中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

495 records (took 0.064 seconds)

    LIGHT EMITTING DIODE WITH INTEGRATED HEAT DISSIPATER
    61.
    发明申请
    LIGHT EMITTING DIODE WITH INTEGRATED HEAT DISSIPATER 审中-公开
    发光二极管与集成散热器

    公开(公告)号：WO2003028119A2

    公开(公告)日：2003-04-03

    申请号：PCT/US2002/026335

    申请日：2002-08-19

    Applicant: SHIH, Kelvin

    Inventor： SHIH, Kelvin

    IPC: H01L33/00

    CPC classification number: H01L33/647 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10659 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: A light emitting diode (LED) has an integrated heat sink structure for removing heat from an LED junction and for dissipating heat from the junction to the ambient air. The anode and the cathode both either act as or are coupled to a thermally conductive material which acts as the heat sink. In one embodiment, the heat sink forms a mounting configuration that allows air to circulate around multiple surfaces to maximize heat dissipation. As a result, the LED junction temperature remains low, allowing the LED to be driven with higher currents and generate a higher light output without adverse temperature-related effects.

    Abstract translation: 发光二极管（LED）具有集成的散热器结构，用于从LED结去除热量并将热量从结点散发到环境空气。 阳极和阴极都充当或耦合到充当散热器的导热材料。 在一个实施例中，散热器形成允许空气围绕多个表面循环以使散热最大化的安装构造。 因此，LED结温仍然很低，使得LED可以用更高的电流驱动，并产生更高的光输出，而不会产生与温度有关的不利影响。

    プリント基板およびプリント基板を備えた電子機器並びにプリント基板の製造方法
    62.
    发明申请
    プリント基板およびプリント基板を備えた電子機器並びにプリント基板の製造方法 审中-公开
    印刷电路板，印刷电路板提供的电子设备以及印刷电路板的制造方法

    公开(公告)号：WO2015060085A1

    公开(公告)日：2015-04-30

    申请号：PCT/JP2014/076282

    申请日：2014-10-01

    Applicant: 住友電装株式会社

    Inventor： 鎌田　将史

    IPC: H05K1/18 ,  H01Q1/24 ,  H01R4/02 ,  H05K3/34 ,  H05K7/06 ,  H05K13/04

    CPC classification number: H05K1/18 ,  H01Q5/35 ,  H01Q9/0421 ,  H01Q23/00 ,  H05K3/34 ,  H05K5/0039 ,  H05K2201/10098 ,  H05K2201/10659 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

    Abstract: 　板金部材を実装機でより容易かつ確実に実装することのできる、新規な構造のプリント基板およびそれを備えた電子機器を提供すること、並びにそのようなプリント基板の新規な製造方法を提供すること。　基板１２上に立設される板金部材１４において、基板１２の貫通孔３８ａ，３８ｂに挿通されて半田付けされるリード固定部２２ａ，２２ｂと、基板１２の表面４２に重ね合わされて半田付けされる平板状部３４を有する表面固定部３２を設けると共に、実装機４６に把持される把持部３０の近位にリード固定部２２ａ，２２ｂを設ける一方、把持部３０の遠位に表面固定部３２を設けた。

    Abstract translation: 为了提供一种新结构的印刷电路板，其中可以通过安装器更容易且可靠地安装钣金构件，以及提供其的电子装置，并且提供了一种用于这种印刷电路板的新的制造方法， 金属构件（14）设置成放置在基板（12）上，插入基板（12）的通孔（38a，38b）中并被焊接的引线固定部分（22a，22b） 提供具有叠置在基板（12）的表面（42）上并被焊接的平坦形部分（34）的固定部分（32），并且引线固定部分（22a，22b）设置在接近 一个由安装器（46）夹紧的抓握部分（30），同时表面固定部分（32）设置在远离把手部分（30）的位置。

    IMPROVED LOW PROFILE INDUCTORS FOR HIGH DENSITY CIRCUIT BOARDS
    64.
    发明申请
    IMPROVED LOW PROFILE INDUCTORS FOR HIGH DENSITY CIRCUIT BOARDS 审中-公开
    改进用于高密度电路板的低剖面电感器

