンとが形成されている。正極電極パターンには正極電極端子4が接続固定され、負極電極パターンには負極電極端子5が接続固定されている。負極電極パターンには、複数のブロック状の導電部材25が半田付けにより接合されている。導電部材25は、負極電極パターンに電流を流した時に電流が集中しやすい部位(電流集中部)、つまり正極電極端子4及び負極電極端子5といった電極部の近傍に配置されている。 【選択図】図1

Abstract translation: 要解决的问题：提供一种能够使大电流流向基板而不使形成电路图案的金属箔增厚的半导体器件。解决方案：逆变器装置1包括：下电路板11，其中多个开关元件 15包装; 以及设置在下电路板上的多个电容器9的上电路基板13。 在上部电路板13的表面上，形成正极图案和负极图案。 正极端子4连接到正极图案并固定，负极端子5连接到负极图案并固定。 通过焊接将多个块状导电构件25接合到负极图案。 当电流流向负电极图案（电流集中部分）时，导电部件25设置在电流容易集中的部分，即在正极端子4或电极端子4等电极部附近 负极端子5。