公开(公告)号：EP1883282B1

公开(公告)日：2012-01-18

申请号：EP07014532.1

申请日：2007-07-24

Applicant: DENSO CORPORATION

Inventor： Kawabata, Akira ,  Fukaya, Yuichiro

IPC: H05K3/30 ,  H05K5/02 ,  H05K1/18 ,  H01M2/10

CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

公开(公告)号：EP1459611B1

公开(公告)日：2011-06-22

申请号：EP02798283.4

申请日：2002-12-19

Applicant: ROBERT BOSCH GMBH

Inventor： SCHIEFER, Peter

IPC: H05K5/00

CPC classification number: H05K9/0026 ,  H05K1/181 ,  H05K3/301 ,  H05K5/0056 ,  H05K5/0069 ,  H05K9/0037 ,  H05K9/0049 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10583 ,  H05K2203/1572 ,  Y02P70/611

Abstract: The invention relates to a housing system for an electric device (1), which has at least two housing parts (2, 3) and an electronic circuit arranged on a circuit board (4) therein, provided with a conductive layer which is connected to the ground of at least one metallic housing part (2). The housing part (3) is made of a plastic part. At least the connecting device (9) for the voltage source of the device and/or the signal transmission to the electronic circuit is integrated therein. The circuit board (4) is covered on both sides. Perturbing-radiation-sensitive components (5) are arranged on the side thereof, and are continuously surrounded by the metallic housing part (2) and the conductive layer, and other components (6) and contacts of the connecting device (9) are arranged on the other side of the circuit board (4).

公开(公告)号：EP1742507B1

公开(公告)日：2010-09-15

申请号：EP06014139.7

申请日：2006-07-07

Applicant: Hosiden Corporation

Inventor： Izuchi, Toshiro c/o Hosiden Kyushu Corp. ,  Ono, Kazuo c/o Hosiden Kyushu Corp. ,  Nakanishi, Kensuke c/o Hosiden Kyushu Corp. ,  Onishi, Hiroaki c/o Hosiden Kyushu Corp.

IPC: H04R19/00

CPC classification number: H05K3/341 ,  H04R1/06 ,  H04R19/016 ,  H04R31/006 ,  H05K1/0243 ,  H05K3/3452 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10083 ,  H05K2201/10583 ,  H05K2203/1178 ,  Y02P70/613

公开(公告)号：EP1996000A3

公开(公告)日：2009-07-22

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

公开(公告)号：EP0556184A1

公开(公告)日：1993-08-25

申请号：EP91914556.0

申请日：1991-08-15

Applicant: HILLER, Peter

Inventor： HILLER, Peter

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/184 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10659

Abstract: La présente invention se rapporte à une plaquette à circuits imprimés comportant des composants électriques, où les composants avec leurs corps isolés (3) sont placés dans des trous de passage (10) de la plaquette à circuits imprimés (9), et où ils sont légèrement en saillie sur le dessous et sur le dessus de la plaquette, en portant dans ces zones des surfaces de contact, lesquelles sont brasées à des pistes conductrices de la plaquette. Les extrémités inférieures des composants se terminent en forme de calotte hémisphérique ou en pointes arrondies et présentent des surfaces de contact inférieures correspondantes, lesquelles font saillie dans des pistes conductrices de la plaquette à circuits imprimés (9) se présentant sous forme de pastilles (7) et lesquelles sont brasées à ces dernières. Les extrémités supérieures des composants portent plusieurs surfaces de contact supérieures (1.1, 1.2) isolées les unes des autres, lesquelles sont reliées à des éléments de contact (2.1, 2.2) en saillie du corps (3) et reliées en pont autour des trous (10) de la plaquette à circuits imprimés, au moyen d'une pâte à braser (5), à des pistes conductrices (6) du dessus de la plaquette à circuits imprimés.

公开(公告)号：JP6250321B2

公开(公告)日：2017-12-20

申请号：JP2013152344

申请日：2013-07-23

Applicant: ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッド ,  Johnson & Johnson Vision Care, Inc.

Inventor： ランドール・ビー・ピュー ,  ジェームズ・ダニエル・リオール ,  ダニエル・ビー・オッツ ,  アダム・トナー ,  フレデリック・エイ・フリッチュ

IPC: G02C7/04 ,  A61F2/16

CPC classification number: G02C7/083 ,  B29D11/00038 ,  B29D11/00817 ,  G02C7/04 ,  G02C7/049 ,  H05K1/0284 ,  H01L23/04 ,  H01L2924/0002 ,  H05K2201/10568 ,  H05K2201/10583

公开(公告)号：JP5540254B2

公开(公告)日：2014-07-02

申请号：JP2010188509

申请日：2010-08-25

Applicant: 北川工業株式会社

Inventor： 達哉 中村

IPC: H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K1/18

CPC classification number: H01G2/10 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651

公开(公告)号：JP4973053B2

公开(公告)日：2012-07-11

申请号：JP2006205300

申请日：2006-07-27

Applicant: 株式会社デンソー

Inventor： 彰 河端 ,  有一郎 深谷

IPC: H05K7/12

CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: An electronic apparatus (100) includes a housing (10) a circuit board (20) held in the housing (10), and large electronic components (30,31) held in the housing (10) and electrically coupled to the circuit board (20). The housing (10) has a mounting surface (10a) and the electronic apparatus is mounted to an object at the mounting surface (10a). The large electronic components (30,31) are arranged in a three-dimensional manner with respect to the mounting surface (10a) in such a manner that at least one of the large electronic components (30) overlaps at least one of the large electronic components (30) in a direction toward the mounting surface.

公开(公告)号：JP4225913B2

公开(公告)日：2009-02-18

申请号：JP2003555874

申请日：2002-12-19

Applicant: ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh

Inventor： シーファー ペーター

IPC: H05K5/06 ,  H05K9/00 ,  H05K1/18 ,  H05K3/30 ,  H05K5/00 ,  H05K7/20

CPC classification number: H05K9/0026 ,  H05K1/181 ,  H05K3/301 ,  H05K5/0056 ,  H05K5/0069 ,  H05K9/0037 ,  H05K9/0049 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10583 ,  H05K2203/1572 ,  Y02P70/611

公开(公告)号：JPS5949980A

公开(公告)日：1984-03-22

申请号：JP14628983

申请日：1983-08-10

Applicant: Xerox Corp

Inventor： DANIERU AARU BURETSUSHINGUTON

IPC: B41J2/01 ,  B41J2/045 ,  B41J2/055 ,  B41J2/14 ,  G01D15/18 ,  G06K15/10 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01R12/526 ,  B41J2/1429 ,  H05K1/184 ,  H05K3/4046 ,  H05K2201/10083 ,  H05K2201/10583