    公开(公告)号：WO2011011624A1

    公开(公告)日：2011-01-27

    申请号：PCT/US2010/042938

    申请日：2010-07-22

    Applicant: VOLTERRA SEMICONDUCTOR CORPORATION ,  IKRIANNIKOV, Alexandr

    Inventor： IKRIANNIKOV, Alexandr

    IPC: H01F17/06 ,  H01F27/28 ,  H01F27/29 ,  H05K1/18

    CPC classification number: H01F27/2847 ,  H01F17/06 ,  H01F27/292 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10659 ,  Y02P70/611

    Abstract: An inductor includes a core (1514) formed of a magnetic material and a foil winding (1506) wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue (1604) configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab (1504). At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor (1508, 1510) attached to the core. The core does not form a magnetic path loop around the ground return conductor.

    Abstract translation: 电感器包括由磁性材料形成的芯部（1514）和至少部分地绕芯部的至少一部分缠绕的箔绕组（1506）。 绕组的第一端远离芯部形成延伸的输出舌片（1604），其配置和布置成补充或用作印刷电路板箔迹线的替代物。 绕组的第二端形成焊接片（1504）。 扩展输出舌片和焊片的至少一部分相对于芯的底表面形成在相同的高度。 另一个电感器包括由磁性材料形成的芯部，至少部分地围绕或穿过芯部的至少一部分缠绕的绕组以及连接到芯体的接地返回导体（1508,1510）。 磁芯不会在接地回路导体周围形成磁路环路。

    ELECTRONIC MODULE HAVING CANOPY-TYPE CARRIERS
    65.
    发明申请
    ELECTRONIC MODULE HAVING CANOPY-TYPE CARRIERS 审中-公开
    具有CANOPY型载体的电子模块

    公开(公告)号：WO02033752A2

    公开(公告)日：2002-04-25

    申请号：PCT/US2001/032330

    申请日：2001-10-16

    IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

    Abstract: An improved multi-chip module includes a main circuit board having and array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of the package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A number of other vriations exist that provide various other embodiments of the invention including one in which the carrier leads are laminated directly to the leads of an IC package.

    Abstract translation: 改进的多芯片模块包括主电路板，其具有安装有多个IC封装单元的电互连焊盘阵列。 每个IC封装单元包括一对IC封装，两者都安装在封装载体的相对侧上。 封装单元可以安装在主电路板的一侧或两侧。 本发明的第一个主要实施例采用具有一对主平面的层状包装载体。 每个表面都包含电接触垫。 通过将封装的引线与平坦表面上的接触焊盘相互连接，将一个IC封装表面安装在每个主平面上，形成IC封装单元。 存在提供本发明的各种其它实施例的许多其他的变化，包括其中载体引线直接层压到IC封装的引线的其他实施例。

    ELECTRONIC MODULE HAVING A THREE DIMENSIONAL ARRAY OF CARRIER-MOUNTED INTEGRATED CIRCUIT PACKAGES
    66.
    发明申请
    ELECTRONIC MODULE HAVING A THREE DIMENSIONAL ARRAY OF CARRIER-MOUNTED INTEGRATED CIRCUIT PACKAGES 审中-公开
    具有载体安装集成电路组件的三维尺寸阵列的电子模块

    公开(公告)号：WO0169680A2

    公开(公告)日：2001-09-20

    申请号：PCT/US0107926

    申请日：2001-03-13

    Applicant: LEGACY ELECTRONICS INC ,  KLEDZIK KENNETH J ,  ENGLE JASON C

    Inventor： KLEDZIK KENNETH J ,  ENGLE JASON C

    IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

    Abstract: A package carrier (100) for increasing the circuit density on printed circuit boards (503). The package carrier (100) mounts on a printed circuit board (503) on top of a first integrated circuit package (507) that is also mounted on the printed circuit board (503). The carrier (100) has an upper major surface (102U) having a pad array on which a second integrated circuit package (501) is mountable. The carrier (100) has a plurality of leads by means of which the carrier (100) is surface mounted to the printed circuit board (503). Each carrier lead is also electrically connected to a single pad of the pad array on the upper surface (102U). The integrated circuit package (507) beneath the carrier (100) shares all or most printed circuit board (503) connections in common with the carrier (100) and consequently the integrated ciurcut package (501) mounted upon the carrier (100). The carrier (100) also includes heat sink or heat disipation structures.

    Abstract translation: 一种用于增加印刷电路板（503）上的电路密度的封装载体（100）。 封装载体（100）安装在也安装在印刷电路板（503）上的第一集成电路封装（507）的顶部上的印刷电路板（503）上。 载体（100）具有具有垫阵列的上主表面（102U），其上可安装第二集成电路封装（501）。 载体（100）具有多个引线，载体（100）通过该引线表面安装到印刷电路板（503）。 每个载体引线也电连接到上表面（102U）上的焊盘阵列的单个焊盘。 载体（100）下方的集成电路封装（507）与载体（100）共同分享全部或大部分印刷电路板（503）连接，从而共同安装在载体（100）上的集成切割封装（501）。 载体（100）还包括散热器或散热结构。

    집적 수동 소자 어셈블리
    68.
    发明公开
    집적 수동 소자 어셈블리 无效
    集成无源器件组件

    公开(公告)号：KR1020110076683A

    公开(公告)日：2011-07-06

    申请号：KR1020090133439

    申请日：2009-12-29

    Applicant: 삼성전기주식회사

    Inventor： 박상욱 ,  윤철환 ,  김윤석 ,  김성근 ,  김상희 ,  최재혁 ,  나준경

    IPC: H01L27/04

    CPC classification number: H05K3/328 ,  H01C1/014 ,  H01C1/14 ,  H01F17/0006 ,  H01F27/027 ,  H01G2/06 ,  H01G4/228 ,  H01L23/645 ,  H01L23/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/30107 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/10659 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PURPOSE: An integrated passive device assembly is provided to obtain plural passive devices in the same area by installing a conductive pattern for installing the passive device on both sides of a device. CONSTITUTION: An integrated passive device assembly comprises the following: a substrate(10) including a wire pattern(12); an integrated passive device(20) including conductive patterns on the upper and lower side, mounted on the upper side of the substrate; a first connection unit electrically connecting the conductive pattern on the upper side of the integrated passive device with the wire pattern; and a second connection unit electrically connecting the conductive pattern on the lower side of the integrated passive device with the wire pattern.

    Abstract translation: 目的：提供集成的无源器件组件，通过安装用于在器件的两侧安装无源器件的导电图案来在同一区域中获得多个无源器件。 构成：集成无源器件组件包括：包括线图案的衬底（10）; 集成无源器件（20），其包括安装在所述衬底的上侧上的在所述上侧和下侧上的导电图案; 将所述集成无源器件的上侧的导电图案与所述导线图案电连接的第一连接单元; 以及第二连接单元，将集成无源器件的下侧上的导电图案与导线图案电连接。

    인쇄회로기판조립체
    69.
    发明授权
    인쇄회로기판조립체 失效
    印刷电路板组装

    公开(公告)号：KR100846931B1

    公开(公告)日：2008-07-17

    申请号：KR1020060060455

    申请日：2006-06-30

    Applicant: 혼하이 프리시젼 인더스트리 컴퍼니 리미티드

    Inventor： 거,취창

    IPC: H05K1/14

    CPC classification number: H05K1/141 ,  H01L2224/48091 ,  H01L2224/73257 ,  H05K1/0218 ,  H05K3/3442 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/10287 ,  H05K2201/10659 ,  H01L2924/00014

    Abstract: 본 발명은 다수의 전기부품들을 연결하도록 제1도선(102)와 제2도선(108)을 각기 구비한 제1인쇄회로기판(100)과 제2인쇄회로기판(200)으로 이루어진 인쇄회로기판조립체(PCB)에 관한 것이다. 제1인쇄회로기판은 제2인쇄회로기판 상에서 평행하게 배치된다. 제1인쇄회로기판은 적어도 하나의 제1도선 및 제2도선을 매개로 제2인쇄회로기판과 전기연결된다. 제1인쇄회로기판의 면적이 제2인쇄회로기판의 면적보다 작다. 제2인쇄회로기판이 전기부품의 배치를 위한 주회로기판으로 사용된다. 바람직하기로, 복합하거나 고전압 회로는 제1인쇄회로기판에 배치되고 다른 회로들은 제2인쇄회로기판에 배치된다.

Patent Agency Ranking